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The effects of Ti doping on the microstructure and properties of SiCp/Al composites fabricated by pressureless infiltration were comprehensively investigated using first-principles calculations and experimental analyses. First-principles calculations revealed that the interface wetting and bonding strength in an Al/SiC system could be significantly enhanced by Ti doping. Subsequently, the Ti element was incorporated into SiC preforms in the form of TiO2 and TiC to verify the influence of Ti doping on the pressureless infiltration performance of SiCp/Al composites. The experimental results demonstrated that the pressureless infiltration of molten Al into SiC preforms was promoted by adding TiC or TiO2 due to the improved wettability. However, incorporating TiO2 leads to the growth of AlN whiskers under a N2 atmosphere, thereby hindering the complete densification of the composites. On the other hand, TiC doping can improve wettability and interface strength without deleterious reactions. As a consequence, the TiC-doped SiCp/Al composites exhibited excellent properties, including a high relative density of 99.4%, a bending strength of 287 ± 18 MPa, and a thermal conductivity of 142 W·m−1·K−1. [ABSTRACT FROM AUTHOR]

• SiC p /Al composites were prepared based on Fused Deposition Modelling (FDM) • Higher SiC volume fraction were obtained compared to other additive manufacturing methods. • complex-structure composites were prepared with excellent properties. SiC p /Al composites are widely used in space vehicles, electronic packaging, automobiles, rail vehicles and other fields due to their excellent mechanical and thermal properties. Complex-shaped SiC p /Al parts are usually manufactured by mechanical processing, which is expensive and time-consuming due to the high hardness of SiC phase. As a highly effective 3D molding method, Fused Deposition Modelling (FDM) of the complex-structure SiC p /Al composites was reported for the first time in this paper. SiC p /Al composites was densified by pressureless infiltration after FDM, and as-acquired bulk possessed high densification of 92.67 % and the SiC volume fraction of 43.2 %. Moreover, excellent performances were also presented, including flexural strength of 211 MPa, thermal conductivity of 112(W/m·K), and the thermal expansion coefficient of 8.67 × 10-6K−1. [ABSTRACT FROM AUTHOR]

Heat dissipation material with programmable anisotropic property is very challenging, yet can realize the controllable thermal diffusion for heating device. In this work, anisotropic Si3N4 ceramics with oriented grains are prepared to adjust and improve the mechanical and thermal properties under the applied stress field by rolling film forming technology. Through the design of the sintering aids in the process of liquid‐phase sintering, the orientation degree of the Si3N4 grains is programmable as well as the mechanical property and the thermal property of the Si3N4 ceramics. As a consequence, the obtained Si3N4 ceramics show significant anisotropy in mechanical properties and thermal conductivity. The typical fracture toughness and thermal conductivity along the grain orientation direction are 10.6 MPa⋅m1/2 and 45.45 W/(m⋅K) while they are 4.5 MPa⋅m1/2 and 66.42 W/(m⋅K) in the direction perpendicular to the oriented grain, respectively. This grain orientation method paves the way for the thermal performance design and the production of programmable heat dissipation material. [ABSTRACT FROM AUTHOR]