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We report on the synthesis and properties of wafer-scale two-dimensional/three-dimensional (2D/3D) n-SnSe2/n-GaN(0001) heterojunctions. The hexagonal crystal structure of crystalline SnSe2 grown by molecular beam epitaxy was confirmed via in-situ reflection high-energy electron diffraction and off-axis X-ray diffraction. Current-voltage (I-V) measurements of SnSe2/GaN diodes exhibited 9 orders of magnitude rectification, and the SnSe2/GaN heterojunction barrier height was estimated to be 1 eV using capacitance-voltage measurements and internal photoemission measurements. Vertical electronic transport analyzed using temperature-dependent I-V measurements indicates thermionic field emission transport across the junction. This work demonstrates the potential of epitaxial growth of large area high quality 2D crystals on 3D bulk semiconductors for device applications involving carrier injection across 2D/3D heterojunctions. [ABSTRACT FROM AUTHOR]

Growth conditions have a tremendous impact on the unintentional background impurity concentration in gallium nitride (GaN) synthesized by molecular beam epitaxy and its resulting chemical and physical properties. In particular for oxygen identified as the dominant background impurity we demonstrate that under optimized growth stoichiometry the growth temperature is the key parameter to control its incorporation and that an increase by 55 °C leads to an oxygen reduction by one order of magnitude. Quantitatively this reduction and the resulting optical and electrical properties are analyzed by secondary ion mass spectroscopy, photoluminescence, capacitance versus voltage measurements, low temperature magneto-transport and parasitic current paths in lateral transistor test structures based on two-dimensional electron gases. At a growth temperature of 665 °C the residual charge carrier concentration is decreased to below 1015 cm−3, resulting in insulating behavior and thus making the material suitable for beyond state-of-the-art device applications. [ABSTRACT FROM PUBLISHER]

Abstractauthoren We propose partially relaxed ultrathin GaN interlayer for strain control of AlN on SiC substrates. According to the degree of relaxation of the GaN interlayer, the lattice constant of the interlayer changes from that of SiC to that of bulk GaN, which leads to strain control of an AlN top layer grown on the interlayer. Growth of these layers is conducted by plasma-assisted molecular beam epitaxy. Before growing the interlayer, an AlN layer coherently grown on SiC is used as a template layer. The interlayers that have different degrees of relaxation are successfully obtained by changing the interlayer thickness. As a result, strain values of the AlN top layer grown on the interlayers are widely controlled from compressive (−0.53%) to tensile (+ 0.07%). TEM observation revealed the relaxation is induced by U-shaped half-loop dislocations originating from the GaN interlayer. [ABSTRACT FROM AUTHOR]

High-quality GaN layers were grown on sapphire (0001) substrates using laser molecular beam epitaxy (LMBE) by laser ablating a solid GaN target at different laser repetition rates (10–40 Hz) under a constant supply of r.f. nitrogen plasma. The effect of laser repetition rate on the structural and optical properties of GaN layers was systematically studied using high-resolution X-ray diffraction (HRXRD), field emission scanning electron microscopy, atomic force microscopy, Raman spectroscopy and photoluminescence (PL) spectroscopy. High-resolution X-ray rocking curve measurements revealed highly c-axis oriented GaN layers on sapphire grown at 30 Hz with a calculated screw dislocation density of ~1.42 × 107 cm−2, whereas the GaN layers grown at 10 or 40 Hz consisted the screw dislocation density in the range of 108–109 cm−2. Surface morphological analysis revealed a change in grain size as well as surface roughness as a function of laser repetition rate and is explained on the basis of growth kinetics. Vibrational Raman spectroscopy revealed that the GaN layer grown at 10 Hz shows an in-plane compressive stress of ~1 GPa, while the film grown at 30 Hz exhibits a minimum stress of ~0.3 GPa. The PL measurements show a highly luminescent band-to-band emission of GaN at 3.44 eV for the 10 Hz grown highly strained GaN layer and at 3.41 eV for the less strained film grown at 30 Hz along with a broad defect band emission centered around 2.28 eV. It is found that the GaN layers grown at 30 Hz have excellent structural and optical properties. We expect that the less strained thin and highly oriented GaN film grown by LMBE can further be utilized for developing prodigious low-temperature-grown nitride-based multilayer structures and devices. [ABSTRACT FROM AUTHOR]

High-quality nonpolar m-plane GaN-based light-emitting diode (LED) wafers on LiGaO(100) substrates have been grown in this work by the combination of pulsed laser deposition and molecular beam epitaxy technologies. This work systemically studies the crystalline quality, surface morphology, as well as optoelectronic properties of as-grown nonpolar m-plane GaN-based LED wafers. The as-grown nonpolar m-plane GaN-based LED wafers on LiGaO(100) substrates show good structural properties with estimated dislocation density ∼10 cm and abrupt InGaN/GaN interfaces. A photoluminescence peak at approximately 446 nm with full-width at half-maximum (FWHM) of 21.2 nm is identified at room temperature. A strong electroluminescence (EL) peak observed at 446 nm with FWHM of 20.7 nm is obtained at an injection current of 20 mA. Furthermore, there is a slight blue shift in the EL emission wavelength with increase in the injection current, while the EL FWHM can be kept stable thanks to the absence of the quantum confined Stark effect. This study of high-quality nonpolar m-plane GaN-based LEDs is of paramount importance for future application of high-efficiency GaN-based devices. [ABSTRACT FROM AUTHOR]

InGaN alloys have been attracting tremendous interest because of the large range of wavelengths covered when tuning the In to Ga ratio, offering extensive band gap engineering possibilities as well as the opportunity to achieve longer wavelength optoelectronic devices. Industrialization of InGaN materials with large In contents is however still limited by challenges imposed by intrinsic material properties. At typical InGaN growth temperatures the In desorption rate is lower than the In–N bond decomposition rate, making it difficult to avoid accumulation of metal In droplets on the surface. Hestroffer et al. (pp. 626–629) have established a growth diagram for InGaN grown on (0001) GaN at a constant temperature of 575 °C versus Ga and In fluxes. The authors identify different regimes, namely: N‐rich, intermediate In‐rich, droplet‐accumulation In‐rich, and Ga‐rich. Compositionally graded InGaN layers are grown by ramping the In and Ga fluxes in parallel under two distinct growth regimes. Structural and optical properties of the two types of grades are compared. The growth diagram proves to be a useful tool in controlling the metal fluxes and thereby the stoichiometry conditions on the surface during the growth of compositionally graded layers. [ABSTRACT FROM AUTHOR]