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Advanced GaN power devices are promising for many applications in high power electronics but performance limitations due to material quality in etched-and-regrown junctions prevent their widespread use. Carrier diffusion length is a critical parameter that not only determines device performance but is also a diagnostic of material quality. Here we present the use of electron-beam induced current to measure carrier diffusion lengths in continuously grown and etched-and-regrown GaN pin diodes as models for interfaces in more complex devices. Variations in the quality of the etched-and-regrown junctions are observed and shown to be due to the degradation of the n-type material. We observe an etched-and-regrown junction with properties comparable to a continuously grown junction.

Aluminum gallium nitride (AlGaN) high electron mobility transistors (HEMTs) are candidates for next-generation power conversion and radio frequency (RF) applications. AlxGa1-xN channel HEMT devices (x = 0.3, x = 0.7) were investigated using multiple in-situ thermal characterization methods and electro-thermal simulation. The thermal conductivity, contact resistivity, and channel mobility were characterized as a function of temperature to understand and compare the heat generation profile and electro-thermal transport within these devices. In contrast to GaN-based HEMTs, the electrical output characteristics of Al0.70Ga0.30 N channel HEMTs exhibit remarkably lower sensitivity to the ambient temperature rise. Also, during 10kHz pulsed operation, the difference in peak temperature between the AlGaN channel HEMTs and GaN HEMTs reduced significantly.

We report on ultra-wide bandgap (UWBG) Al0.7Ga0.3N channel metal–oxide–semiconductor field-effect transistors (MOSFETs) grown by metal-organic chemical vapor deposition. Employing reverse Al composition graded ohmic contact layers and 20 nm Al2O3 gate-dielectric, 250 nm thick Al0.7Ga0.3N:Si channel MOSFETs resulted in the maximum current density of 0.5 A/mm, which is the highest value reported for AlGaN channels with Al composition >0.25. Transistors with a gate-drain spacing ( $L_{\mathrm{ GD}})$ of $1.7~\mu \text{m}$ demonstrated a breakdown voltage ( $V_{\mathrm{ DG}})$ of ~620 V, translating in an average lateral breakdown field of ~3.6 MV/cm. This work establishes UWBG AlGaN as a promising candidate for advanced RF applications.

Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power (SWaP) of power electronics beyond current devices based on silicon (Si). However, the increased operating power densities and reduced areal footprints of WBG device technologies result in significant levels of self-heating that can ultimately restrict device operation through performance degradation, reliability issues, and failure. Typically, self-heating in WBG devices is studied using a single measurement technique while operating the device under steady-state direct current (DC) measurement conditions. However, for switching applications, this steady-state thermal characterization may lose significance since high power dissipation occurs during fast transient switching events. Therefore, it can be useful to probe the WBG devices under transient measurement conditions in order to better understand the thermal dynamics of these systems in practical applications. In this work, the transient thermal dynamics of an AlGaN/GaN high electron mobility transistor (HEMT) were studied using thermoreflectance thermal imaging and Raman thermometry. Also, the proper use of iterative pulsed measurement schemes such as thermoreflectance thermal imaging to determine the steady-state operating temperature of devices is discussed. These studies are followed with subsequent transient thermal characterization to accurately probe the self-heating from steady-state down to sub-microsecond pulse conditions using both thermoreflectance thermal imaging and Raman thermometry with temporal resolutions down to 15 ns.

In this work, synchrotron monochromatic X-ray topography was employed to study the structural characteristics of as-received c-plane dot-core GaN substrates and then to investigate the structural evolution with annealing under growth-like conditions at 1050 °C for 10 h. Single exposure X-ray topography images were obtained using the (1124) GaN asymmetric reflection. These images were superimposed to quantify the lattice distortions in regions near the dot-cores and in the regions between these defects. The results show that different dot-core substrates from the same vendor exhibit different defect distribution, lattice distortions around the cores, and different radii of lattice curvature, ranging from 7 m to 25 m. Annealing under growth-like conditions reduces both the global and local lattice distortions. Globally, the radius of curvature across the wafer increased from 17 m to 27 m after annealing. The local radius of curvature across the highly distorted core regions also increased from 0.47 ± 0.04 m to 0.9 ± 0.2 m after annealing. An increase in the radius of curvature is an indication of stress reduction. The lattice tilt around the cores varies from 0.01°−0.02°. The lattice planes around the centers of cores are highly distorted, and the magnitude of the tilt generally decreases radially away from the core center. After annealing, these local distortions decreased as well. A general core model was built based on these experimental results, providing a fundamental structural picture of dot-core regions, which has been lacking in the current literature.

Ammonothermal growth of bulk gallium nitride (GaN) crystals is considered the most suitable method to meet the demand for high quality bulk substrates for power electronics. A non-destructive evaluation of defect content in state-of-the-art ammonothermal substrates has been carried out by synchrotron X-ray topography. Using a monochromatic beam in grazing incidence geometry, high resolution X-ray topographs reveal the various dislocation types present. Ray-tracing simulations that were modified to take both surface relaxation and absorption effects into account allowed improved correlation with observed dislocation contrast so that the Burgers vectors of the dislocations could be determined. The images show the very high quality of the ammonothermal GaN substrate wafers which contain low densities of threading dislocations (TDs) but are free of basal plane dislocations (BPDs). Threading mixed dislocations (TMDs) were found to be dominant among the TDs, and the overall TD density (TDD) of a 1-inch wafer was found to be as low as 5.16 × 103 cm−2.

Gallium nitride substrates grown by the hydride vapor phase epitaxy (HVPE) method using a patterned growth process have been characterized by synchrotron monochromatic beam X-ray topography in the grazing incidence geometry. Images reveal a starkly heterogeneous distribution of dislocations with areas as large as 0.3 mm2 containing threading dislocation densities below 103 cm−2 in between a grid of strain centers with higher threading dislocation densities (>104 cm−2). Basal plane dislocation densities in these areas are as low as 104 cm−2. By comparing the recorded images of dislocations with ray tracing simulations of expected dislocations in GaN, the Burgers vectors of the dislocations have been determined. The distribution of threading screw/mixed dislocations (TSDs/TMDs), threading edge dislocations (TEDs) and basal plane dislocations (BPDs) is discussed with implications for fabrication of power devices.

Monolayer epitaxial graphene (EG), grown on the Si face of SiC, is an advantageous material for a variety of electronic and optical applications. EG forms as a single crystal over millimeter-scale areas and consequently, the large scale single crystal can be utilized as a template for growth of other materials. In this work, we present the use of EG as a template to form millimeter-scale amorphous and hexagonal boron nitride (a-BN and h-BN) films. The a-BN is formed with pulsed laser deposition and the h-BN is grown with triethylboron (TEB) and NH3 precursors, making it the first metal organic chemical vapor deposition (MOCVD) process of this growth type performed on epitaxial graphene. A variety of optical and non-optical characterization methods are used to determine the optical absorption and dielectric functions of the EG, a-BN, and h-BN within the energy range of 1 eV to 8.5 eV. Furthermore, we report the first ellipsometric observation of high-energy resonant excitons in EG from the 4H polytype of SiC and an analysis on the interactions within the EG and h-BN heterostructure.

The AlGaN materials system offers a tunable, ultra-wide bandgap that is exceptionally useful for high-power electronics and deep ultraviolet optoelectronics. Moseley et al. (pp. 723–726) investigate a structural defect known as an open-core threading dislocation or ''nanopipe'' that is particularly detrimental to devices that employ these materials. Furthermore, an AlGaN thin film was synthesized using metal-organic chemical-vapor deposition. Electrical current leakage is detected at a discrete point using a conductive atomic-force microscope (CAFM). However, no physical feature or abnormality at this location was visible by an optical microscope. The AlGaN thin film was then etched in hot phosphoric acid, and the same location that was previously analyzed was revisited with the CAFM. The point that previously exhibited electrical current leakage had been decorated with a 1.1 μm wide hexagonal pit, which identified the site of electrical current leakage as a nanopipe and allows these defects to be easily observed by optical microscopy. Moreover, with this nanopipe identification and quantification strategy, the authors were able to correlate decreasing ultraviolet light-emitting diode optical output power with increasing nanopipe density.

High hole concentrations in AlxGa1-xN become increasingly difficult to obtain as the concentration of Al increases. It is well known in GaN and related alloys that hole concentration is directly affected by compensation and extended defects. Using electron paramagnetic resonance (EPR) spectroscopy, we studied the amount of neutral Mg in AlxGa1-xN with x = 0 to 0.28. 0.4-0.9 μm thick Mg-doped AlxGa1-xN films were grown by metal-organic chemical vapour deposition and annealed at 900 °C anneal in N2. EPR measurements indicate that the amount of neutral Mg decreased by 60% in AlxGa1-xN films for x = 0.18 and 0.28 as compared to x=0.00 and 0.08. Experiments also showed that the lower neutral Mg for higher Al compositions trend did not depend on threading dislocation densities in the range of 3-20x109 cm-2, capping the surface with 5 nm of P+ GaN, or detailed annealing conditions. Additional studies show that oxygen and carbon concentrations are insufficient to account for the decrease in neutral Mg observed in the samples. Although the study cannot isolate the cause for the decrease in neutral Mg, the results clearly demonstrate that the acceptor concentration decreases with increasing Al, providing an additional limitation to achieving high hole densities. (© 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

Emerging ultrawide bandgap semiconductor materials are logical candidates for applications that exploit the large critical electric field (E C ) associated with these devices. For semiconductor devices, E C scales approximately as E g 2 5 [1]. With a 25% larger bandgap and an approximately 73% larger E C than GaN, Al 0.3 Ga 0.7 N-channel high election mobility transistors (HEMTs) might be viable candidates for harsh environment electronics or short wavelength photo-transistors. In either case, transistor quality factors such as minimal off-state leakage currents and subthreshold slope factor are important metrics.

In this work, we investigate the use of nanoscale polarization engineering to achieve efficient hole injection from metals to ultra-wide band gap AlGaN, and we show that UV-reflective aluminum (Al) layers can be used for hole injection into p-AlGaN. The dependence of tunneling on the work function of the metal was investigated, and it was found that highly reflective Al metal layers can enable efficient hole injection into p-AlGaN, despite the relatively low work function of Al. Efficient tunneling hole injection was confirmed by light emission at 326 nm with on-wafer peak external quantum efficiency and wall-plug efficiency of 2.65% and 1.55%, respectively. A high power density of 83.7 W/cm2 was measured at 1200 kA/cm2. The metal/semiconductor tunnel junction structure demonstrated here could provide significant advantages for efficient and manufacturable device topologies for high power UV emitters.

Research results for AlGaN-channel transistors are reviewed as they have progressed from low Al-content and long-channel devices to Al-rich and short-channel RF devices. Figure of merit (FOM) analysis shows encouraging comparisons relative to today’s state-of-the-art GaN devices for high Al-content and elevated temperatures. Critical electric field (EC), which fuels the AlGaN transistor FOM for high Al-composition, is not measured directly, but average gate-drain electric field at breakdown is substantially better in multiple reported AlGaN-channel devices compared to GaN. Challenges for AlGaN include the constraints arising from relatively low room temperature mobility dominated by ternary alloy scattering and the difficulty of making low-resistivity Ohmic contacts to high Al-content materials. Nevertheless, considerable progress has been made recently in the formation of low-resistivity Ohmic contacts to Al-rich AlGaN by using reverse compositional grading in the semiconductor, whereby a contact to a lower-Al alloy (or even to GaN) is made. Specific contact resistivity (ρc) approaching ρc ∼ 2 × 10−6 Ω cm2 to AlGaN devices with 70% Al-content in the channel has been reported. Along with scaling of the channel length and tailoring of the threshold voltage, this has enabled a dramatic increase in the current density, which has now reached 0.6 A/mm. Excellent ION/IOFF current ratios have been reported for Schottky-gated structures, in some cases exceeding 109. Encouraging RF performance in Al-rich transistors has been reported as well, with fT and fmax demonstrated in the tens of gigahertz range for devices with less than 150 nm gates. Al-rich transistors have also shown lesser current degradation over temperature than GaN in extreme high-temperature environments up to 500 °C, while maintaining ION/IOFF ratios of ∼106 at 500 °C. Finally, enhancement-mode devices along with initial reliability and radiation results have been reported for Al-rich AlGaN transistors. The Al-rich transistors promise to be a very broad and exciting field with much more progress expected in the coming years as this technology matures.

The emerging Al-rich AlGaN-channel Al x Ga1−x N/Al y Ga1−y N high-electron-mobility transistors (HEMTs) with 0.7 ≤ y < x ≤ 1.0 have the potential to greatly exceed the power handling capabilities of today's GaN HEMTs, possibly by five times. This projection is based on the expected 4× enhancement of the critical electric field, the 2× enhancement of sheet carrier density, and the parity of the electron saturation velocity for Al-rich AlGaN-channel HEMTs relative to GaN-channel HEMTs. In this paper, the expected increased RF power density in Al-rich AlGaN-channel HEMTs is calculated by theoretical analysis and computer simulations, based on existing data on long-channel AlGaN devices. It is shown that a saturated power density of 18 W mm−1, a power-added efficiency of 55% and an output third-order intercept point over 40 dB can be achieved for this technology. The method for large-signal RF performance estimation presented in this paper is generic and can be applied to other novel high-power device technologies at the early stages of development.

AlGaN/GaN High Electron Mobility Transistors (HEMTs) show great promise for applications such as military radar and satellite-based communications systems. Circular devices, with smaller junction areas and higher effective gate width/gate length, are better suited for high power, high frequency application. Since the circular devices have been shown to improve the device performance, the effect of radiation on their reliability is an important topic. There are many studies characterizing the performance under proton, neutron, and electron irradiations for rectangular AlGaN/GaN HEMTs. However, the studies for circular-shaped devices are limited. In this work, we report the effect of proton irradiation on circular-based AlGaN/GaN HEMT. DC performance, breakdown voltage, and gate lag measurement were done to characterize the devices. AlGaN/GaN HEMT heterostructures were grown on c-plane sapphire by molecular beam epitaxy (MBE). The layer structure included a thin AlGaN nucleation layer followed with a 2 µm thick undoped GaN buffer topped by a 25 nm thick unintentionally doped Al0.28GaN layer. Mesa isolation was achieved by using an inductively coupled plasma system with Ar/Cl2-based discharges. The Ohmic contacts were formed by lifting-off e-beam evaporated Ti (200 Å)/Al (1000 Å)/Ni (400 Å)/Au (800 Å). Gates with the dimension of 1.5 µm × 314 µm were defined by lift-off of e-beam deposited Ni/Au metallization. The contacts were annealed at 850°C for 45 s under a flowing N2 ambient in Heatpulse 610T system. The final step was deposition of e-beam evaporated Ti/Au (300 Å/1200 Å) interconnection contacts. Devices were exposed to protons with 5 MeV and different doses of 2×1014 proton/cm2. The device DC performance was characterized using an HP 4156 parameter analyzer. The breakdown voltage was conducted with a Tektronix 370A curve tracer. FLOODS TCAD finite-element solver was used to simulate the electrical field around the gate edge to confirm the experimental result. As shown in Figure 1, drain current IVs, IDSS, decreased from 454 to 398 mA/mm after irradiation with a proton dose of 2×1014 cm-2. Moreover, resistance between source and drain increased and extrinsic transconductance decreased after irradiation. However, the drain breakdown voltage increased from 150 to 230 V. The improvement of the breakdown voltage was due to the reduction of electric field at the edge of the gate, caused by the defects generated by proton irradiation at AlGaN/GaN interface, which was confirmed with simulation, as shown in Figure 2. Both gate and drain pulse measurements were also performed to verify the introductions of implanted defects into the HMET structure, which will be discussed in the talk.

InxGa1–xN and AlxGa1–xN alloys are used in many optoelectronic applications due to their tunable band gap, but p-type doping remains a challenge. To better understand the Mg acceptor in nitride alloys, we investigate the effects of In or Al mole fraction, growth temperature and sample thickness on the amount of un-ionized (neutral) Mg using electron paramagnetic resonance (EPR) spectroscopy. The results show that neither temperature nor thickness effects the concentration of the neutral Mg-related acceptor defects; however, the mole fraction of metal, In or Al, alters the behavior of the dopant. For InxGa1–xN, a broadening of the EPR linewidth is shown to be directly related to the presence of a nearby In and is consistent with a lowering of the acceptor level. Incorporation of Al into GaN, on the other hand, produces a systematic decrease in the concentration of neutral Mg-related acceptors as the amount of Al increases. Earlier studies indicate that the reduction is caused by incomplete hydrogen removal from the acceptor impurity. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

The performance and efficiency of power devices depends on both high breakdown voltage and low on-state resistance. For semiconductor devices, the critical electric field (E C ) affecting breakdown scales approximately as E g 25 [1], making the wide bandgap semiconductor materials logical candidates for high voltage power electronics devices. In particular, AlGaN alloys approaching AlN with its 6.2 eV bandgap have an estimated E C approaching 5x that of GaN. This factor makes AlN/AlGaN high election mobility transistors (HEMTs) extremely interesting as candidate power electronic devices. Until now, such devices have been hampered, ostensibly due to the difficulty of making Ohmic contacts to AlGaN alloys with high Al composition. With the use of an AlN barrier etch and regrowth procedure for Ohmic contact formation, we are now able to report on an AlN/AlGaN HEMT with 85% Al.

Enhancement-mode Al0.7Ga0.3N-channel high electron mobility transistors (HEMTs) were achieved through a combination of recessed etching and fluorine ion deposition to shift the threshold voltage (VTH) relative to depletion-mode devices by +5.6 V to VTH = +0.5 V. Accounting for the threshold voltage shift (ΔVTH), current densities of approximately 30 to 35 mA/mm and transconductance values of 13 mS/mm were achieved for both the control and enhancement mode devices at gate biases of 1 V and 6.6 V, respectively. Little hysteresis was observed for all devices, with voltage offsets of 20 mV at drain currents of 1.0 × 10−3 mA/mm. Enhancement-mode devices exhibited slightly higher turn-on voltages (+0.38 V) for forward bias gate currents. Piecewise evaluation of a threshold voltage model indicated a ΔVTH of +3.3 V due to a gate recess etching of 12 nm and an additional +2.3 V shift due to fluorine ions near the AlGaN surface.

Ultra violet light emitting diodes (UV LEDs) face critical limitations in both the injection efficiency and light extraction efficiency due to the resistive and absorbing p-type contact layers. In this work, we investigate the design and application of polarization engineered tunnel junctions for ultra-wide bandgap AlGaN (Al mole fraction higher than 50%) materials towards highly efficient UV LEDs. We demonstrate that polarization-induced 3D charge is beneficial in reducing tunneling barriers especially for high composition AlGaN tunnel junctions. The design of graded tunnel junction structures could lead to low tunneling resistance below 10-3 Ohm cm2 and low voltage consumption below 1 V (at 1 kA/cm2) for high composition AlGaN tunnel junctions. Experimental demonstration of 292 nm emission was achieved through non-equilibrium hole injection into wide bandgap materials with bandgap energy larger than 4.7 eV, and detailed modeling of tunnel junctions shows that they can be engineered to have low resistance, and can enable efficient emitters in the UV-C wavelength range., Comment: 7 pages, 7 figures

We discuss the engineering of p-AlGaN cladding layers for achieving efficient tunnel-injected III-Nitride ultraviolet light emitting diodes (UV LEDs) in the UV-A spectral range. We show that capacitance-voltage measurements can be used to estimate the compensation and doping in p-AlGaN layers located between the multi-quantum well region and the tunnel junction layer. By increasing the p-type doping concentration to overcome the background compensation, on-wafer external quantum efficiency and wall-plug efficiency of 3.37% and 1.62% were achieved for tunnel-injected UV LEDs emitting at 325 nm. We also show that interband tunneling hole injection can be used to realize UV LEDs without any acceptor doping. The work discussed here provides new understanding of hole doping and transport in AlGaN-based UV LEDs, and demonstrates the excellent performance of tunnel-injected LEDs for the UV-A wavelength range., Comment: 9 pages, 5 figures

We investigate Al2O3/AlGaN interface in GaN MOSHEMTs to engineer channel mobility and threshold voltage suitable for power switching applications. Using oxygen-plasma and annealing treatments, we find the optimal window for high mobility and threshold voltage. Next, we discuss the power switching figure of merit of high composition AlGaN based HEMTs and their potential to achieve large threshold voltages. Finally, we characterize the electrical properties of the interface between Al2O3/high composition Al0.7Ga0.3N, and measure the conduction band offset of approximately 1 eV with a low positive interface fixed charge density of +2.5 × 1012 cm−2.

Realization of efficient laser diodes with ultra-violet (UV) emission from ∼260–360 nm would enable many applications including fluorescence-based biological agent detection, sterilization, and portable water purification. While InGaN-based laser diodes are well developed down to ∼370 nm, achieving shorter UV wavelengths requires higher Al-content AlGaN alloys with increasing challenges in achieving p-type doping, strain-management, and low threading-dislocation-density (TDD) AlGaN templates. Given these challenges, few groups have reported AlGaN-based edge-emitting laser diodes (LDs) with emission < 355 nm.[1, 2] Most recently, random lasing via Anderson localization in AlGaN nanowire structures has demonstrated a novel approach to realizing deep-UV laser diodes.[3]

We report on the first demonstration of tunnel-injection-based III-Nitride ultraviolet light emitting diodes (LEDs) with emission wavelength lower than 300 nm. The III-Nitride system could enable a new class of solid state ultraviolet sources that could surpass the efficiency and cost of traditional gas-based ultraviolet bulbs. However, III-Nitride based ultraviolet emitters have significantly lower efficiency (10–100x lower) than visible wavelength emitters, even though the internal quantum efficiency (IQE) of AlGaN emitters is high. The main reason for the lower efficiency in these devices is the high acceptor activation energy, poor hole availability, and high p-contact resistance in p-type AlGaN. Interband tunnel junctions (TJ) can overcome these fundamental limitations by non-equilbrium injection of holes into the LED active region, offering an approach to increase both the electrical injection as well as light extraction efficiency. However, interband PN tunnel junctions become increasingly more resistive as the band gap is increased. We show here that polarization engineering can enable non-equilibrium hole injection into wide bandgap AlGaN with bandgap larger than 4.7 eV (Al composition > 50%), enabling UV LEDs at a wavelength of 295 nm, with a record low differential resistance of 1.6 × 10−3 Ωcm2 at a current density of 1 kA/cm2.

Solid-state light sources emitting at wavelengths less than 300 nm would enable technological advances in many areas such as fluorescence-based biological agent detection, non-line-of-sight communications, water purification, and industrial processing including ink drying and epoxy curing. In this paper, we present our recent progress in the development of LEDs with emission between 237 and 297 nm. We will discuss growth and design issues of deep-UV LEDs, including transport in Si-doped AlGaN layers. The LEDs are designed for bottom emission so that improved heat sinking and light extraction can be achieved by flip chipping. To date, we have demonstrated 2.25 mW of output power at 295 nm from 1 mm x 1 mm LEDs operated at 500 mA. Shorter wavelength LEDs emitting at 276 nm have achieved an output power of 1.3 mW at 400 mA. The heterostructure designs that we have employed have suppressed deep level emission to intensities that are up to 330 x lower than the primary quantum well emission.

Visible- and solar-blind detection was demonstrated using Al0.45Ga0.55N/Al0.30Ga0.70N and Al0.85Ga0.25N/Al0.70Ga0.30N high electron mobility transistors (HEMTs), respectively. Peak responsivities (S) of 3.9 × 106 A/W in the saturation mode and 6.2 × 104 A/W in the pinch-off mode were observed for the visible-blind Al0.45Ga0.55N/Al0.30Ga0.70N HEMT, and a peak S of 4.9 × 104 A/W was observed for the solar-blind Al0.85Ga0.15N/Al0.70Ga0.30N HEMT in the saturation mode. Spectrally resolved photocurrent investigation indicated that sub-bandgap absorption by defect states was the primary origin of the HEMTs' photoresponse. Defect-mediated responsivity caused slow photocurrent rise and fall times, but electrical pulsing was used to improve the bandwidth at the cost of optical gain. Operating HEMTs in this dynamic mode achieved a 25 Hz bandwidth with S = 2.9 × 105 A/W in accumulation and S = 2.0 × 104 A/W in pinch-off for visible-blind detection and S = 5.1 × 103 A/W for solar-blind detection.

We report on the high efficiency tunnel-injected ultraviolet light emitting diodes (UV LEDs) emitting at 287 nm. Deep UV LED performance has been limited by the severe internal light absorption in the p-type contact layers and low electrical injection efficiency due to poor p-type conduction. In this work, a polarization engineered Al0.65Ga0.35N/In0.2Ga0.8N tunnel junction layer is adopted for non-equilibrium hole injection to replace the conventionally used direct p-type contact. A reverse-graded AlGaN contact layer is further introduced to realize a low resistance contact to the top n-AlGaN layer. This led to the demonstration of a low tunnel junction resistance of 1.9 × 10−3 Ω cm2 obtained at 1 kA/cm2. Light emission at 287 nm with an on-wafer peak external quantum efficiency of 2.8% and a wall-plug efficiency of 1.1% was achieved. The measured power density at 1 kA/cm2 was 54.4 W/cm2, confirming the efficient hole injection through interband tunneling. With the benefits of the minimized internal absor...

Al-rich AlGaN-channel high electron mobility transistors with 80-nm long gates and 85% (70%) Al in the barrier (channel) were evaluated for RF performance. The dc characteristics include a maximum current of 160 mA/mm with a transconductance of 24 mS/mm, limited by source and drain contacts, and an on/off current ratio of $10^{{9}}$ . ${f}_{T}$ of 28.4 GHz and ${f}_{\text {MAX}}$ of 18.5 GHz were determined from small-signal S-parameter measurements. Output power density of 0.38 W/mm was realized at 3 GHz in a power sweep using on-wafer load pull techniques.

Ultra-violet emitters have several applications in the areas of sensing, water purification, and data storage. While the III-Nitride semiconductor system has the band gap region necessary for ultraviolet emission, achieving efficient ultraviolet solid state emitters remains a challenge due to the low p-type conductivity and high contact resistance in wide band gap AlGaN-based ultra-violet light emitters. In this work, we show that efficient interband tunneling can be used for non-equilibrium injection of holes into ultraviolet emitters. Polarization-engineered tunnel junctions were used to enhance tunneling probability by several orders of magnitude over a PN homojunction, leading to highly efficient tunnel injection of holes to ultraviolet light emitters. This demonstration of efficient interband tunneling introduces a new paradigm for design of ultra-violet light emitting diodes and diode lasers, and enables higher efficiency and lower cost ultra-violet emitters., Comment: 13 pages, 7 figures, Submitted

Single junction InGaP/GaAs solar cells displaying high efficiency and record high open circuit voltage values have been grown by metalorganic chemical vapor deposition on Ge/graded SiGe/Si substrates. Open circuit voltages as high as 980 mV under AM0 conditions have been verified to result from a single GaAs junction, with no evidence of Ge-related sub-cell photoresponse. Current AM0 efficiencies of close to 16% have been measured for a large number of small area cells, whose performance is limited by non-fundamental current losses due to significant surface reflection resulting from greater than 10% front surface metal coverage and wafer handling during the growth sequence for these prototype cells. It is shown that at the material quality currently achieved for GaAs grown on Ge/SiGe/Si substrates, namely a 10 nanosecond minority carrier lifetime that results from complete elimination of anti-phase domains and maintaining a threading dislocation density of approximately 8 x 10(exp 5) per square centimeter, 19-20% AM0 single junction GaAs cells are imminent. Experiments show that the high performance is not degraded for larger area cells, with identical open circuit voltages and higher short circuit current (due to reduced front metal coverage) values being demonstrated, indicating that large area scaling is possible in the near term. Comparison to a simple model indicates that the voltage output of these GaAs on Si cells follows ideal behavior expected for lattice mismatched devices, demonstrating that unaccounted for defects and issues that have plagued other methods to epitaxially integrate III-V cells with Si are resolved using SiGe buffers and proper GaAs nucleation methods. These early results already show the enormous and realistic potential of the virtual SiGe substrate approach for generating high efficiency, lightweight and strong III-V solar cells.

We report on tunnel-injected deep ultraviolet light emitting diodes (UV LEDs) configured with a polarization engineered Al0.75Ga0.25N/ In0.2Ga0.8N tunnel junction structure. Tunnel-injected UV LED structure enables n-type contacts for both bottom and top contact layers. However, achieving Ohmic contact to wide bandgap n-AlGaN layers is challenging and typically requires high temperature contact metal annealing. In this work, we adopted a compositionally graded top contact layer for non-alloyed metal contact, and obtained a low contact resistance of Rc=4.8x10-5 Ohm cm2 on n-Al0.75Ga0.25N. We also observed a significant reduction in the forward operation voltage from 30.9 V to 19.2 V at 1 kA/cm2 by increasing the Mg doping concentration from 6.2x1018 cm-3 to 1.5x1019 cm-3. Non-equilibrium hole injection into wide bandgap Al0.75Ga0.25N with Eg>5.2 eV was confirmed by light emission at 257 nm. This work demonstrates the feasibility of tunneling hole injection into deep UV LEDs, and provides a novel structural design towards high power deep-UV emitters.

Nanometer-scale compositional structure in InAsxP1.InNYAsxPl.x-Y/InP, grown by gas-source molecular-beam epitaxy and in InAsl-xPJkAsl$b#InAs heterostructures heterostructures grown by metal-organic chemical vapor deposition has been characterized using cross-sectional scanning tunneling microscopy. InAsxP1-x alloy layers are found to contain As-rich and P-rich clusters with boundaries formed preferentially within (T 11) and (111) crystal planes. Similar compositional structure is observed within InNYAsxP1-x-Y alloy layers. Imaging of InAsl-xp@Asl#bY superlattices reveals nanometer-scale clustering within both the hAsI-.p and InAsl$bY alloy layers, with preferential alignment of compositional features in the direction. Instances are observed of compositional structure correlated across a heterojunction interface, with regions whose composition corresponds to a smaller unstrained lattice, constant relative to the surrounding alloy material appearing to propagate across the interface.

Although several magnetic resonance studies address the Mg acceptor in GaN, there are few reports on Mg doping in the alloys, where hole production depends strongly on the Al or In content. Our electron paramagnetic resonance (EPR) measurements of the p-type alloys suggest that the Mg impurity retains the axial symmetry, characteristic of a p-type dopant in both alloys; however, In and Al produce additional, different characteristics of the acceptor. In InGaN, the behavior is consistent with a lowering of the acceptor level and increasing hole density as In concentration increases. For AlGaN, the amount of neutral Mg decreases with increasing Al content, which is attributed to different kinetics of hydrogen diffusion thought to occur in samples with higher Al mole fraction.

Ultraviolet light-emitting diodes (LEDs) have been grown by metalorganic vapor phase epitaxy using AlN nucleation layers and thick n-type Al0.48Ga0.52N current spreading layers. The active region is composed of three Al0.36Ga0.64N quantum wells with Al0.48Ga0.52N barriers for emission at 290 nm. Devices were designed as bottom emitters and flip-chip bonded to thermally conductive submounts using an interdigitated contact geometry. The ratio of quantum well emission to 330 nm sub-band gap emission is as high as 125:1 for these LEDs. Output power as high as 1.34 mW at 300 mA under direct current operation has been demonstrated with a forward voltage of 9.4 V. A peak external quantum efficiency of 0.18% has been measured at an operating current of 55 mA.

It is well known that hydrogen passivation of Mg in Mg-doped GaN reduces free hole concentrations. While there are numerous studies of passivation of Mg in GaN, little work has been reported concerning passivation rates in AlGaN alloys. We investigated the hydrogen interaction with Mg in nitrides by measuring the intensity of the electron paramagnetic resonance (EPR) signal associated with the acceptor. The samples were isothermally annealed in sequential steps ranging from 5 min - 6.6 h between 300 and 700 oC in H2:N2 (7%: 92%) or pure N2. The signal intensity decreased during the H2N2 anneal and was revived by the N2 anneal as expected; however, the rate at which the intensity changed was shown to depend on Al concentration. In addition, while all signals were quenched at 700 oC in H2:N2, a 750 oC N2 anneal reactivated only about 30% of the Mg in the alloys and 80% of the intensity in the GaN film. These data suggest that the rate of passivation and activation of Mg by hydrogen is dependent on the concentration of Al in the AlxGa-1xN layer. The EPR annealing data could prove to be beneficial in improving p-type optimization in AlGaN alloys.© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

Ultraviolet light emitting diodes (LEDs) have been grown using metalorganic vapor phase epitaxy, while monitoring the 550 nm reflected light intensity. During nucleation of GaN on sapphire, the transition from three-dimensional (3D) grain growth to two-dimensional (2D) coalesced growth was intentionally delayed in time by lowering the NH3 flow during the initial high temperature growth. Initially, when the reflectance signal is near zero, the GaN film is rough and composed of partly coalesced 3D grains. Eventually, the reflected light intensity recovers as the 2D morphology evolves. For 380 nm LEDs grown on 3D nucleation layers, we observe increased light output. For LEDs fabricated on GaN films with a longer recovery time an output power of 1.3 mW at 20 mA current was achieved.

To gain insight into the nitrogen-related defects of InGaAsN, nitrogen vibrational mode spectra, Hall mobilities, and minority carrier diffusion lengths are examined for InGaAsN (1.1 eV band gap) grown by molecular beam epitaxy (MBE). Annealing promotes the formation of In–N bonding, and lateral carrier transport is limited by large scale (≫mean free path) material inhomogeneities. Comparing solar cell quantum efficiencies with our earlier results for devices grown by metalorganic chemical vapor deposition (MOCVD), we find significant electron diffusion in the MBE material (reversed from the hole diffusion in MOCVD material), and minority carrier diffusion in InGaAsN cannot be explained by a “universal,” nitrogen-related defect.

We present the results of a three year LDRD project that has focused on overcoming major materials roadblocks to achieving AlGaN-based deep-UV laser diodes. We describe our growth approach to achieving AlGaN templates with greater than ten times reduction of threading dislocations which resulted in greater than seven times enhancement of AlGaN quantum well photoluminescence and 15 times increase in electroluminescence from LED test structures. We describe the application of deep-level optical spectroscopy to AlGaN epilayers to quantify deep level energies and densities and further correlate defect properties with AlGaN luminescence efficiency. We further review our development of p-type short period superlattice structures as an approach to mitigate the high acceptor activation energies in AlGaN alloys. Finally, we describe our laser diode fabrication process, highlighting the development of highly vertical and smooth etched laser facets, as well as characterization of resulting laser heterostructures.

Using a hybrid ion implanted/selectively oxidized device structure, we report high-power single-mode operation of an 850-nm vertical-cavity laser. Under continuous-wave operation, >4 mW of single-mode power with 45 dB of side-mode suppression is achieved. The spectral behavior under pulsed modulation is determined to be influenced by thermal lensing. When biased to threshold, single-mode operation with >35-dB side-mode suppression is obtained for large signal modulation.

A wide-aperture vertical-cavity surface-emitting laser has been fabricated so as to enhance the transverse mode selection. It was found that the far field emission can be made to exhibit two distinct steerable beams. The laser beams may be steered from 30/spl deg/ away from the normal right up to normal emission by varying the driving current. The steering effect is a thermal effect as confirmed by transient waveform analysis. A two-channel switch was built with switching time between channels of 10 /spl mu/s and crosstalk of greater than 18 dB.

We report a monolithic coupled-resonator vertical-cavity laser with an ion-implanted top cavity and a selectively oxidized bottom cavity which exhibits bistable behavior in the light output versus injection current. Large bistability regions over current ranges as wide as 18 mA have been observed with on/off contrast ratios of greater than 20 dB. The position and width of the bistability region can be varied by changing the bias to the top cavity. Switching between on and off states can be accomplished with changes as small as 250 μW to the electrical power applied to the top cavity. The bistable behavior is the response of the nonlinear susceptibility in the top cavity to the changes in the bottom intracavity laser intensity as the bottom cavity reaches the thermal rollover point.

We report Q-switched operation from an electrically injected monolithic coupled-resonator structure which consists of an active cavity with InGaAs quantum wells optically coupled to a passive cavity. The passive cavity contains a bulk GaAs region which is reverse biased to provide variable absorption at the lasing wavelength of 990 nm. Cavity coupling is utilized to effect large changes in output intensity with only very small changes in passive cavity absorption. The device is shown to produce pulses as short as 150 ps at repetition rates as high as 4 GHz. A rate equation approach is used to model the Q-switched operation yielding good agreement between the experimental and theoretical pulse shape. Small-signal frequency response measurements also show a transition from a slower (∼300 MHz) forward-biased modulation regime to a faster (∼2 GHz) modulation regime under reverse-bias operation.

We demonstrate the high-speed (gigabit-per-second) operation of a wavelength-division-multiplexed optical interconnect, which is implemented by multiplexing the optical data from a multiple-wavelength vertical-cavity surface-emitting laser (VCSEL) array into a single optical fiber, and demultiplexing the composite data stream using an array of resonance-enhanced photodetectors (REPDs) with matching resonance wavelengths. By using VCSELs and REPDs with a new quasi-planar oxide-confinement design for improved high-speed performance, and using strained InGaAs-GaAs quantum wells to achieve a better tradeoff between optical responsivity and wavelength selectivity, wavelength-division-multiplexing (WDM) operation has been demonstrated under 1-Gb/s data modulation, with an optical crosstalk rejection ratio of better than -10 dB for wavelength channels that are spaced 4 nm apart.

By employing a reactive low-temperature wafer bonding technique, we have demonstrated oxide-defined 850 nm vertical-cavity surface-emitting lasers (VCSEL's) on Si substrates. Devices reach a differential quantum efficiency of 53% and a light output power of 7.1 mW under room temperature and continuous-wave operation without a heat sink.

The design, growth by metal-organic chemical vapor deposition, and processing of an In{sub 0.07}Ga{sub 0.93}As{sub 0.98}N{sub 0.02} solar Al, with 1.0 ev bandgap, lattice matched to GaAs is described. The hole diffusion length in annealed, n-type InGaAsN is 0.6-0.8 pm, and solar cell internal quantum efficiencies > 70% arc obwined. Optical studies indicate that defects or impurities, from InGAsN doping and nitrogen incorporation, limit solar cell performance.

The authors present a compact, robust, solid-state blue light (490 nm) source capable of greater than 5 mW of output in a TEM{sub 00} mode. This device is an optically pumped, vertical external-cavity surface-emitting laser (VECSEL) with an intracavity frequency doubling crystal.