1. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation.
- Author
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Liu, Yang, Chen, Chuantong, Wang, Ye, Zhang, Zheng, Liu, Ran, Ueshima, Minoru, Ota, Ichiro, Nishikawa, Hiroshi, Nishijima, Masahiko, Nakayama, Koji S., and Suganuma, Katsuaki
- Subjects
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THERMAL shock , *TRAVERTINE , *THERMAL resistance , *STRAINS & stresses (Mechanics) , *ELASTICITY , *THERMOCYCLING - Abstract
Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is incorporated into sintered Ag matrix to develop an Ag@Si composite sintering strategy. The Si integration helps reduce cost and alleviate CTE-mismatch of Ag-sintered die attachments. An innovative Ag@Si composite sintering structure is achieved by low-temperature and pressure-less sintering process, where a possibly slight diffusion of native SiO 2 on the Si surface toward Ag is indicated by TEM observation, enabling the integration of Ag and Si into one continuous network. Owing to the robust well-bonded composite sintering, the Ag@Si joining strategy provides mechanical/microstructural reliability far beyond the pure Ag sinter joining, demonstrating significant prospects in high-temperature interconnection applications. During the harsh thermal cycling (−50–250 °C), the mitigating effect of the Si addition on CTE mismatch is manifested through the substantial suppression of microstructure deterioration in Ag@Si joint that occurs in pure-Ag-sintered joint, while the shear strength retention rate is doubled. Detailed investigation into the mechanism for elevated performance was conducted by material property and Missies stress analysis. The incorporation of Si helps modify the CTE, elastic properties, and stress distribution of Ag@Si-sintered material, synergistically contributing to the satisfactory joining reliability. [Display omitted] • The Ag@Si composite sinter joining was developed for power modules, where Si addition not only contributed to cost reduction but also helped alleviate CTE-mismatch issues in modules. • The Ag@Si sintering was revealed to be a well-integrated network between Ag and Si due to the slight diffusion of native SiO 2 on Si, offering good mechanical stability for the composite joining layer. • The integrated matrix endows Ag@Si sinter joint with much superior reliability to pure Ag sintered joining, both in terms of mechanical and microstructural stability during thermal cycling. • The impact of Si addition on alleviating CTE-mismatch was systematically validated through analyses of thermal expansion, tensile properties, and finite element method (FEM) simulation. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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