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Herein, the reliability of commercial ultraviolet‐C (UV‐C) light‐emitting diodes (LEDs) subjected to constant current stress is reported. Electrical, optical, and spectral analyses are carried out on UV‐C LEDs with an emission peak of 275 nm and a nominal optical power of 12 mW at 100 mA. Degradation tests are carried out at the maximum rated current, the double and at three times the maximum. The LED lifetime is found to be inversely proportional to the third power of the stress current density, indicating that the degradation mechanism might be activated by high‐energy electrons arising from Auger–Meitner recombination. Electrical characterization indicates an increase in defect‐related leakage, whereas the spectral analysis identifies a variation in two emission peaks which can be ascribed to a defect density increase in the active region and the p‐gallium nitride (GaN) layer of the LEDs. A final remark comes from the strong dependence of lifetime on operating current: increasing current to lower the number of LEDs in a system is not an optimized strategy. In fact, this has a substantial impact on system lifetime, thus lowering the total number of permitted disinfections. [ABSTRACT FROM AUTHOR]

This tutorial paper focuses on the physical origin of thermal droop, i.e., the decrease in the luminescence of light-emitting diodes (LEDs) induced by increasing temperature. III-nitride-based LEDs are becoming a pervasive technology, covering several fields from lighting to displays, from automotive to portable electronics, and from horticulture to sensing. In all these environments, high efficiency is a fundamental requirement, for reducing power consumption and system cost. Over the last decade, a great deal of effort has been put in the analysis of the efficiency droop, the decrease in LED internal quantum efficiency (IQE) induced by high current density. On the other hand, an IQE decrease is observed also for increasing temperature, a phenomenon usually referred to as thermal droop. For commercial LEDs, the IQE decrease related to thermal droop can be comparable to that of efficiency droop: for this reason, understanding thermal droop is a fundamental step for making LEDs capable of operating at high temperature levels. In several fields (including street lighting, automotive, photochemical treatments, projection, entertainment lighting, etc.), compact and high-flux light sources are required: typically, to reduce the size, weight, and cost of the systems, LEDs are mounted in compact arrays, and heat sinks are reduced to a minimum. As a consequence, LEDs can easily reach junction temperatures above 85–100 °C and are rated for junction temperatures up to 150–175 °C (figures from commercially available LED datasheets: Cree XHP70, Osram LUW HWQP, Nichia NVSL219CT, Samsung LH351B, and LedEngin LZP-00CW0R) and this motivates a careful analysis of thermal droop. This paper discusses the possible physical causes of thermal droop. After an introduction on the loss mechanisms in junctions, we will individually focus on the following processes: (i) Shockley–Read–Hall (SRH) recombination and properties of the related defects; (ii) Auger recombination and its temperature dependence, including the discussion of trap-assisted Auger recombination; (iii) impact of carrier transport on the thermal droop, including a discussion on carrier delocalization, escape, and freeze out; (iv) non-SRH defect-related droop mechanisms. In addition, (v) we discuss the processes that contribute to light emission at extremely low current levels and (vi) the thermal droop in deep ultraviolet LEDs, also with reference to the main parasitic emission bands. The results presented within this paper give a tutorial perspective on thermal droop; in addition, they suggest a pathway for the mitigation of this process and for the development of LEDs with stable optical output over a broad temperature range. [ABSTRACT FROM AUTHOR]

The long-term stability of ultraviolet (UV)-C light-emitting diodes (LEDs) is of major importance for many applications. To improve the understanding in this field, we analyzed the degradation of AlGaN-based UVC LEDs and modeled the variation of electrical characteristics by 2D simulations based on the results of deep-level optical spectroscopy (DLOS). The increase in the forward leakage current observed during ageing was ascribed an increase in trap-assisted tunneling. The analysis of the degradation kinetics suggests the role of a defect diffusion process, possibly involving impurities coming from the p-type layers. [ABSTRACT FROM AUTHOR]

The defectiveness of InGaN-based quantum wells increases with low indium contents, due to the compressive strain induced by the lattice mismatch between the InGaN and GaN layers, and to the stronger incorporation of defects favored by the presence of indium. Such defects can limit the performance and the reliability of LEDs, since they can act as non-radiative recombination centers, and favor the degradation of neighboring semiconductor layers. To investigate the location of the layers mostly subjected to degradation, we designed a color-coded structure with two quantum wells having different indium contents. By leveraging on numerical simulations, we explained the experimental results in respect of the ratio between the emissions of the two main peaks as a function of current. In addition, to evaluate the mechanisms that limit the reliability of this type of LED, we performed a constant-current stress test at high temperature, during which we monitored the variation in the optical characteristics induced by degradation. By comparing experimental and simulated results, we found that degradation can be ascribed to an increment of traps in the active region. This process occurs in two different phases, with different rates for the two quantum wells. The first phase mainly occurs in the quantum well closer to the p-contact, due to an increment of defectiveness. Degradation follows an exponential trend, and saturates during the second phase, while the quantum well close to the n-side is still degrading, supporting the hypothesis of the presence of a diffusive front that is moving from the p-side towards the n-side. The stronger degradation could be related to a lowering of the injection efficiency, or an increment of SRH recombination driven by a recombination-enhanced defect generation process. [ABSTRACT FROM AUTHOR]

Herein, the main factors and mechanisms that limit the reliability of gallium nitride (GaN)‐based light‐emitting diodes (LEDs) are reviewed. An overview of the defects characterization techniques most relevant for wide‐bandgap diodes is provided first. Then, by introducing a catalogue of traps and deep levels in GaN and computer‐aided simulations, it is shown which types of defects are more detrimental for the radiative efficiency of the devices. Gradual degradation mechanisms are analyzed in terms of their specific driving force: a separate analysis of recombination‐enhanced processes, driven by nonradiative recombination and/or temperature‐assisted processes, such as defects or impurity diffusion, is presented. The most common lifetime estimation methods and standards adopted for solid‐state luminaires are also reported on. Finally, the paper concludes by examining which are the typical degradation and failure mechanisms exhibited by LEDs submitted to electrical overstress. [ABSTRACT FROM AUTHOR]

We investigate the density of defects and the degradation rate in InGaN light-emitting diodes having identical dislocation density and epitaxial structure, but different indium content in the quantum well (QW; 12%, 16%, 20%). Our results, based on combined steady-state photocapacitance, light-capacitance voltage, and degradation measurements indicate that: (a) the density of defects in the superlattice underlayer is identical for the three wafers, indicating good and reproducible growth conditions; (b) the density of defects within the active region of the devices shows a monotonic dependence on the indium content in the QWs. These results, consistent with previous studies on the topic, prove unequivocally the important role of indium in favoring the incorporation of point defects, further clarifying the possible mechanisms of defect formation, and give a quantitative assessment of the related effect; (c) in step-stress experiments, the degradation rate was found to be much stronger for devices having high indium content in the QW. This result can be explained by considering a decrease in injection efficiency due to the generation or transport of defects, or an increment in defect-assisted Auger recombination terms due to the propagation of defects. [ABSTRACT FROM AUTHOR]

Defects can significantly modify the electro-optical characteristics of InGaN light-emitting diodes (LEDs); however, modeling the impact of defects on the electrical characteristics of LEDs is not straightforward. In this paper, we present an extensive investigation and modeling of the impact of defects on the electrical characteristics of InGaN-based LEDs, as a function of the thickness of the quantum well (QW). First, we demonstrate that the density of defects in the active region of III-N LEDs scales with increasing thickness of the InGaN QW. Since device layers with high indium content tend to incorporate more defects, we ascribed this experimental evidence to the increased volume of defects-rich InGaN associated to thicker InGaN layers. Second, we demonstrate that the current–voltage characteristics of the devices are significantly influenced by the presence of defects, especially in the sub turn-on region. Specifically, we show that the electrical characteristics can be effectively modeled in a wide current range (from pA to mA), by considering the existence of trap-assisted tunneling processes. A good correspondence is obtained between the experimental and simulated electrical characteristics (I–V), by using—in the simulation—the actual defect concentrations/activation energies extracted from steady-state photocapacitance, instead of generic fitting parameters. [ABSTRACT FROM AUTHOR]

In this work, we report a contactless temperature measurement method based on the photoluminescence (PL) of an AlInGaP light-emitting diode (LED) structure under open-circuit conditions. The proposed method has been evaluated between 90 and 460 K, but a broader temperature range is possible. The system is based on the temperature-dependent PL variation of a commercial AlInGaP LED designed to emit at 630 nm at room $T$. The sample is placed inside a temperature-controlled cryostat equipped with a transparent glass window. After exciting the sample by means of a green 532-nm laser, the emitted PL spectrum has been collected by an optical fiber and acquired by means of a charge-coupled device (CCD) array spectrometer. In the first part of the work, the most effective calibration is discussed as a function of the properties of the sampled spectrum; both PL emission peak and spectral width have been considered to calculate the optimal estimated temperature. The effect of spectrometer resolution on temperature estimation has been evaluated by comparing and analyzing the results from two spectrometers with different pixel densities. The effects of excitation intensity and angular positioning have also been evaluated. Finally, uncertainty due to calibration, together with measurement accuracy and precision, has been calculated over 50 acquisitions resulting on average in ±1, ±0.7, and ±0.3 K, respectively, on a temperature range of 300 K. [ABSTRACT FROM AUTHOR]

We present an electro-optical method for the extrapolation of the nonradiative and Auger recombination coefficients in InGaN/GaN Light-emitting diodes (LEDs). The method has the advantage of permitting the extrapolation of the recombination parameters of packaged devices, contrary to conventional techniques based on the analysis of quasibulk structures. For the analyzed devices, the average values of the nonradiative and Auger recombination coefficients have been determined to be equal to 2.3×107 s-1 and 1.0×10-30 cm6 s-1, respectively. These results are consistent with previous reports based on the analysis of quasibulk structures and on theoretical simulations. The method described in this paper constitutes an efficient tool for the analysis of the recombination dynamics in GaN-based LEDs. The results obtained within this work support the hypothesis on the importance of Auger recombination in determining the so-called efficiency droop in LED structures. [ABSTRACT FROM AUTHOR]

This work describes an experiment on degradation mechanisms of InGaN light-emitting diode (LED) test structures which do not fulfill the requirements of longlife products. We present a combined capacitance-voltage (C-V), deep level transient spectroscopy (DLTS), electroluminescence (EL), and cathodoluminescence (CL) study of short-term instabilities of InGaN/GaN LEDs submitted to low current aging tests at room temperature. In the early stages of the aging tests, the EL and CL characterizations showed an optical power decrease, more prominent at low current levels. The C-V profiles indicated that the stress induced an apparent charge increase, well related to the deep level changes detected by DLTS and to the optical power decrease. It is supposed that the main cause of the degradation is the generation of nonradiative paths, due to the generation/propagation of defects activated by carrier transport. [ABSTRACT FROM AUTHOR]

The aim of this paper is to investigate the degradation mechanisms of UV-B AlGaN-based light-emitting diodes (LEDs) submitted to constant current stress beyond the typical application conditions. We demonstrate the existence of two main degradation mechanisms that significantly impact the relative amplitude of the main quantum well (QW) peak at 310 nm and of a parasitic peak at ~340 nm related to the electron overflow toward the last quantum barrier before the p-side. These mechanisms are thoroughly investigated by means of electrical and optical measurements, and by photocurrent (PC) spectroscopy. We demonstrate that in the first 50 h of stress, degradation is caused by an increased defect density in the last quantum barrier and/or carrier escape from the QWs, which results in a decrease in the QW emission and in an increase in the parasitic peak at 340 nm. For longer stress times, degradation is dominated by a diffusion process, causing an increase in defect density and nonradiative recombination in the LED. This has a direct impact on both the QW peak and the parasitic peak, which show a significant decrease for long stress times. PC spectroscopy demonstrates that the defects responsible for degradation are most likely located next to mid-gap, thus acting as efficient nonradiative recombination centers. [ABSTRACT FROM AUTHOR]

With this paper, we review several different failure mechanisms of commercial light emitting diodes operating in real-life applications. We consider both high power and mid power devices, which represent the biggest share of the market. Real-life applications are particularly interesting since they reveal potential reliability issues and weaknesses of the optoelectronic devices, which are not detected/studied during conventional laboratory testing, due to their extrinsic origin. The analyzed failures mechanisms are mainly due to: 1) electrical overstress (surge and hot plugging); 2) assembly issues; 3) mishandling; and 4) chemical contamination. The results presented within this paper provide relevant data for the improvement of the reliability and robustness of current solid-state lighting systems. [ABSTRACT FROM AUTHOR]

This paper presents an extensive analysis of the operating principles, theoretical background, advantages and limitations of laser-based lighting systems. In the first part of the paper we discuss the main advantages and issues of laser-based lighting, and present a comparison with conventional LED-lighting technology. In the second part of the paper, we present original experimental data on the stability and reliability of phosphor layers for laser lighting, based on high light-intensity and high-temperature degradation tests. In the third part of the paper (for the first time) we present a detailed comparison between three different solutions for laser lighting, based on (i) transmissive phosphor layers; (ii) a reflective/angled phosphor layer; and (iii) a parabolic reflector, by discussing the advantages and drawbacks of each approach. The results presented within this paper can be used as a guideline for the development of advanced lighting systems based on laser diodes. [ABSTRACT FROM AUTHOR]

This paper reports an extensive analysis of the failure of high power replace with light-emitting diodes (LEDs) submitted to electrical overstress (EOS). By using a custom EOS simulator, capable of generating current pulses up to 40 A with a duration between 50~\mu \texts and 5 ms, we characterized four different kinds of power LEDs having a different layout: horizontal structure with bonding wires, vertical structure with via-holes through the insulating substrate, and a flip chip-structure with isolated vias. The results described in this paper demonstrate that: 1) state-of-the-art LEDs rated for a maximum current of 1–1.5 A can withstand EOS current levels in excess of 35 A, corresponding to power densities of 350 W/mm2; 2) dependent on the layout of the devices, the failure mechanisms include: fusion of the bonding wires, migration/degradation of the metal lines, failure of the insulated vias, and cracking the semiconductor material; and 3) the EOS failure level strongly depends on the pulse duration and on the layout of the package/chip. The devices with a flip-chip structure showed the highest robustness, while the use of bonding wire was found to severely limit the stability of the devices. [ABSTRACT FROM PUBLISHER]