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We have developed the FeCo nanocontact magnetoresistance (NCMR) with spin-valve structure [H. N. Fuke et al., IEEE Trans. Magn. 43, 2848 (2007)] which exhibits up to a MR ratio of 11%–12% at a resistance area (RA) of 0.3–0.55 Ω μm2. The nanocontact configurations were estimated at about 2 nm in in-plane diameter, 1.2 nm in thickness, and 0.55% in density for a RA∼0.5 Ω μm2 film based on in-plane current distribution by conductive atomic-force microscopy cross sectional transmission electron microscope images of the NCMR. The origin of the NCMR was discussed by comparing magnetic field dependence of resistance, with micromagnetics simulation based on the diffusive MR theory. It is found that our NCMR cannot be explained by diffusive domain wall theory or bulk scattering in free and pinned layers. It is likely that a theory on the basis of a ballistic MR consideration is needed to interpret our MR origin. [ABSTRACT FROM AUTHOR]

The current-perpendicular-to-plane (CPP) giant-magnetoresistance (GMR) of spin valves with Fe50Co50 alloy was investigated. It has been reported that the Cu inserted in Fe50Co50 is effective for enhancing CPP-GMR. In this paper, we investigated the number of Cu lamination effect on CPP-GMR and clarified that higher CPP-GMR is obtained by decreasing the number of Cu layers. In order to ascertain the reason for this tendency, the crystalline structure and magnetization were examined. As a result, it was found that the d spacing of Fe50Co50 increases when the number of Cu layers is increased, although saturation magnetization does not change. [ABSTRACT FROM AUTHOR]

To understand the mechanism of current-confined-path formation for the current-perpendicular-to-plane type of giant magnetoresistive devices, we have investigated the evolution of an Al monolayer on the Cu (111) surface both by in situ scanning tunneling microscopy and by molecular dynamics simulation. Ultrathin Al nano-clusters were formed on the plateaus and step (or plateau) edges of the Cu surface in the as-deposited state. Upon annealing at 300 °C, Al atoms migrated toward the step edges by surface diffusion. As a consequence, nanometer-sized Cu channels not covered by Al clusters can be formed. These channels could serve as current-confined paths if subsequent mild Al oxidation is provided. [ABSTRACT FROM AUTHOR]