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This Letter presents a novel RF ground lead structure for surface-mount-type optical modules that enables RF crosstalk reduction and bandwidth enhancements. Conventional RF lead-pins of a surface-mount-type optical module have a bent shape that affects on RF ground stability and RF crosstalk between channels. The authors introduced an enhanced ground lead with an optimised shape for RF ground scheme enhancement. They prepared two types of high-bandwidth coherent driver modulator packages for demonstrating RF performance difference, one with the conventional bent ground lead and the other with the optimum-shaped ground lead. The measured results of the package with the enhanced ground lead successfully exhibited adjacent far-end crosstalk reduction of about 5 dB at 50 GHz, and the crosstalk of −30 dB or less up to 58 GHz was confirmed. Moreover, they obtained the improvement in the insertion loss of 1 dB at 54 GHz and the 3-dB electrical bandwidth enhancement of 2 GHz. These RF performances are sufficient for a high-bandwidth coherent driver modulator package that allows 96-GBd class operations. [ABSTRACT FROM AUTHOR]

An ultra‐high bandwidth (BW) and a low Vπ InP Mach‐Zehnder modulator with an n‐i‐p‐n heterostructure is proposed. The combination of the n‐i‐p‐n heterostructure and the capacitive‐loaded travelling‐wave electrode provides a modulator with extremely low electrical loss. The device exhibits a 3 dB electro‐optic BW of over 67 GHz and a Vπ of 2.0 V. A 100 Gb/s non‐return‐to‐zero on–off keying modulation with an extinction ratio of over 10 dB is also realised. [ABSTRACT FROM AUTHOR]