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This Letter reports a high performance β -Ga2O3 thin channel MOSFET with T gate and degenerately doped (n++) source/drain contacts regrown by metal organic chemical vapor deposition. Highly scaled T-gate with a gate length of 160–200 nm was fabricated to achieve enhanced RF performance and passivated with 200 nm silicon nitride. Peak drain current (ID,MAX) of 285 mA/mm and peak transconductance (gm) of 52 mS/mm were measured at 10 V drain bias with 23.5 Ω mm on resistance (RON). Metal/n++ contact resistance of 0.078 Ω mm was extracted from transfer length measurements. RON is possibly dominated by interface resistance between channel and highly doped n++ regrown layer. A gate-to-drain breakdown voltage of 192 V is measured for LGD = 355 nm resulting in average breakdown field (EAVG) of 5.4 MV/cm. This EAVG is the highest reported among all sub-micron gate length lateral FETs. Current gain cut off frequency (fT) of 11 GHz and record power gain cut off frequency (fMAX) of approximately 48 GHz were extracted from small signal measurements. fT is limited by DC-RF dispersion due to interface traps which needs further investigation. The fT·VBR product is 2.112 THz V for 192 V breakdown voltage. Device surpasses the switching figure of merit of Silicon and competitive with mature wide bandgap devices. [ABSTRACT FROM AUTHOR]

β-(AlxGa1−x)2O3 thin films are grown on ( 2 ¯ 01) β-Ga2O3 substrates via metal organic chemical vapor deposition to investigate the solubility of Al in β-phase Ga2O3. The x-ray diffraction (XRD) spectra reveal crystalline quality ( 2 ¯ 01) β-(AlxGa1−x)2O3 thin films with Al compositions up to 48%. The Al compositions are further confirmed by high resolution x-ray spectroscopy measurements and energy-dispersive x-ray spectra (EDS) mapping. The bandgap energies extracted from XPS spectra range between 5.20 ± 0.06 eV and 5.72 ± 0.08 eV for x = 21%–48%. The surface morphology evaluated by both scanning electron microscopy and atomic force microscopy shows elongated features with granules along the [010] direction, which are suppressed with the increasing Al content. A systematic growth study through tuning growth parameters indicates that the chamber pressure plays an important role in both surface morphology and Al incorporation. Material characterization via high resolution scanning transmission electron microscopy and STEM-EDS reveals Al fluctuations in the sample with the 48% Al composition. Atomic resolution STEM imaging and XRD spectra for ( 2 ¯ 01) β-(AlxGa1−x)2O3/Ga2O3 superlattice structures confirm that the periodicity of the β-(AlxGa1−x)2O3/Ga2O3 sub-layers is well maintained with high-Al compositions. [ABSTRACT FROM AUTHOR]

In this paper, we investigated the evolution of microstructural chemistry of metal organic chemical vapor deposition grown (010) (AlxGa1x)2O3 films with varying Al contents, x 0.10-1.0, using atom probe tomography (APT). At a low Al content (x 0.25), the films are homogeneous, where layer inhomogeneity appears at a high Al content (x>0.25). Further increasing the Al content up to x 0.60 results in a homogeneous (AlxGa1x)2O3 layer. This change in microstructural features was linked to the phase transformation of (AlxGa1x)2O3 using a manifold learning approach to capture the governing features hidden in the data dimensionality. Combining APT to unsupervised machine learning enables APT to be an independent material characterization tool to investigate the microstructure, chemical composition, and phase related information. [ABSTRACT FROM AUTHOR]

The results of a detailed investigation of electrically active defects in metal-organic chemical vapor deposition (MOCVD)-grown β-Ga2O3 (010) epitaxial layers are described. A combination of deep level optical spectroscopy (DLOS), deep level transient (thermal) spectroscopy (DLTS), and admittance spectroscopy (AS) is used to quantitatively map the energy levels, cross sections, and concentrations of traps across the entire ∼4.8 eV bandgap. States are observed at EC-0.12 eV by AS; at EC-0.4 eV by DLTS; and at EC-1.2 eV, EC-2.0 eV, and EC-4.4 eV by DLOS. While each of these states have been reported for β-Ga2O3 grown by molecular-beam epitaxy (MBE) and edge-defined film fed grown (EFG), with the exception of the EC-0.4 eV trap, there is both a significantly different distribution in the concentration of these states and an overall ∼10× reduction in the total trap concentration. This reduction is consistent with the high mobility and low background compensating acceptor concentrations that have been reported for MOCVD-grown (010) β-Ga2O3. Here, it is observed that the EC-0.12 eV state dominates the overall trap concentration, in marked contrast with prior studies of EFG and MBE material where the state at EC-4.4 eV has dominated the trap spectrum. This sheds light on possible physical sources for this ubiquitous DLOS feature in β-Ga2O3. The substantial reduction in trap concentration for MOCVD material implies great promise for future high performance MOCVD-grown β-Ga2O3 devices. [ABSTRACT FROM AUTHOR]

This Letter reports a high performance β -Ga2O3 thin channel MOSFET with T gate and degenerately doped (n++) source/drain contacts regrown by metal organic chemical vapor deposition. Highly scaled T-gate with a gate length of 160–200 nm was fabricated to achieve enhanced RF performance and passivated with 200 nm silicon nitride. Peak drain current (ID,MAX) of 285 mA/mm and peak transconductance (gm) of 52 mS/mm were measured at 10 V drain bias with 23.5 Ω mm on resistance (RON). Metal/n++ contact resistance of 0.078 Ω mm was extracted from transfer length measurements. RON is possibly dominated by interface resistance between channel and highly doped n++ regrown layer. A gate-to-drain breakdown voltage of 192 V is measured for LGD = 355 nm resulting in average breakdown field (EAVG) of 5.4 MV/cm. This EAVG is the highest reported among all sub-micron gate length lateral FETs. Current gain cut off frequency (fT) of 11 GHz and record power gain cut off frequency (fMAX) of approximately 48 GHz were extracted from small signal measurements. fT is limited by DC-RF dispersion due to interface traps which needs further investigation. The fT·VBR product is 2.112 THz V for 192 V breakdown voltage. Device surpasses the switching figure of merit of Silicon and competitive with mature wide bandgap devices. [ABSTRACT FROM AUTHOR]

In this paper, we investigated the evolution of microstructural chemistry of metal organic chemical vapor deposition grown (010) (AlxGa1x)2O3 films with varying Al contents, x 0.10-1.0, using atom probe tomography (APT). At a low Al content (x 0.25), the films are homogeneous, where layer inhomogeneity appears at a high Al content (x>0.25). Further increasing the Al content up to x 0.60 results in a homogeneous (AlxGa1x)2O3 layer. This change in microstructural features was linked to the phase transformation of (AlxGa1x)2O3 using a manifold learning approach to capture the governing features hidden in the data dimensionality. Combining APT to unsupervised machine learning enables APT to be an independent material characterization tool to investigate the microstructure, chemical composition, and phase related information. [ABSTRACT FROM AUTHOR]