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We investigated the effects of sputtering conditions for the deposition of an Iridium (Ir) layer in a [Co/Pt]m/Co/Ir/[Co/Pt]n/Co/W/CoFeB synthetic antiferromagnetic reference layer (Ir-SyF) on the magnetic properties and tunnel magnetoresistance ratio (TMR ratio) of magnetic tunnel junctions (MTJs) stacks annealed at 400 °C for 1 h. The exchange coupling field ($H_{\mathrm {ex}}$) of Ir-SyF was improved by reducing the energy of Ir recoil ions and two times larger than that with Ru-SyF. Energy dispersive X-ray (EDX) spectrometry line analysis revealed greater interlayer diffusion in Ir when Ir was sputtered by using a conditions with large recoiled energy. This could cause the deterioration of the $H_{\mathrm {ex}}$ of the Ir-SyF. Despite the larger $H_{\mathrm {ex}}$ , the TMR ratio of the MTJ with Ir-SyF is smaller than that with Ru-SyF. The $m$ – $H$ curve of MTJ with Ru-SyF showed a large plateau region around zero magnetic field, whereas that with Ir-SyF did not. These results indicated the degradation of perpendicular magnetic anisotropy (PMA) in the top part of the Co/Pt multilayer with CoFeB reference layer and a large biquadratic coupling effect in the thin Ir layer. This causes the deterioration of the TMR ratio of the MTJ with Ir-SyF. TEM image of the Co/Pt layer in the MTJ with Ir shows some lattice defects. The EDX line analysis revealed that a large amount of Pt in the top Co/Pt layer diffused toward CoFeB reference layer in the Ir-SyF, resulting in the degradation of PMA. The structural analysis by X-ray diffraction showed the lattice spacing of CoPt (111) in Ir-SyF to be larger than that in Ru-SyF, indicating the occurrence of strain relaxation at the Co/Pt interface. These crystallographic changes in Ir-SyF might be related to a larger Pt diffusion. Suppression of Pt diffusion as well as low damage Ir deposition in the reference layer is crucial to utilize Ir-SyF. [ABSTRACT FROM AUTHOR]

We investigated the effect of magnetic coupling (the energy constant of unit area $J_{\text {cpl}}$) between CoFeB free layers on thermal stability factor $\Delta $ in magnetic tunnel junction (MTJ) with CoFeB/MgO double interfacial perpendicular magnetic anisotropy (IPMA). We newly introduced $J_{\text {cpl}}$ in models for calculations, which were based on magnetic domain propagation model when MTJ diameter $d$ is larger than critical diameter $d_{\text {c}}$ and magnetization coherent rotation model when $d \le d_{\text {c}}$. With increasing $J_{\text {cpl}}$ , $\Delta $ increases and saturates when $J_{\text {cpl}}$ is over a critical value $J_{\mathrm {cpl\_{}c}}$. Magnetostatic coupling constants ($J_{\text {stat}}$) between the free layers were also calculated. $J_{\text {stat}}$ is much smaller than $J_{\mathrm {cpl\_{}c}}$ and cannot maximize $\Delta $ by itself, so an interlayer exchange coupling (the critical energy constant of unit area $J_{\mathrm {ex\_{}c}}$) is required to cover the difference between $J_{\mathrm {cpl\_{}c}}$ and $J_{\text {stat}}$. $J_{\mathrm {ex\_{}c}}$ also rapidly increases with the decrease in $d$ and reaches a plateau of 0.15 mJ/m2 in $d \le 30$ nm. MTJ devices with the smallest $J_{\text {ex}}\,\,(=0.01 \text {mJ/m}^{2}$) and a moderate PMA (constant per unit area $K_{\text {eff}} t^{\ast }$) were made and $\Delta s$ were evaluated by experiments. The experimental $\Delta s$ were fitted by the calculations with adjusting stiffness constants $A_{s}$. The calculated $\Delta s$ and the experimental $\Delta s$ were in good agreement when $A_{s}$ had a smaller value than that of the blanket film. Since the experimentally used $J_{\text {ex}}$ value was almost 0, $\Delta $ values were estimated when $J_{\text {ex}}$ was a greater value of 0.15 mJ/m2. As a result, 30% enhancement of $\Delta $ was obtained at the smallest $d = 20$ nm. [ABSTRACT FROM AUTHOR]

We developed perpendicular magnetic tunnel junctions (MTJs) with four synthetic anti-ferromagnetically coupled Co/Pt layers (quad-SyF) and investigated their magnetic and transport properties. The quad-SyF comprised four Co/Pt layers and three 0.9 nm-thick Ru coupling layers, which consisted of Co/[Co/Pt] ${}_{a}$ /Ru/Co/[Co/Pt] ${}_{b}$ /Ru/Co/[Co/Pt] ${}_{c}$ /Ru/Co/[Co/Pt] ${}_{d}$ from top to bottom. The exchange coupling field ($H_{\mathrm {ex}}$) reached a maximum of 1 T when the values of $a$ , $b$ , $c$ , and $d$ were 1, 2, 2, and 1, respectively. The tunnel magnetoresistance ratio of the MTJ with the quad-SyF and the second-peak conventional double-SyF increased as the annealing temperature was increased up to 400 °C, whereas that of the MTJ with the first-peak conventional double-SyF degraded at temperatures of more than 350 °C in blanket films. A 55 nm diameter MTJ with quad-SyF was found to be stable even against an external magnetic field up to 300 mT. On the contrary, in the conventional double-SyF, the reference-layer (RL) magnetization direction flips at around 250 mT. The shift magnetic field of the MTJ with quad-SyF becomes approximately zero when the values of $a$ , $b$ , $c$ , and $d$ are 1, 4, 1, and 2, respectively. No back-hopping of the MTJ with quad-SyF was observed even for the write pulsewidth ($t_{W}$) down to 10 ns. On the contrary, an MTJ with conventional double-SyF exhibited back-hopping. In the patterned MTJ with conventional double-SyF, as the MTJ size decreases, the coercive field of Co/Pt significantly increases and $H_{\mathrm {ex}}$ decreases, causing the $m$ – $H$ curve of the RL to cross the zero magnetic field. This enables both parallel and antiparallel configurations for the top and bottom Co/Pt layers in double-SyF at the zero magnetic field, which could induce back-hopping. However, the $m$ – $H$ curves of the RL in the patterned MTJ with quad-SyF are far from the zero magnetic field owing to the high $H_{\mathrm {ex}}$ and low $H_{c}$ , which could lead to the suppression of back-hopping. [ABSTRACT FROM AUTHOR]

We successfully developed 25-nm quad CoFeB/MgO-interfaces perpendicular magnetic tunnel junction (quad-MTJ) with enough thermal stability. To fabricate the quad-MTJ, a physical vapor deposition (PVD) process for depositing novel free layer and low resistance-area (RA) product MgO layer and low-damage fabrication processes were developed. The developed quad-MTJ technology and advanced process bring better tunnel magneto resistance (TMR) ratio and RA to quad-MTJ than those of double-interface MTJ (double-MTJ), even though quad-MTJ has an additional MgO layer. Scaling down the MTJ size to 25 nm, we demonstrated the advantages of quad-MTJ compared with double-MTJ as follows: 1) two times larger thermal stability factor (Δ), which results in over ten years retention; 2) superiority of large Δ in the measuring temperature range up to 200 °C; 3) ~1.5 times higher write efficiency; 4) lower write current at short write pulse regions at less than 100 ns; and e) excellent endurance of over 1011 thanks to higher write efficiency, which results from the reduced voltage owing to low RA and the low damage integration process technology. As a result, the developed quad-MTJ technologies will open the way for the realization of high-density STT-MRAM with low power, high speed, high reliability, and excellent scalability down to 2 × nm node. [ABSTRACT FROM AUTHOR]

Magnetic coupling between two CoFeB layers through the W insertion layer is important in the conventional double CoFeB/MgO interface, magnetic tunneling junctions (MTJs) (double-MTJs) with MgO/CoFeB/W/CoFeB/MgO free layer stack because it increases the effective magnetic volume of the free layer. The magnetic coupling energy constant per unit area, Jcpl, between two CoFeB layers through the W layer and the effective perpendicular magnetic anisotropy (PMA) energy constant per unit area, Kefft*, were investigated for conventional double-MTJs with various W insertion layer thicknesses. As the W layer thickness increased, Kefft* increased and Jcpl decreased. There exists a trade-off relationship between Jcpl and Kefft*. In conventional double-MTJs with a single W insertion layer, large values for Jcpl and Kefft* were difficult to obtain simultaneously. To improve this tradeoff, we employed a free layer stack with a thin ferromagnetic layer (ferromagnetic bridge layer: FBL) located in the W insertion layer. In the double-MTJs with FBL annealed at 400 °C, a large Jcpl value of 0.37 mJ/m2 was achieved while maintaining the maximum values of Kefft*. Accordingly, the MTJ with FBL provides an MTJ stack structure for obtaining high thermal stability. [ABSTRACT FROM AUTHOR]

We have proposed a novel quad-interface magnetic tunnel junction (MTJ) technology which brings forth an increase of both thermal stability factor Δ and switching efficiency defined as the ratio of Δ to intrinsic critical current IC0 (Δ/IC0) by a factor of 1.5–2 compared with the conventional double-interface MTJ technology. The free layer of the developed quad interface consists of bottom-MgO/FL1/middle-MgO/FL2/top-MgO stack structure. We successfully fabricated the quad-interface MTJ using a 300-mm process based on a novel low-damage integration process including physical vapor deposition (PVD), reactive ion etching (RIE), and so on. By developing the quad-interface MTJ, we have achieved about two times larger Δ and Δ/IC0 at the same time. Moreover, we have achieved about two times larger tunnel magnetoresistance (TMR) ratio at the same resistance area (RA) product by developing the FL1, bottom-MgO, and middle-MgO. The developed quad-interface MTJ technology considered as post-double-interface MTJ technology will become an essential technology for the scaling of the spin-transfer-torque magnetoresistive random access memory (STT-MRAM) beyond 20 nm. [ABSTRACT FROM AUTHOR]