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1. Atomic layer etching of silicon dioxide using alternating C4F8and energetic Ar+plasma beams

2. Silicon nitride and silicon etching by CH3F/O2and CH3F/CO2plasma beams

3. Optical emission spectroscopic studies and comparisons of CH3F/CO2 and CH3F/O2 inductively coupled plasmas

4. Measurement of absolute CO number densities in CH3F/O2plasmas by optical emission self-actinometry

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