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In this work, a deliberate etching-based top-down approach is proposed to fabricate the GaN nanorod (NR) Schottky barrier diode (SBD). As a key step during the fabrication, the impact of the wet-etching process on device performance is systematically studied. By virtue of the reduced surface states at the sidewall, the performance of NR SBD with the wet-etching process is substantially improved, delivering a forward turn-on voltage of 0.65 V, a current density of ∼10 kA/cm2 at 3 V, an ideality factor of 1.03, an ON/OFF current ratio of ∼1010, and no severe current collapse, along with a reverse breakdown voltage of 772 V. [ABSTRACT FROM AUTHOR]

In this study, GaN m‐plane Schottky barrier diodes are fabricated by metalorganic vapor‐phase epitaxy (MOVPE) on several off‐angle gallium nitride (GaN) substrates, and the off‐cut angle dependence of impurity incorporation is investigated. We show that the MOVPE layer on the substrate inclined 5° toward the [000–1] direction has extremely low impurity incorporation. These results provide important suggestions for the fabrication of m‐plane power devices. [ABSTRACT FROM AUTHOR]

The background of this cover page shows a superimposed emission microscope image observed from backside of a GaN m‐plane Schottky barrier diode with reverse biased condition. It can be observed that the epitaxial layer of m‐plane GaN has pyramidal hillocks at the surface, and only facets inclined toward the [0001] direction (+c facet) have emission due to leakage current. Three images at the corner are differential interference contrast microscopy image (upper left), photoluminescence intensity mapping image (PL, upper right), and cathode luminescence image (CL, lower left), respectively, observing the same pyramidal hillocks to investigate the characteristics of each facet. The PL image indicates the intensity of near‐band‐edge emission (around 363 nm wavelength) of the facets. Details are discussed in the article by Tanaka et al. (no. 1600829). The +c facets have high emission intensity, indicating that there is a high impurity concentration in the +c facets. Furthermore, we consider this is the reason that +c facets have high leakage current. The CL image is a panchromatic image, and facets inclined toward [000‐1] direction (−c facet) have lowest emission. Together with PL intensity mapping it can be considered that −c facets have less yellow emission and less impurity concentration. [ABSTRACT FROM AUTHOR]