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Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and μBGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2×1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75 × 35 × 0.2 mm³) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-lntegrated RF and mm wave functions and modules. [ABSTRACT FROM AUTHOR]

A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5GHz and UNII 5.15-5.85GHz frequency bands, using the novel "dual behavior resonators" technique has been developed. Exploiting the strong second resonant frequency of resonators to realize the filtering response, allows for achieving the asymmetric shape and the good rejection between the two bands. The insertion loss and return loss at the central frequency are -2.4 dB and -15 dB for the 2.4-GHz band, respectively, and -1.8 dB and -10 dB for the 5-GHz band, respectively. The filter has been fabricated using the novel liquid crystal polymer (LCP) based multilayer packaging technology, enabling a low cost SOP implementation. [ABSTRACT FROM PUBLISHER]