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This paper presents a simulation study using a novel distributive quasi-ballistic drift diffusion (DD) TCAD model applied to low mobility unstressed and high mobility stressed scaled pMOS devices. The model is implemented in a DD simulator and used to study the gate length dependence of current drives. The new model captures the physically correct potential distribution and gives the correct drive current limit in ballistic devices for both linear current response and current saturation source–drain bias conditions. The diffusive and ballistic transport is connected using a ballistic probability, which relates to the fundamental time scale in the problem—the mean energy relaxation time. The model captures the ballistic velocity degradation from the diffusive limit at linear source–drain biases. It is shown that the DD simulation with the distributive quasi-ballistic model describes the stress ballistic drive gains at high driving field, which are missed by the existing ballistic models. [ABSTRACT FROM AUTHOR]

The transport properties of holes in Si, Ge, and Si1-xGex under high compressive stresses are studied with a Monte Carlo simulation method. Stress significantly improves the low-energy mass and mobility, while its effect is diminished in the high-energy bandstructure. The transient behavior of the carrier velocity exhibits a double-overshoot peak at high driving field. This double-overshoot behavior is manifested in carrier-velocity profiles in simulated short-channel PMOS devices. In steady state at lower field, the hole velocity exceeds the saturation velocity at high field. This leads to a negative differential resistance effect in simulated resistors. We propose to use this effect, generic to cubic semiconductors, for transferred-hole devices. An advantage of this approach is that it can be integrated into the conventional stress-engineered Si or Ge logic process. [ABSTRACT FROM AUTHOR]