1. Effect of trace alloying elements on stress relaxation properties of high strength and high conductivity C19160 alloy.
- Author
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Xiao, Shishui, Lei, Qian, Liang, Yaqian, Li, Xu, and Chen, Cong
- Subjects
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STRESS relaxation (Mechanics) , *TRACE elements , *TENSILE strength , *PHASE transitions , *STRAINS & stresses (Mechanics) , *ELECTRIC conductivity , *ALLOYS - Abstract
The addition of Si in a Cu–Ni– P –Pb (C19160) alloy has been fabricated by atmospheric smelting to approach high strength, high conductivity, and high-stress relaxation resistance. The addition of Si inhibited the coarsening and phase transition of Ni 5 P 4. The fine Ni 5 P 4 particles were dispersed in the matrix, which pinned dislocations and improved the studied alloy's strength and stress relaxation resistance. After homogenization at 900 °C for 4 h, cold rolled by 70 %, aging treatment at 450 °C for 1 h, cold rolled by 60 %, aging treatment at 400 °C for 45 min, cold rolled by 60 %, annealing treatment at 200 °C for 1 h, the C19160-0.1Si alloy shows an ultimate tensile strength of 705 MPa, electrical conductivity of 53.8%IACS, and a stress relaxation rate of 17.8 % after tested at 150 °C for 100 h. These findings have guiding significance for developing C19160 alloys with high strength, high conductivity, and high-stress relaxation resistance. • The changes of microstructure and properties during stress relaxation of C19160 alloy by adding Sn and Si were systematically studied. • The prepared C19160–Si alloy has high strength, high conductivity, and high-stress relaxation resistance. • The addition of Si effectively improves the high temperature stress relaxation resistance of the studied C19160 alloys. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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