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Due to the unique microstructure of hydrogenated nanocrystalline silicon oxide (nc‐SiOx:H), the optoelectronic properties of this material can be tuned over a wide range, which makes it adaptable to different solar cell applications. In this work, the authors review the material properties of nc‐SiOx:H and the versatility of its applications in different types of solar cells. The review starts by introducing the growth principle of doped nc‐SiOx:H layers, the effect of oxygen content on the material properties, and the relationship between optoelectronic properties and its microstructure. A theoretical analysis of charge carrier transport mechanisms in silicon heterojunction (SHJ) solar cells with wide band gap layers is then presented. Afterwards, the authors focus on the recent developments in the implementation of nc‐SiOx:H and hydrogenated amorphous silicon oxide (a‐SiOx:H) films for SHJ, passivating contacts, and perovskite/silicon tandem devices. [ABSTRACT FROM AUTHOR]

Interdigitated back contact (IBC) architecture can yield among the highest silicon wafer‐based solar cell conversion efficiencies. Since both polarities are realized on the rear side, there is a definite need for a patterning step. Some of the common patterning techniques involve photolithography, inkjet patterning, and laser ablation. This work introduces a novel patterning technique for structuring the rear side of IBC solar cells using the enhanced oxidation characteristics under the locally laser‐doped n++ back surface field (BSF) regions with high‐phosphorous surface concentrations. Phosphosilicate glass layers deposited via POCl3 diffusion serve as a precursor layer for the formation of local heavily laser‐doped n++ BSF regions. The laser‐doped n++ BSF regions exhibit a 2.6‐fold increase in oxide thickness compared to the nonlaser‐doped n+ BSF regions after undergoing high‐temperature wet thermal oxidation. The utilization of oxide thickness selectivity under laser‐doped and nonlaser‐doped regions serves two purposes in the context of the IBC solar cell, first patterning rear side and second acting as a masking layer for the subsequent boron diffusion. Proof‐of‐concept solar cells are fabricated using this novel patterning technique with a mean conversion efficiency of 20.41%. [ABSTRACT FROM AUTHOR]

The contact resistivity is a key parameter to reach high conversion efficiency in solar cells, especially in architectures based on the so‐called carrier‐selective contacts. The importance of contact resistivity relies on the evaluation of the quality of charge collection from the absorber bulk through adjacent electrodes. The electrode usually consists of a stack of layers entailing complex charge transport processes. This is especially the case of silicon heterojunction (SHJ) contacts. Although it is known that in thin‐film silicon, the transport is based on subgap energy states, the mechanisms of charge collection in SHJ systems is not fully understood yet. Here, we analyse the physical mechanisms driving the exchange of charge among SHJ layers with the support of rigorous numerical simulations that reasonably replicate experimental results. We observe a connection between recombination and collection of carriers. Simulation results reveal that charge transport depends on the alignment and the nature of energy states at heterointerfaces. Our results demonstrate that transport based on direct energy transitions is more efficient than transport based on subgap energy states. Particularly, for positive charge collection, energy states associated to dangling bonds support the charge exchange more efficiently than tail states. The conditions for optimal carrier collection rely on the Fermi energy of the layers, in terms of activation energy of doped layers and carrier concentration of transparent conductive oxide. We observe that fill factor (FF) above 86% concurrently with 750‐mV open circuit voltage can be attained in SHJ solar cells with ρc lower than 45 mΩ·cm2 for p‐contact and 20 mΩ·cm2 for the n‐contact. Furthermore, for achieving optimal contact resistivity, we provide engineering guidelines that are valid for a wide range of silicon materials from amorphous to nanocrystalline layers. [ABSTRACT FROM AUTHOR]

Mixed-phase hydrogenated silicon oxide (SiO x :H) is applied to thin-film hydrogenated amorphous silicon germanium (a-SiGe:H) solar cells serving as both p-doped and n-doped layers. The bandgap of p-SiO x :H is adjusted to achieve a highly-transparent window layer while also providing a strong electric field. Bandgap grading of n-SiO x :H is designed to obtain a smooth transition of the energy band edge from the intrinsic to n-doped layer, without the need of an amorphous buffer layer. With the optimized optical and electrical structure, a high conversion efficiency of 9.41% has been achieved. Having eliminated other doped materials without sacrificing performance, the sole use of SiO x :H in the doped layers of a-SiGe:H cells opens up great flexibility in the design of high-efficiency multi-junction thin-film silicon-based solar cells. [ABSTRACT FROM AUTHOR]

Front and rear contacted wafer-based c-Si solar cells characterized by P-diffused emitter and Al-based back surface field currently constitute the dominant solar cell architecture in the photovoltaic market. The key success of this technology is based on the simple and cost effective fabrication process. However, its conversion efficiency is limited. High-efficiency c-Si solar cells architectures have been demonstrated at laboratory and industrial scale with the aim of decreasing the levelized cost of electricity (LCOE) by increasing efficiency. For this reason, high-efficiency solar cells are expected to increase their market share in next decade. In particular, interdigitated back contacted (IBC) c-Si solar cell architecture, which the current world record efficiency is based on, is expected to gain shortly relevance at industrial level. In this work, activities at TUDelft on the fabrication of IBC c-Si solar cells are reported. In particular, a novel method for realizing high-efficiency IBC c-Si solar cells based on single-side and (relatively) low-temperature doping techniques is demonstrated. In particular, epitaxial growth of B-doped Si is used to form the emitter, while P-ion implantation is deployed to form both front and back surface fields. To pattern the rear junction, a self-aligned process based on one lithographic step has been developed. In addition, metal lift-off is used to define the metal contacts of both polarities. By using this process, efficiency higher than 20% has been demonstrated. [ABSTRACT FROM AUTHOR]

To further increase the efficiency of multijunction thin-film silicon (TF-Si) solar cells, it is crucial for the front electrode to have a good transparency and conduction, to provide efficient light trapping for each subcell, and to ensure a suitable morphology for the growth of high-quality silicon layers. Here, we present the implementation of highly transparent modulated surface textured (MST) front electrodes as light-trapping structures in multijunction TF-Si solar cells. The MST substrates comprise a micro-textured glass, a thin layer of hydrogenated indium oxide (IOH), and a sub-micron nano-textured ZnO layer grown by low-pressure chemical vapor deposition (LPCVD ZnO). The bilayer IOH/LPCVD ZnO stack guarantees efficient light in-coupling and light trapping for the top amorphous silicon (a-Si:H) solar cell while minimizing the parasitic absorption losses. The crater-shaped micro-textured glass provides both efficient light trapping in the red and infrared wavelength range and a suitable morphology for the growth of high-quality nanocrystalline silicon (nc-Si:H) layers. Thanks to the efficient light trapping for the individual subcells and suitable morphology for the growth of high-quality silicon layers, multijunction solar cells deposited on MST substrates have a higher efficiency than those on single-textured state-of-the-art LPCVD ZnO substrates. Efficiencies of 14.8% (initial) and 12.5% (stable) have been achieved for a-Si:H/nc-Si:H tandem solar cells with the MST front electrode, surpassing efficiencies obtained on state-of-the-art LPCVD ZnO, thereby highlighting the high potential of MST front electrodes for high-efficiency multijunction solar cells. Copyright © 2015 John Wiley & Sons, Ltd. [ABSTRACT FROM AUTHOR]

Passivating contacts based on poly-Si have enabled record-high c-Si solar cell efficiencies due to their excellent surface passivation quality and carrier selectivity. The eventual existence of pinholes within the ultra-thin SiO x layer is one of the key factors for carrier collection, beside the tunneling mechanism. However, pinholes are usually believed to have negative impact on the passivation quality of poly-Si passivating contacts. This work studied the influence of the pinhole density on the passivation quality of ion-implanted poly-Si passivating contacts by decoupling the pinhole generation from the dopants diffusion process by means of two annealing steps: (1) a pre -annealing step at high temperature after the intrinsic poly-Si deposition to visualize the formation of pinholes and (2) a post -annealing step for dopants activation/diffusion after ion-implantation. The pinhole density is quantified in the range of 1✕106 to 3✕108 cm2 by the TMAH selective etching approach. The passivation quality is discussed with respect to the pinhole density and the post-annealing thermal budget (TB) for dopants diffusion. The study shows that a moderate pinhole density does not induce doping profile variations that can be detectable by the coarse spatial resolution of ECV measurements. It is surprising that the existence of pinholes in a moderate density within our thickness fixed SiO x layer can effectively enhance the passivation qualities for both n + and p + poly-Si passivating contacts. We speculate the reason is due to the enhanced field-effect passivation at the pinhole surrounding. In fact, the variation of the passivation quality depends on the balance between a strengthened field-effect passivation and an excessive local Auger recombination, being both effects induced by the higher and deeper level of dopants diffused into the c-Si surface through the pinholes. • Decoupling of the pinhole formation and the dopant diffusion using two annealing processes. • Application of the thermal diffusion budget concept to the fabrication of the poly-Si passivating contacts. • The existence of pinholes within the SiO x layer enhances the localized dopant diffusion. • The dopant diffusion through the pinholes enhances the electrical field passivation locally. • A moderate pinhole density within SiO x induces obvious increase in passivation qualities for both n+ and p+ poly-Si passivating contacts, although the sensitivity of passivation on pinhole density is less for p + poly-Si. [ABSTRACT FROM AUTHOR]

Photovoltaic (PV) technology offers an economic and sustainable solution to the challenge of increasing energy demand in times of global warming. The world PV market is currently dominated by the homo-junction crystalline silicon (c-Si) PV technology based on high temperature diffused p-n junctions, featuring a low power conversion efficiency (PCE). Recent years have seen the successful development of Si heterojunction technologies, boosting the PCE of c-Si solar cells over 26%. This article reviews the development status of high-efficiency c-Si heterojunction solar cells, from the materials to devices, mainly including hydrogenated amorphous silicon (a-Si:H) based silicon heterojunction technology, polycrystalline silicon (poly-Si) based carrier selective passivating contact technology, metal compounds and organic materials based dopant-free passivating contact technology. The application of silicon heterojunction solar cells for ultra-high efficiency perovskite/c-Si and III-V/c-Si tandem devices is also reviewed. In the last, the perspective, challenge and potential solutions of silicon heterojunction solar cells, as well as the tandem solar cells are discussed. [ABSTRACT FROM AUTHOR]