1. GO modified EPDM/paraffin shape-stabilized phase change materials with high elasticity and low leakage rate.
- Author
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Ding, Ze, Yang, Wenbin, He, Fangfang, Jiang, Zhuoni, He, Ren, Fan, Jinghui, and Zhang, Kai
- Subjects
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PARAFFIN wax , *TESTING , *THERMAL conductivity , *ELASTICITY , *LEAKAGE - Abstract
A novel elastic shape-stabilized phase change materials (SSPCMs) were obtained by reducing and vulcanizing a graphene oxide (GO) modified phase change latex (PCL), which is composed of ethylene propylene diene monomer (EPDM) and paraffin. GO as Pickering emulsifier assisted in fabricating EPDM/paraffin PCL. The zeta potential showed that the PCL was stable. Meanwhile, optical microscope and particle size test indicated that the average particle size was 3–5 μm. Scanning electron microscopy (SEM) showed that the SSPCMs were composed of reduced GO (RGO)-coated phase change composite microspheres (PCCMs). The intact RGO coating was beneficial to prevent the leakage of paraffin. According to the leakage rate test, the leakage rate of SSPCMs were decreased. When the GO content was 0.5%, the leakage rate of SSPCMs was 0.3%. The mechanical properties test showed that the tensile strength and elongation at break were up to 2.26 MPa and 1663.53%, respectively. The comprehensive properties of the prepared SSPCM make it have great potential in the field of building temperature control. A novel elastic shape-stabilized phase change materials (SSPCMs) were obtained by reducing and vulcanizing a graphene oxide (GO) modified phase change latex (PCL), which is composed of ethylene propylene diene monomer (EPDM) and paraffin. When the GO content was 0.5%, the leakage rate of SSPCMs was 0.3%. The mechanical properties test showed that the tensile strength and elongation at break were up to 2.26 MPa and 1663.53%, respectively. Image 1 • Through Pickering emulsification method, GO modified EPDM/paraffin phase change latex is studied. • The effect of GO content on leakage rate and mechanical strength of SSPCMs was studied. • GO improves the thermal conductivity and thermal stability of SSPCMs and reduces the leakage rate. [ABSTRACT FROM AUTHOR]
- Published
- 2020
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