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The article reports on the selection of EV Group's (EVG) Gemini wafer bonder by EPCOS AG. It states that EPCOS ordered the wafer bonder from EVG for high volume production of their electronic products for their facility in Munich, Germany. It quotes Christian Bauer, head of process development in EPCOS, on suppliers who can address the company's performance needs. Company profiles for EPCOS and EVG are also presented.

The article discusses the research study on the ceramic materials and cast-metal manufacturing methods which are being developed at the Fraunhofer Institute in Bremen, Germany. According to the Institute press release, scientists are developing a method which make light-metal parts intelligent by embedding electrical components and sensors into the parts during the casting stage of manufacturing. It also mentions that one application that might result from the innovation is sports monitoring.

The article provides information about the introduction of Dynex Semiconductor Ltd. with its high power semiconductor technologies during the PCIM exhibition to be held in Germany in May 2007. According to Paul Taylor, chief executive office (CEO) of Dynex, they will continue to focus power device R&D on future high voltage semiconductor products for high power energy management.