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The epitaxial growth of Si layers on Si substrates in the presence of O atoms is generally considered a challenge, as O atoms degrade the epitaxial quality by generating defects. Here, we investigate the growth mechanisms for Si epitaxy on O atomic layers (ALs) with different O-contents and structures. O ALs are deposited by ozone (O 3 ) or oxygen (O 2 ) exposure on H-terminated Si at 50 °C and 300 °C respectively. Epitaxial Si is deposited by chemical vapor deposition using silane (SiH 4 ) at 500 °C. After O 3 exposure, the O atoms are uniformly distributed in Si-Si dimer/back bonds. This O layer still allows epitaxial seeding of Si. The epitaxial quality is enhanced by lowering the surface distortions due to O atoms and by decreasing the arrival rate of SiH 4 reactants, allowing more time for surface diffusion. After O 2 exposure, the O atoms are present in the form of SiO x clusters. Regions of hydrogen-terminated Si remain present between the SiO x clusters. The epitaxial seeding of Si in these structures is realized on H-Si regions, and an epitaxial layer grows by a lateral overgrowth mechanism. A breakdown in the epitaxial ordering occurs at a critical Si thickness, presumably by accumulation of surface roughness. [ABSTRACT FROM AUTHOR]

V-defects can be very detrimental to the functionality of GaN based light emitting diodes (LEDs) and high power transistors grown on 200 mm Si (111) substrates. This work focuses on reducing these detrimental defects in the GaN/AlGaN/AlN stacks grown in a Veeco Turbodisc Maxbright MOCVD system. The origins of V-defects in GaN/AlGaN/AlN material were studied by cross-sectional transmission electron microscope (TEM) and high angle annular dark field scanning transmission electron microscopy (HAADF-STEM). It was found that V-defects were associated with inversion domain boundary (IDB) like defects, which started from the interface between the AlN nucleation layers and the Si (111) substrates. These IDB-like defects were terminated by generating V-defects in the upper layers. Encouraging the 2-D GaN growth mode helped to close these V-defects in the GaN layers, but relaxed the built-in compressive stress faster and resulted in excessive wafer bow. Optimizing the V/III ratio during the AlN nucleation step improved AlN crystal quality and surface morphology, and close V-defects in GaN without degrading wafers stress condition. [ABSTRACT FROM AUTHOR]

Abstract: We report on the synthesis of Cu3Ge films by exposing Cu films to germane (GeH4). The process window was established by investigating the influence of the GeH4 partial pressure, the soak temperature, and the soak time on Cu films of different thickness. It is shown that short exposures of germane led to Cu-rich germanides, while an excessive GeH4 supply resulted in a Cu3Ge/Ge mixed phase. The germanidation reaction was found to be selective and required the prior removal of the native Cu oxide by in situ plasma cleaning. X-ray diffraction and transmission electron microscopy showed that the Cu3Ge films were crystalline as deposited in the orthorhombic phase and were textured. The films were homogenous in composition. Thin films consisted of Cu3Ge islands connected by a thin wetting layer. Fully continuous layers were however found for larger film thicknesses. The continuity of the Cu3Ge film was also found to be influenced by the pseudosubstrate: the films were more continuous on TaN/Ta than on SiO2. The electric properties of the Cu3Ge films on both TaN/Ta and SiO2 pseudosubstrates are presented and compared. [Copyright &y& Elsevier]

Abstract: A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects. [Copyright &y& Elsevier]