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Photoluminescence (PL) spectroscopy of nonpolar m-plane InGaN thin films with indium composition up to 21% and nearly strain-balanced In0.09Ga0.91N/Al0.19Ga0.81N superlattices grown by plasma-assisted molecular beam epitaxy was performed as a function of temperature. The experimental transition energies are consistently lower than the calculation based on structural parameters extracted from x-ray diffraction measurements. This indicates the presence of indium composition fluctuations in InGaN and hence local bandgap reduction that produces charge localization centers. The spectral width of the low-temperature PL of our m-plane InGaN/AlGaN superlattices is narrower than previously reported for m-plane InGaN/GaN quantum wells grown by MOCVD. The PL integrated intensity drops rapidly, though, as the temperature is increased to 300 K, indicating strong non-radiative recombination at room temperature. Time-resolved PL at low temperatures was performed to characterize the relaxation time scales in an undoped and a doped superlattice. [ABSTRACT FROM AUTHOR]

Temperature‐dependent continuous‐excitation and time‐resolved photoluminescence are studied to probe carrier localization and recombination in nearly strain‐balanced m‐plane In0.09Ga0.91N/Al0.19Ga0.81N multi‐quantum wells grown by plasma‐assisted molecular‐beam epitaxy. An average localization depth of 21 meV is estimated for the undoped sample. This depth is much smaller than the reported values in polar structures and m‐plane InGaN quantum wells. As part of this study, temperature and magnetic field dependence of time‐resolved photoluminescence is performed. At 2 K, an initial fast decay time of ≈0.3 ns is measured for both undoped and doped structures. The undoped sample also exhibits a slow decay component with a time scale of 2.2 ns. The existence of two relaxation paths in the undoped structure can be attributed to different localization centers. The fast relaxation decays are relatively insensitive to external magnetic fields, while the slower relaxation time constant decreases significantly with increasing magnetic fields. The fast decay time scale in the undoped sample is likely due to indium fluctuations in the quantum well. The slow decay time may be related to carrier localization in the barriers. The addition of doping leads to a single fast decay time likely due to stronger exciton localization in the InGaN quantum wells. [ABSTRACT FROM AUTHOR]

The structural, morphological, optical, and electrical transport characteristics of a metamorphic, broken-gap InAs/GaSb p-i-n tunnel diode structure, grown by molecular beam epitaxy on GaAs, were demonstrated. Precise shutter sequences were implemented for the strain-balanced InAs/GaSb active layer growth on GaAs, as corroborated by high-resolution X-ray analysis. Cross-sectional transmission electron microscopy and detailed micrograph analysis demonstrated strain relaxation primarily via the formation of 90° Lomer misfit dislocations (MDs) exhibiting a 5.6 nm spacing and intermittent 60° MDs at the GaSb/GaAs heterointerface, which was further supported by a minimal lattice tilt of 180 arc sec observed during X-ray analysis. Selective area diffraction and Fast Fourier Transform patterns confirmed the full relaxation of the GaSb buffer layer and quasi-ideal, strain-balanced InAs/GaSb heteroepitaxy. Temperature-dependent photoluminescence measurements demonstrated the optical band gap of the GaSb layer. Strong optical signal at room temperature from this structure supports a high-quality material synthesis. Current–voltage characteristics of fabricated InAs/GaSb p-i-n tunnel diodes measured at 77K and 290K demonstrated two bias-dependent transport mechanisms. The Shockley–Read–Hall generation-recombination mechanism at low bias and band-to-band tunneling transport at high bias confirmed the p-i-n tunnel diode operation. This elucidated the importance of defect control in metamorphic InAs/GaSb tunnel diodes for the implementation of low-voltage and high-performance tunnel field effect transistor applications. [ABSTRACT FROM AUTHOR]

The structural and optical properties of buffer mediated epitaxial germanium (Ge) layer were investigated and compared with bulk n -type and p -type Ge substrates. An interconnected dual-chamber molecular beam epitaxy (MBE) system was used to grow a 280 nm thin Ge epilayer on (100)GaAs substrate with an intermediate AlAs buffer layer. The lattice-matched, abrupt Ge/AlAs heterointerface was analyzed using cross-sectional transmission electron microscopic analysis, and no elemental interdiffusion was detected via secondary ion mass spectrometry. A strong direct gap transition, compared to the indirect gap transition, and a series of phonon-assisted transitions was observed by photoluminescence (PL) spectroscopy. In addition, the intensity of the direct gap recombination decreases with decreasing PL measurement temperatures, which was ascribed to the reduced density of Γ-valley electrons available for recombination at lower temperature. Furthermore, the intensity ratio between the direct and indirect optical transition drastically decreases with decreasing temperature in both n -type epitaxial and p -type bulk Ge. An empirical relation in both direct and indirect peak position with temperature was established. The observed strong luminescence in 280 nm thick epitaxial Ge at room temperature is vital for Ge-based photonic devices. In addition, the quality of the epitaxial Ge layer grown via MBE is on par with bulk Ge substrates. • Structural and optical transport behavior of buffer mediated epitaxial Ge grown by MBE and compared with Ge substrates. • Ge on GaAs with AlAs buffer offers advantages: lattice matched system, larger band offsets and superior carrier confinement. • No evidence of defect formation in epitaxial Ge layer, and a strong direct gap transition was observed by PL spectroscopy. • Intensity of the direct gap recombination decreases with temperatures, ascribed to reduced density of Γ-valley electrons. • The quality of the buffer mediated epitaxial Ge layer grown via MBE is on par with bulk Ge substrate. [ABSTRACT FROM AUTHOR]