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Many of today’s stretchable interconnection technologies make extensive use of meandered interconnections, these provide 2-D in-plane springs capable of extending and compressing as the need arises. While a significant quantity of research work exists on these interconnects, few generic methodologies exist to design circuits in a consistent manner. This shortfall leads to questionable design practices, which can negatively affect reliability and performance. Presented within this paper is a method to quickly determine which meander fits within a given area based on common geometric boundary conditions. [ABSTRACT FROM AUTHOR]

Metal-elastomer interfacial systems, often encountered in stretchable electronics, demonstrate remarkably high interface fracture toughness values. Evidently, a large gap exists between the rather small adhesion energy levels at the microscopic scale (‘intrinsic adhesion’) and the large measured macroscopic work-of-separation. This energy gap is closed here by unravelling the underlying dissipative mechanisms through a systematic numerical/experimental multi-scale approach. This self-containing contribution collects and reviews previously published results and addresses the remaining open questions by providing new and independent results obtained from an alternative experimental set-up. In particular, the experimental studies on Cu-PDMS (Poly(dimethylsiloxane)) samples conclusively reveal the essential role of fibrillation mechanisms at the micro-meter scale during the metal-elastomer delamination process. The micro-scale numerical analyses on single and multiple fibrils show that the dynamic release of the stored elastic energy by multiple fibril fracture, including the interaction with the adjacent deforming bulk PDMS and its highly nonlinear behaviour, provide a mechanistic understanding of the highwork-of-separation. An experimentally validated quantitative relation between the macroscopic work-of-separation and peel front height is established from the simulation results. Finally, it is shown that a micro-mechanically motivated shape of the traction-separation law in cohesive zone models is essential to describe the delamination process in fibrillating metal-elastomer systems in a physically meaningful way. [ABSTRACT FROM AUTHOR]

In this paper, we present the developments of a new technology to realize 2.5-/3-D electronic circuits. The starting point is an electronic circuit embedded in a hard thermoplastic material, which is transformed into a 2.5-/3-D shape using a thermoforming process. The electronic circuit consists of stretchable copper interconnections in combination with electronic components. The circuit is produced using conventional printed circuit board process steps: a copper sheet is laminated on a thermoplastic material, such as Polycarbonate (PC) or Polyethylene Terephthalate Glycol (PET-G). The copper is structured using lithography and wet etching, and the electronic components are assembled using conductive adhesives. We investigated the use of different designs for stretchable interconnects to overcome the stretching of the electronic circuit by thermoforming it. A semispherical-shaped mold was used for this purpose where the local strain of the substrate can reach 100% with a sharp bending. It was shown that meander-shaped interconnects could accommodate the gradual deformation during the forming of the substrate either for PC and PET-G. However, at the mold’s edge, the copper-meandered tracks showed a delamination of the copper from the substrate. In the meanwhile, the electrical conductivity of the copper tracks did not show any significant variation. Another meander design based on an elliptical shape (in order to increase the length of the track) is proposed and compared with the first design. [ABSTRACT FROM PUBLISHER]

Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. However, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experience. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable characteristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability. [ABSTRACT FROM AUTHOR]

The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used for the realization of wearable textile electronics and biomedical implants. The stretchable devices consist of rigid or flexible component islands interconnected with stretchable meander-shaped copper conductors embedded in a stretchable polymer, polydemethylsiloxane. The technology uses standard printed circuit board manufacturing steps and liquid injection molding techniques to achieve a robust and reliable product. The conductors in the device are designed to accommodate strains up to 10–15%. Spin-on photo-definable polyimide as mechanical support for the stretchable interconnects and the functional flexible islands are introduced. By use of polyimide, the reliability of the stretchable interconnects, the straight interconnects on the flexible islands and the transitions between the stretchable and nonstretchable parts are improved. Long-term endurance behavior of the stretchable interconnects is studied by cyclic elongation at strain ranges of up to 20% while monitoring the electrical connectivity. It's shown that the lifetime of the polyimide supported interconnects is at least two times better compared to the nonsupported. [ABSTRACT FROM AUTHOR]

Today electronics in “wearable systems” or “smart textiles” are mainly realised on traditional interconnection substrates, like rigid printed circuit boards or mechanically flexible substrates. The electronic modules are detachable to allow cleaning and washing of the textile. In order to achieve a higher degree of integration and user comfort, a technology for flexible and stretchable electronic circuits was developed. The electronic system is completely embedded in an elastomer material like polydimethylsiloxane (PDMS, silicone), resulting in soft and stretchable electronic modules. The technology uses standard packaged components (ICs) and meander-shaped copper tracks, so that stretchable systems with complex functionality can be achieved. This paper describes how these stretchable modules can be integrated in textiles. Also the influence of the PDMS on the stretchability of the textile has been examined. A basic electronic module with blinking light emitting diodes (LEDs) was designed and produced to illustrate the textile integration and to perform initial washing tests. [ABSTRACT FROM PUBLISHER]

The increasing number of biomedical applications for electronic systems have led to the need for stretchable electronics in order to significantly enhance the comfort of the user. This paper describes the design and manufacturing process of new stretchable high-frequency interconnects with meander-shaped conductors in a coplanar waveguide topology. The novel interconnects are produced based on laser-ablation of a copper foil, which is then embedded in a highly stretchable bio-compatible silicone material. Measurements on prototypes of the designed stretchable high-frequency interconnects revealed a maximal magnitude of -14 dB for the reflection coefficient and a minimal magnitude of -4 dB for the transmission coefficient in the frequency band up to 3 GHz. The influence of stretch on the performance of the high-frequency interconnects was analyzed using a stretch testing machine. The results showed that nor the magnitude, neither the phase of the transmission coefficient was influenced by elongations up to 20%. [ABSTRACT FROM AUTHOR]

For biomedical and textile applications, the comfort of the user will be enhanced if the electronic circuits are not only flexible but also elastic. This letter reveals a simple moulded-interconnect-device technology for the construction of elastic point-to-point interconnections, based on 2-D spring-shaped metallic tracks, which are embedded in a highly elastic silicone film. Metal interconnections of 3-cm long were constructed with an initial resistance of about 3 Ω, which did not significantly increase (< 5%) when stretched. A stretchability above 100% in one direction has been demonstrated. [ABSTRACT FROM AUTHOR]

Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview of recent technology developments in this domain and concrete application examples will be discussed. [ABSTRACT FROM AUTHOR]