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This article presents a systematic power stage design approach for a high-power density air-cooled inverter, which involves the utilization of emerging 1.7 kV silicon carbide (SiC) mosfet bare die engineering samples, heatsinks optimized with genetic algorithm, and built using three-dimensional printing technology and integrated power modules with a novel packaging structure. The developed air-cooled inverter assembly is mainly composed of the SiC mosfet phase leg modules with split high-side and low-side switch submodules, which are attached to two separate heatsinks for increased heat dissipation area and reduced thermal resistance. The heatsink is designed using a co-simulation environment with finite element analysis in COMSOL and genetic algorithm in MATLAB. The primary design procedure, including bare die device characterization, loss calculation, thermal evaluation, and power module development, is elaborated. The proposed design approach is verified and validated through experiments at each stage of development. The experimental results show that the inverter California Energy Commission efficiency is 98.4%, and a power density of 75 W/in3 is achieved with a sufficient junction temperature margin for semiconductor long-term reliability. [ABSTRACT FROM AUTHOR]

Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. This paper reviews the technology progress of SiC power devices and their emerging applications. The design challenges and future trends are summarized at the end of the paper. [ABSTRACT FROM AUTHOR]

The application of silicon carbide (SiC) devices as battery interface, motor controller, etc., in a hybrid electric vehicle (HEV) will be beneficial due to their high-temperature capability, high-power density, and high efficiency. Moreover, the light weight and small volume will affect the whole powertrain system in a HEV and, thus, the performance and cost. In this paper, the performance of HEVs is analyzed using the vehicle simulation software Powertrain System Analysis Toolkit (PSAT). Power loss models of a SiC inverter based on the test results of latest SiC devices are incorporated into PSAT powertrain models in order to study the impact of SiC devices on HEVs from a system standpoint and give a direct correlation between the inverter efficiency and weight and the vehicle's fuel economy. Two types of HEVs are considered. One is the 2004 Toyota Prius HEV, and the other is a plug-in HEV (PHEV), whose powertrain architecture is the same as that of the 2004 Toyota Prius HEV. The vehicle-level benefits from the introduction of SiC devices are demonstrated by simulations. Not only the power loss in the motor controller but also those in other components in the vehicle powertrain are reduced. As a result, the system efficiency is improved, and vehicles that incorporate SiC power electronics are predicted to consume less energy and have lower emissions and improved system compactness with a simplified thermal management system. For the PHEV, the benefits are even more distinct; in particular, the size of the battery bank can be reduced for optimum design. [ABSTRACT FROM PUBLISHER]

Silicon carbide (SiC) power devices are expected to have an impact on power converter efficiency, weight, volume, and reliability. Currently, only SiC Schottky diodes are commercially available at relatively low current ratings. Oak Ridge National Laboratory. has collaborated with Cree and Semikron to build a Si insulated-gate bipolar transistor-SiC Schottky diode hybrid 55-kW inverter by replacing the Si p-n diodes in Semikron's automotive inverter with Cree's made-to-order higher current SiC Schottky diodes. This paper presents the developed models of these diodes for circuit simulators, shows inverter test results, and compares the results with those of a similar all-Si inverter. [ABSTRACT FROM AUTHOR]

In this paper, an analytical model for a vertical double implanted metal-oxide semiconductor (DIMOS) transistor structure in 4H-Silicon Carbide (SIC) is presented. Simulation for transport characteristics of the SiC MOSFET with the exact device geometry is carried out using the commercial device simulator MEDICI. A rigorous experimental testing and characterization is done on a 4H-SiC DIMOS transistor test device. SPICE parameters are extracted from the measurements, and a SPICE model for the DIMOS transistor has been developed. The presented work is a part of team efforts of material, device, and power electronics researchers at the University of Tennessee and. Oak Ridge National Laboratory. [ABSTRACT FROM AUTHOR]

The emergence of silicon carbide- (SIC-) based power semiconductor switches, with their superior features compared with silicon- (Si-) based switches, has resulted in substantial improvements in the performance of power electronics converter systems. These systems with SiC power devices have the qualities of being more compact, lighter, and more efficient; thus, they are ideal for high voltage power electronics applications such as a hybrid electric vehicle (HEV) traction drive. More research is required to show the impact of SiC devices in power conversion systems. In this study, findings of SiC research at Oak Ridge National Laboratory (ORNL) including SiC device design and system modeling studies, will be given. [ABSTRACT FROM AUTHOR]