1. Effect of interfacial diffusion on microstructure and magnetic properties of Cu/FePt bilayer thin films.
- Author
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Chen, S. K., Yuan, F. T., and Chin, T. S.
- Subjects
THIN films ,SOLID state electronics ,CRYSTALS ,MICROMECHANICS ,MAGNETIZATION ,MICROSTRUCTURE - Abstract
The crystal structure, microstructure, and magnetic properties for a series of Cu/FePt bilayer films were investigated. The samples were prepared by depositing a Cu top layer on a highly ordered L1
0 FePt film. To promote interdiffusion, the bilayer samples were annealed at a temperature Td ranging from 300 to 800 °C. X-ray diffraction data indicate that observable diffusion occurs at 400 °C. The maximum coercivity thus obtained is 14.0 kOe, which is 24% larger than that of the ordered FePt film without a Cu top layer. The high Hc can be attributed to the diffusion of copper atoms through the grain boundaries of the magnetic films, which may produce extra pinning sites for domain-wall movement. The ΔM data measured from the Henkel plots of annealed Cu/FePt films change from negative to positive values as Td is raised from 400 to 800 °C. This can result from the effects of demagnetization coupling and exchange coupling and is further explained from the variation of squareness ratios of hysteresis loops. [ABSTRACT FROM AUTHOR]- Published
- 2005
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