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Conductive fillers made from metal nanoparticles offer many advantages for the fabrication of a variety of electronic devices, but when they have a porous structure, their poor conductivity limits their adoption in many applications. In this study, an Ag-coated Cu micro-nanoparticle paste is used to achieve compact filling of blind vias on flexible copper clad polyimide laminates through a multistep filling and sintering technique. The filled blind vias achieve a resistivity as low as 6.2 μΩ·cm, which is comparable that of electroplated blind vias. Higher sintering pressure and temperature promote the filling performance, while the conductivity deteriorates at a via depth/diameter ratio greater than 1:1. Finite element simulations reveal a stress inhomogeneity in vias with large depth/diameter ratios, which is the key to understanding the evolution of the conductive properties of a paste-filled via. This study provides an effective method for high-performance microvia filling as well as insights into the mechanism that influences its performance. [ABSTRACT FROM AUTHOR]

In this study, we explore the structure-property relationship of sintered metal nano/microparticles from the perspective of the agglomerate size effect. Through sintering experiments and mechanical tests of Cu particle pastes with different solvents, a linear correlation between the agglomerate size in the particle paste (L a) and the size of large-scale cavities in the sintered structure (L c) is revealed, and a negative correlation between the cavity size and the shear strength of the sintered structure is discovered. Based on these results, a quantitative model is proposed to predict the overall strength of the sintered structure (τ f). A relationship τ f = τ c /(1 + √(2 L cmax / d)) is established, which fits the experimental results very well. The model reveals that the relative agglomerate size (L a / d) or relative cavity size (L c / d) plays a more important role than the particle size (d) itself in terms of defining the final sintering properties of metal nano/microparticles. [Display omitted] • The structure-property relation of sintered metal particles is explored • A linear correlation between agglomerate size and sintered cavity size is revealed • The cavity size and shear strength follow a relation of τ c / 1 + 2 L cmax / d • The relative cavity size (L c / d) is the key to determining the strength [ABSTRACT FROM AUTHOR]

[Display omitted] • The influencing mechanism of ultrasound on the size of Cu nanoparticles is studied. • The mean size and size dispersion are significantly reduced ultrasound treatment. • A competition model between surface energy and ultrasonic force is proposed. • An exponential relation of between particle size and ultrasonic power is revealed. • Ultrasonic power and surface energy are keys to control the final particle size. Ultrasonic treatment is an effective method for size refinement and dispersion of nanomaterials during their synthesis process. However, the quantitative relationship between ultrasonic conditions and particle size in the synthesis of metal nanoparticles has not been fully revealed. In this study, Cu nanoparticles were synthesized via the wet-chemical redox method under ultrasonic treatment, and statistical analysis on the evolution of particle size distribution was carried out. It was found that the particle size decreased exponentially with increasing ultrasonic power. A quantitative model was then proposed to describe the influence of ultrasonic power on the size distribution of metal nanoparticles from the perspective of the competition between the surface energy and the ultrasonic force. A relational expression of R c ∝ γ 4 7 P - 3 7 was revealed, and it was proved to fit well with the experimental results. Our study provides new experimental basis and theoretical method for understanding the mechanism of ultrasonic-induced size refinement of metal nanoparticles. [ABSTRACT FROM AUTHOR]