1. Atomic layer etching of silicon dioxide using alternating C4F8and energetic Ar+plasma beams
- Author
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Qiaowei Lou, Demetre J. Economou, Sanbir Kaler, and Vincent M. Donnelly
- Subjects
010302 applied physics ,Acoustics and Ultrasonics ,Ion beam ,Chemistry ,Analytical chemistry ,02 engineering and technology ,Plasma ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,X-ray photoelectron spectroscopy ,Etching (microfabrication) ,0103 physical sciences ,Reactive-ion etching ,Thin film ,Atomic physics ,Inductively coupled plasma ,0210 nano-technology ,Layer (electronics) - Abstract
Atomic layer etching (ALE) of SiO2 was studied by alternating exposure of a 5 nm-thick SiO2 film on Si substrate to (1) a plasma beam emanating from a c-C4F8 inductively coupled plasma (ICP), to grow a fluorocarbon (FC) film composed mainly of CF2, and (2) an energetic (130 eV) Ar+ ion beam extracted from a separate Ar ICP. In situ x-ray photoelectron spectroscopy was used to analyze the chemical composition of the near-surface region, and to quantify the thickness of the FC and SiO2 films. A very thin (3–6 A), near self-limiting thickness CF2-rich FC film was found to deposit on the SiO2 surface with exposure to continuous or pulsed power C4F8 plasma beams, under conditions that generated a large relative flux of CF2. Following this, a FC film of similar composition grew at ~10 times slower rate. Exposure of the thin film to the Ar+ beam led to removal of 1.9 A SiO2. An estimated yield of 1.3 SiO2 molecules-per-Ar+ was found for a single ALE step. The rate of 1.9 A/cycle persisted over multiple ALE cycles, but a carbon-rich residual film did build up. This film can be removed by a brief exposure to an O2-containing plasma beam.
- Published
- 2017
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