1. Effects of Y2O3-LaF3 on the low temperature sintering and thermal conductivity of AlN ceramics.
- Author
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Jiang, Hai, Lu, YiYing, Ding, Liwen, Lu, Wenzhong, Fan, Guifen, and Shi, Yusheng
- Subjects
ALUMINUM nitride ,SINTERING ,THERMAL conductivity ,MICROSTRUCTURE ,PACKAGING materials ,POWER management of integrated circuits - Abstract
Purpose Aluminum nitride (AlN) ceramics are suitable substrate and package materials for high-power integrated circuits.Design/methodology/approach Dense AlN ceramics with Y
2 O3 and LaF3 as sintering additives are prepared. The effects of these additives on the density, phase composition, microstructure and thermal conductivity of AlN ceramics are investigated.Findings Results show that 2 Wt.% Y2 O3 -doped additive is insufficient for the samples to achieve the full densification sintered at 1,700°C. When LaF3 is added with Y2 O3 , the samples are perfectly densified at the same sintering condition. The relative density and thermal conductivity of the samples are 97.8-99.07 per cent and 169.104-200.010 W·m-1·K-1, respectively. The density of the samples and their microstructure, especially the content and distribution of secondary phases, is necessary to control the thermal conductivity of AlN ceramics.Originality/value Y2 O3 and LaF3 additives can effectively promote densification and enhance the thermal conductivity of AlN ceramics in a low sintering temperature, and the AlN ceramics added with Y2 O3 -LaF3 might have potential applications in package materials for high-power integrated circuits. [ABSTRACT FROM AUTHOR]- Published
- 2019
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