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This paper reports our recent studies on nanocrystalline layer of copper produced using pulse plating method. The grain size of the copper layer was about 60 nm. Electrochemical and physical Properties of the nanocrystalline surface were investigated using Potentiostatic scanning and Impedance measurements. Microcrystalline copper deposits were also produced by direct current electrodeposition processes and compared with pulse plated ones. Effects of deposition parameters, such as the peak Density, frequency, current-on time and current-off time of the pulse current (PC), on the grain size were investigated for the purpose of process optimization. It was demonstrated that the nanocrystalline film was markedly superior to regularly grained film made by direct current (DC) plating; the nanocrystalline deposit shows higher electrochemical stability and lower electrical resistance. [ABSTRACT FROM AUTHOR]