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We developed an in-operando x-ray topography method for dynamically visualizing single Shockley-type stacking fault (1SSF) expansion motions in silicon carbide (SiC) metal–oxide–semiconductor field-effect transistors (MOSFETs) during their operations and investigated the effect of the operating condition applied to the body diodes in SiC MOSFETs on dislocation glide velocity. In-operando x-ray topography observations were carried out in reflection geometry, and a high-resolution x-ray camera was used as a detector to record topographies dynamically. The sequence of 1SSF expansion motions in the SiC MOSFETs was observed at a high resolution of 1 s in x-ray topographies, which is sufficient to analyze the dislocation glide velocity of a 1SSF expansion. The observation results of changing the forward current density applied to the body diodes in SiC MOSFETs revealed that each triangular and bar-shaped 1SSF expands at different forward current densities. The 1SSF expansion timings also differed, even in the same chip under the same current density. The dislocation glide velocity of each expanded 1SSF in SiC MOSFETs was extracted, and it increased with the forward current density. Our method enables the dynamic visualization of bipolar degradation in SiC MOSFETs during their operations, and we can accurately obtain the information of when, where, and which 1SSF expands in a SiC MOSFET. [ABSTRACT FROM AUTHOR]

When developing silicon carbide (SiC) devices, the reliability of the internal body diode is an important issue. Stacking faults (SFs) are expanded from basal plane defects by using a body diode. Although it is well known that ON-voltage degradation occurs due to SFs, their effects on dynamic reliability have not been studied well. Furthermore, including the effects of SFs, there are not many reports about the dynamic reliability of SiC-MOSFETs. In this paper, a double-pulse switching test using 3.3-kV SiC-MOSFETs was carried out to clarify the failure mechanism of the switching operation of SiC-MOSFETs and effects of SFs on the safe operation area (SOA). Before the switching test, current stress was applied to the body diode of the devices under test (DUTs) to expand the SFs. The circuit configuration was half-bridge type, and a double-pulse gate signal was applied to the lower arm DUT. The switching voltage was 1.8 kV, and the switching current increased at about 8-A steps to failure. As a result, reverse recovery SOA (RRSOA) reliability decreased depending on the amount of SFs in the SiC-MOSFET. Because RRSOA failure was caused by avalanche due to the hole concentration during reverse recovery and the SFs raised local current density, reverse bias SOA (RBSOA) hardly decreased even if SFs containing SiC-MOSFETs were used. This is because RBSOA failure was caused by degradation of the gate isolation layer due to overheating and the temperature coefficient of the SFs electric resistance indicated negative. [ABSTRACT FROM AUTHOR]