1. Low-Temperature Synthesis of Wafer-Scale MoS2–WS2 Vertical Heterostructures by Single-Step Penetrative Plasma Sulfurization
- Author
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Yonas Tsegaye Megra, Taesung Kim, Minjun Kim, Hyeong-U Kim, Hyunho Seok, Inkoo Lee, Pil J. Yoo, Vinit Kanade, Chaitanya Kanade, Ji Won Suk, and Jinill Cho
- Subjects
Materials science ,business.industry ,Graphene ,General Engineering ,General Physics and Astronomy ,Heterojunction ,Chemical vapor deposition ,Plasma ,law.invention ,law ,Optoelectronics ,General Materials Science ,Dry transfer ,Wafer ,business ,Nanoscopic scale ,Diode - Abstract
Two-dimensional (2D) transition metal dichalcogenides (TMDs) have attracted considerable attention owing to their synergetic effects with other 2D materials, such as graphene and hexagonal boron nitride, in TMD-based heterostructures. Therefore, it is important to understand the physical properties of TMD-TMD vertical heterostructures for their applications in next-generation electronic devices. However, the conventional synthesis process of TMD-TMD heterostructures has some critical limitations, such as nonreproducibility and low yield. In this paper, we synthesize wafer-scale MoS2-WS2 vertical heterostructures (MWVHs) using plasma-enhanced chemical vapor deposition (PE-CVD) via penetrative single-step sulfurization discovered by time-dependent analysis. This method is available for fabricating uniform large-area vertical heterostructures (4 in.) at a low temperature (300 °C). MWVHs were characterized using various spectroscopic and microscopic techniques, which revealed their uniform nanoscale polycrystallinity and the presence of vertical layers of MoS2 and WS2. In addition, wafer-scale MWVHs diodes were fabricated and demonstrated uniform performance by current mapping. Furthermore, mode I fracture tests were performed using large double cantilever beam specimens to confirm the separation of the MWVHs from the SiO2/Si substrate. Therefore, this study proposes a synthesis mechanism for TMD-TMD heterostructures and provides a fundamental understanding of the interfacial properties of TMD-TMD vertical heterostructures.
- Published
- 2021
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