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Measuring the thermal shock crack growth process is crucial for revealing ceramic materials and structures' thermal shock failure mechanisms and evaluating their reliability. We used a self-made water quenching system to conduct thermal shock tests on alumina and zirconia ceramics. The thermal shock process was recorded by high-speed digital image correlation (DIC) during the test. The process of thermal shock crack initiation and propagation in two kinds of ceramics was determined by analyzing the speckle image change on the sample's surface. It is found that the crack growth rate of alumina is faster than that of zirconia, which is caused by different material parameters. This paper presents an in-situ measurement method for the initiation and propagation of thermal shock cracking in ceramic materials. It can provide a measurement method to identify and predict the thermal shock damage of ceramic components. [ABSTRACT FROM AUTHOR]

Based on alumina ceramics, we employ the phase‐field method to study the effects of thermal conductivity, specific heat, density, thermal expansion coefficient, Young's modulus, and fracture toughness on thermal shock cracks. The results show that increasing thermal conductivity and fracture toughness will reduce thermal shock damage. That is, the long crack length becomes shorter, or the crack density becomes smaller. However, increasing the thermal expansion coefficient and Young's modulus will increase thermal shock damage. It is consistent with the previous thermal shock theory. The effect of material parameters on crack propagation speed was also considered. In addition, we carried out a thermal shock test of the zirconia. The results of the phase‐field calculation are the same as the thermal shock results of the zirconia. This paper verifies that the phase‐field method is suitable for simulating thermal shock cracks in other ceramics. [ABSTRACT FROM AUTHOR]

Crack measurement after thermal shock is usually considered as a replacement because real-time observation of thermal shock experiments is difficult to achieve. This paper presents an experimental approach for real-time displaying thermal shock cracking using oxygen-acetylene flame and high-speed imaging of translucent ceramic. We capture the crack propagation process, calculate the crack propagation speed, discuss the effect of sample size and flame heat flux on the crack propagation, and analyze the difference between the crack propagation under cold shock and hot shock. This paper further improves the mechanism of thermal shock damage of ceramic materials. [ABSTRACT FROM AUTHOR]

• A prefabricated crack growth of ceramic under thermal shock is studied in real-time. • A relation between the dynamic stress intensity factor and crack speed is identified. • A numerical model can reproduce the crack evolution process of the thermal shock. The prefabricated cracks propagation of ceramic under flame thermal shock was studied by real-time observation. The experimental results show that wing cracks are generated from both tips of the prefabricated crack, and the complete failure of the samples is a high-speed process. The crack propagation speed is fast at first and then gradually slows down. The maximum propagation speed of the near flame tip increases with the prefabricated crack distance to the heated surface, while an inverse trend is observed for the far flame tip. The effect of prefabricated crack angle on thermal shock crack propagation was also considered. In addition, numerical simulations based on dynamic fracture mechanics were carried out to reproduce the entire cracking process. To this end, the relation between the dynamic stress intensity factors and the crack growth speed in the speed range of 100 m/s to 2600 m/s was identified by combing experiments and numerical simulations. The simulation results and the above-mentioned relation are consistent with the experimental observations. The numerical model can faithfully reproduce the crack evolution process of the thermal shock, which is difficult to observe in an experiment due to the high speed of the cracking process. [ABSTRACT FROM AUTHOR]