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As technology advances toward ongoing circuit miniaturization and device size reduction followed by improved power density, heat dissipation is becoming a key challenge for electronic equipment. Heat accumulation can be prevented if the heat from electrical equipment is efficiently exported, ensuring a device's lifespan and dependability and preventing otherwise possible mishaps or even explosions. Hence, thermal management applications, which include altering the role of aerogels from thermally insulative to thermally conductive, have recently been a hot topic for 3D-aerogel-based thermal interface materials. To completely comprehend three-dimensional (3D) networks, we categorized and comparatively analyzed aerogels based on carbon nanomaterials, namely fibers, nanotubes, graphene, and graphene oxide, which have capabilities that may be fused with boron nitride and impregnated for better thermal performance and mechanical stability by polymers, including epoxy, cellulose, and polydimethylsiloxane (PDMS). An alternative route is presented in the comparative analysis by carbonized cellulose. As a result, the development of structurally robust and stiff thermally conductive aerogels for electronic packaging has been predicted to increase polymer thermal management capabilities. The latest trends include the self-organization of an anisotropic structure on several hierarchical levels within a 3D framework. In this study, we highlight and analyze the recent advances in 3D-structured thermally conductive aerogels, their potential impact on the next generation of electronic components based on advanced nanocomposites, and their future prospects. [ABSTRACT FROM AUTHOR]

In this study, three-dimensional (3D) polyvinyl alcohol (PVA)/aligned boron nitride (BN) aerogel framework nanocomposites with high performance were fabricated by a facile strategy. The boron nitride powder was initially hydrolyzed and dispersed with a chemically crosslinked plasticizer, diethyl glycol (DEG), in the PVA polymer system. The boron nitride and DEG/PVA suspensions were then mixed well with different stoichiometric ratios to attain BN/PVA nanocomposites. Scanning electron microscopy revealed that BN platelets were well dispersed and successfully aligned/oriented in one direction in the PVA matrix by using a vacuum-assisted filtration technique. The formed BN/PVA aerogel cake composite showed excellent in-plane and out-of-plane thermal conductivities of 0.76 W/mK and 0.61 W/mK with a ratio of BN/PVA of (2:1) in comparison with 0.15 W/mK for the pure PVA matrix. These high thermal conductivities of BN aerogel could be attributed to the unidirectional orientation of boron nitride nanoplatelets with the post-two days vacuum drying of the specimens at elevated temperatures. This aerogel composite is unique of its kind and displayed such high thermal conductivity of the BN/PVA framework without impregnation by any external polymer. Moreover, the composites also presented good wettability results with water and displayed high electrical resistivity of ~1014 Ω cm. These nanocomposites thus, with such exceptional characteristics, have a wide range of potential uses in packaging and electronics for thermal management applications. [ABSTRACT FROM AUTHOR]