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This study develops a novel high‐thickness BM QD color conversion layer structure and a surface‐planarization process for QD materials after inkjet printing. This process reduces the height differences caused by the multi‐step exposure‐developing process. Following the fabrication of 8μm BM structure and 2μm CF structure, precise inkjet printing of QD materials is conducted within the 100ppi pixel area. we adjusted the surface energy of the color conversion layer by using an organic solution treatment to control the thickness profile and improve the color conversion efficiency. The printed QD materials are covered by a high‐transparency, low‐density polymer. After the color conversion layer component is encapsulated, reliability verification with a reliability assessment of 240 hours at RA (60℃ degrees, 90%RH) demonstrates an encapsulation effect where QD brightness retention rate remains above 90%. [ABSTRACT FROM AUTHOR]

This work analyses the overall stress/strain characteristic of flexible encapsulations with organic light-emitting diode (OLED) devices. A robust methodology composed of a mechanical model of multi-thin film under bending loads and related stress simulations based on nonlinear finite element analysis (FEA) is proposed, and validated to be more reliable compared with related experimental data. With various geometrical combinations of cover plate, stacked thin films and plastic substrate, the position of the neutral axis (NA) plate, which is regarded as a key design parameter to minimize stress impact for the concerned OLED devices, is acquired using the present methodology. The results point out that both the thickness and mechanical properties of the cover plate help in determining the NA location. In addition, several concave and convex radii are applied to examine the reliable mechanical tolerance and to provide an insight into the estimated reliability of foldable OLED encapsulations. [ABSTRACT FROM AUTHOR]