1. 3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology.
- Author
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Tentzeris, Manos M., Laskar, Joy, Papapolymerou, John, Pinel, Stéphane, Palazzari, V., Li, R., DeJean, G., Papageorgiou, N., Thompson, D., Bairavasubramanian, R., Sarkar, S., and Lee, J.-H.
- Subjects
MILLIMETER waves ,ELECTRONIC packaging ,SYSTEMS on a chip ,MICROWAVES ,EMBEDDED computer systems ,POLYMER liquid crystals ,LIQUID crystals - Abstract
Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and μBGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2×1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75 × 35 × 0.2 mm³) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-lntegrated RF and mm wave functions and modules. [ABSTRACT FROM AUTHOR]
- Published
- 2004
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