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This work presents an acoustic platform using solidly mounted thin-oriented lithium niobate (LiNbO3) film on silicon (Si). A thin layer of amorphous Si eliminates a conductive layer generated in the thin-film bonding processes and contributes to acoustic energy confinement and thermal frequency stability. The gigahertz operating frequency is achieved by resorting to the guided acoustic wave shear-horizontal wave (SH0) in a 400-nm-thick X-cut LiNbO3 thin film. Due to the elimination of the parasitic surface conduction (PSC) effect, the electromechanical coupling of the guide acoustic wave is maximized in the Si-based heterogeneous wafer. Due to the minimized acoustic impedance mismatch between surface material and substrate, longitudinal and higher order spurious modes are suppressed. Due to the stiff substrate with a small temperature expansion coefficient (TEC), the solidly mounted structure features a reduced temperature coefficient of frequency (TCF) and improved power handling. The fabricated resonator shows an extracted electromechanical coupling coefficient of 22.8%, a high loaded $Q$ of 1208 at 1.6 GHz, and a TCF of −36 p/min/K. The compressed filter is demonstrated with a minimum insertion loss (IL) of 0.6 dB, a fractional bandwidth (FBW) of 8%, an out-of-band rejection of 30 dB, a TCF of −38.5 p/min/K at roll-off, and a miniaturized footprint of 0.4 mm2. The performance has shown the strong potential of the LiNbO3–Si platform for front-end applications in 5G. [ABSTRACT FROM AUTHOR]

This work studies the influence of substrate loss on the performance of acoustic resonators and on-chip inductors and investigates the effective substrate resistivity of seven commonly used substrates in silicon-based devices. The substrates include X-cut lithium niobate (LiNbO3) film with two different thicknesses (400 nm and 1.6 $\mu \text{m}$) on high-resistivity Si (HR-Si) and amorphous Si wafers, SiO2 film with two different thicknesses on HR-Si, and bare HR-Si. The effective resistivities of these substrates are extracted using coplanar waveguides (CPWs) over a frequency range from 1 to 40 GHz. Using the effective resistivity approach, the efficiency of two substrate loss reduction techniques—Si wafer removal and amorphous Si—in reducing substrate loss is quantified. Comparison of the extracted substrate resistivities of the suspended and un-suspended dielectric-on-Si structures and comparison of LiNbO3 on HR-Si and amorphous Si are carried out. Substrate loss reduction techniques are more advantageous for a thinner dielectric film and at a lower frequency range due to the higher filling factor of the electric field in the Si wafer. Finally, by comparison of the effective substrate resistivity of SiO2 film on an HR-Si with bare HR-Si, thick plasma-enhanced chemical vapor deposition (PECVD) SiO2 film is found to be a good insulation layer to reduce substrate loss. [ABSTRACT FROM AUTHOR]