1. 21‐3: Effect of Ag Adhesion Layer on Plasmon Outcoupling Efficiency.
- Author
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Thompson, Nicholas J., Fusella, Michael A., Saramak, Renata, Mundoor, Haridas, Menon, Vinod M., Weaver, Michael S., and Brown, Julia J.
- Subjects
ENERGY dissipation ,ORGANIC light emitting diodes - Abstract
In this paper we explore energy loss in the novel plasmonic PHOLED device architecture that enables next‐generation OLED operation by harnessing energy previously believed to be trapped in the plasmon mode. We determine that the quality of Ag used in the plasmon out‐coupling scheme can increase the device efficiency by greater than 30%. We identify the Ag adhesion layer as a way to tune the quality of Ag and discuss the effects on both plasmon in‐ and out‐coupling efficiencies. [ABSTRACT FROM AUTHOR]
- Published
- 2022
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