Search

In this study, we focus on the development of key processes towards wafer-scale 3-dimentional/vertical (3D) integration of Indium-Phosphide (InP) photonic membranes on InP electronics via adhesive bonding. First, we identified the most critical steps and optimized them to achieve high thermal and mechanical compatibility of components for the co-integration process. Next, we developed a strategy for InP-to-InP wafer bonding with high topology tolerance, and introduced hard benzocyclobutene (BCB) anchors to preserve the alignment and BCB thickness uniformity after bonding. The resulting bond layer is homogeneous in terms of physical and mechanical properties. Finally, we developed a novel method to selectively remove the InP substrate from the photonics side via wet etching while protecting the electronics carrier wafer with hermetic multi-layer coatings. The investigation of these key steps is essential for scalable 3D integration of photonics and electronics at ultra short distances (< $15 ~\mu \text{m}$). [ABSTRACT FROM AUTHOR]

In this letter, a grounded coplanar waveguide-to-microstrip (GCPW-to-MS) transition without via holes is presented. The transition is designed on a PET® substrate and fabricated using inkjet printing technology. To our knowledge, fabrication of transitions using inkjet printing technology has not been reported in the literature. The simulations have been performed using HFSS® software and the measurements have been carried out using a Vector Network Analyzer on a broad frequency band from 40 to 85 GHz. The effect of varying several geometrical parameters of the GCPW-to-MS on the electromagnetic response is also presented. The results obtained demonstrate good characteristics of the insertion loss better than 1.5 dB, and return loss larger than 10 dB in the V-band (50–75 GHz). Such transitions are suitable for characterization of microwave components built on different flexible substrates. [ABSTRACT FROM PUBLISHER]