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This letter demonstrates an on-silicon integrated thin film coupled inductor using a novel cascade matrix concept to suit multiphase integrated voltage regulator (IVR) applications. The novel cascade matrix coupled (CMC) stripline inductor facilitates all-phase-coupled configuration to reduce the phase ripple current in IVRs. It also shows excellent scalability and neat floor planning. Moreover, the proposed CMC inductor uses double layer metal scheme for windings and interconnects, which significantly reduces the ac winding resistance. A four-phase CMC inductor has been successfully fabricated on-silicon substrate and characterized, which uses conventional thin film magnetic core deposition process to achieve in-plane magnetic uniaxial anisotropy. The device occupies 3.2 × 1.7 mm2 floor area and provides 19.5 nH phase inductance with 120 mΩ dc resistance. The saturation current for each phase is up to 0.4 A when the phase inductance drops by approximately 20%. The coupling coefficient between any two phases of the proposed CMC inductor is 0.27, much higher and more controllable than that of toroid core-based coupled inductors. [ABSTRACT FROM AUTHOR]

In an integrated power microinductor, the size and shape of the magnetic material will have a relationship to the permeability and inductance of the device. To demonstrate these effects, a set of inductors with closed Ni45Fe55 films were fabricated having similar structures but different footprint sizes and aspect ratios (ARs). Magnetic and electrical characterization was performed on the devices to determine magnetic properties, and in both measurements the same relationship between film shape and magnetic anisotropy is observed. Micromagnetic shape anisotropy simulations were used to predict this behavior and correlate with the experimentally determined parameters. The AR of the film is determined to have a strong influence on the anisotropy and permeability of the magnetic film via shape demagnetization effects which is shown to be a significant variation from the as-deposited magnetic material parameters. [ABSTRACT FROM AUTHOR]