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Over the last decade, Optical Phased Arrays (OPA) have been extensively studied, targeting applications such as Light Detection And Ranging (LiDAR) systems, holographic displays, atmospheric monitoring and free space communications. Leveraging the maturity of the silicon photonics platform, the usual mechanical based beam steering system could be replaced by an integrated OPA; significantly reducing the cost and size of the LiDAR while improving its performance (scanning speed, power efficiency, resolution…) thanks to solid state beam steering. However, the realization of an OPA that meets the specifications of a LiDAR system (low divergence and single output beam) is not trivial. Targeting the realization of a complete LiDAR system, the technical challenges inherent to the development of high performance OPAs have been studied at CEA LETI. In particular, efficient genetic algorithms have been developed for the calibration of high channel count OPAs as well as an advanced measurement setup compatible with wafer-scale OPA characterization.

Roughness has always been a key detractor of the optical losses within the silicon photonics devices. With scaling at 300mm wafer, there is an introduction of new tools such immersion lithography scanner, OPC technique that can help to drive furthermore the optical losses reduction. This study will detail the work done on characterizing multiple steps of the process (Lithography, Etch, Annealing) and using roughness tools such LER (Line Edge Roughness), LWR (Line Width Roughness) and finally PSD (Power Spectral Density) to understand the main detractor of the optical losses at each step. These data will be extracted using SEM imaging from VeritySEM 6i.