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• SiC p /Al composites were prepared based on Fused Deposition Modelling (FDM) • Higher SiC volume fraction were obtained compared to other additive manufacturing methods. • complex-structure composites were prepared with excellent properties. SiC p /Al composites are widely used in space vehicles, electronic packaging, automobiles, rail vehicles and other fields due to their excellent mechanical and thermal properties. Complex-shaped SiC p /Al parts are usually manufactured by mechanical processing, which is expensive and time-consuming due to the high hardness of SiC phase. As a highly effective 3D molding method, Fused Deposition Modelling (FDM) of the complex-structure SiC p /Al composites was reported for the first time in this paper. SiC p /Al composites was densified by pressureless infiltration after FDM, and as-acquired bulk possessed high densification of 92.67 % and the SiC volume fraction of 43.2 %. Moreover, excellent performances were also presented, including flexural strength of 211 MPa, thermal conductivity of 112(W/m·K), and the thermal expansion coefficient of 8.67 × 10-6K−1. [ABSTRACT FROM AUTHOR]

Heat dissipation material with programmable anisotropic property is very challenging, yet can realize the controllable thermal diffusion for heating device. In this work, anisotropic Si3N4 ceramics with oriented grains are prepared to adjust and improve the mechanical and thermal properties under the applied stress field by rolling film forming technology. Through the design of the sintering aids in the process of liquid‐phase sintering, the orientation degree of the Si3N4 grains is programmable as well as the mechanical property and the thermal property of the Si3N4 ceramics. As a consequence, the obtained Si3N4 ceramics show significant anisotropy in mechanical properties and thermal conductivity. The typical fracture toughness and thermal conductivity along the grain orientation direction are 10.6 MPa⋅m1/2 and 45.45 W/(m⋅K) while they are 4.5 MPa⋅m1/2 and 66.42 W/(m⋅K) in the direction perpendicular to the oriented grain, respectively. This grain orientation method paves the way for the thermal performance design and the production of programmable heat dissipation material. [ABSTRACT FROM AUTHOR]