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The influence of microstructure evolution on microhardness and electrical resistivity of ultrafine grained (UFG) commercial purity Al under annealing at different temperatures within a range of 363–673 K was studied. The initially coarse grained Al was processed by high pressure torsion (HPT) technique for the formation of UFG structure. The microstructure was characterized by electron backscattering diffraction and X-Ray diffraction. It was shown that annealing of UFG Al at temperatures within a range of 363–473 K leads to simultaneous increase of microhardness (by 6–13%) and electrical conductivity (by 4–8% at 300 K). The correlation between microstructural features and the resulting properties were analyzed. The average width s of potential barriers at grain boundaries (GBs) in HPT-processed Al was estimated in the frame of a tunnel model. The obtained large value of s compared with the GB crystallographic width is associated with elastically distorted lattice near GBs. The obtained results suggest a new way to increase simultaneously strength and electrical conductivity of UFG Al alloys by an appropriate annealing. [ABSTRACT FROM AUTHOR]

The influence of deformation temperature of tensile test on the mechanical properties of ultrafine grained (UFG) Al-Cu-Zr alloy in three different states: after high pressure torsion (HPT), subsequent low-temperature annealing as well as after annealing and a small additional deformation has been studied for the first time. The UFG structure was formed by HPT processing. The temperature dependences of the yield stress and elongation to failure under uniaxial tension in the temperature range of 77–293 K were obtained for all three states. The effect of increasing ductility from ∼3–5 to 11 % (the plasticization effect) at room temperature while maintaining a high strength of ∼465 MPa was observed after deformation-heat treatment (DHT), consisting of annealing and additional deformation. The plasticization effect decreases monotonically with decreasing temperature of tensile test and completely disappears at ∼223 K. In the temperature range 223–293 K, the temperature sensitivity of the yield stress and the value of activation energy (Q) of plastic flow differ in all three states, which is related to the changes in the grain boundary (GB) structure (dislocation density, size and shape of Al 2 Cu nanoprecipitates). In the temperature range of 77–223 K, the temperature sensitivity of the yield stress does not depend on the state of GBs. The plasticization effect at room temperature is preserved when the strain rate is changed from 10−4 to 10−3 s−1 and sharply decreases as strain rate is further increased. The strain rate sensitivity coefficient (m) for the UFG Al-1.47Cu-0.34Zr (wt%) alloy was determined in the states before and after DHT. The results and relevant mechanisms are analyzed by using the resulting m valuе and Q values as well as the observations of specific features of GB structure. • Substantial increase in ductility of high-strength UFG Al-Cu-Zr alloy after annealing and additional deformation. • Suppression of plasticization effect at low temperatures or at high strain-rates. • Activation energy of plastic flow strongly changes after annealing and additional deformation. • The activation energy modulation is related to grain boundary structure/state. [ABSTRACT FROM AUTHOR]

Abstract: A coarse-grained (CG) Al6061 alloy after solution treatment is subjected to high pressure torsion at room temperature resulting in the formation of a homogeneous ultra-fine grained (UFG) microstructure with average grain size of 170nm. Tensile tests are performed at room and liquid nitrogen temperatures for both CG and UFG conditions. Analysis of the surface relief of the tested specimens is performed. The effect of microstructure on the mechanical properties and on the deformation behavior of the material is discussed. [Copyright &y& Elsevier]