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Depleted Monolithic Active Pixel Sensors are of highest interest at the HL-LHC and beyond for the replacement of the Pixel trackers in the outermost layers of experiments where the requirement on total area and cost effectiveness is much bigger. They aim to provide high granularity and low material budget over large surfaces with ease of integration. Our research focuses on MALTA, a radiation hard DMAPS with small collection electrode designed in TowerJazz 180 nm CMOS imaging technology and asynchronous read-out. Latest prototypes are radiation hard up to 2 × 1015 1 MeV n e q /cm2 with a time resolution better than 2 ns. [ABSTRACT FROM AUTHOR]

The MALTA pixel chip is a 2 cm × 2 cm large monolithic pixel detector developed in the Tower 180 nm imaging process. The chip contains four CMOS transceiver blocks at its sides which allow chip-to-chip data transfer. The power pads are located mainly at the side edges on the chip which allows for chip-to-chip power transmission. The MALTA chip has been used to study module assembly using different interconnection techniques to transmit data and power from chip to chip and to minimize the overall material budget. Several 2-chip and 4-chip modules have been assembled using standard wire bonding, ACF (Anisotropic Conductive Films) and laser reflow interconnection techniques. These proceedings will summarize the experience with the different interconnection techniques and performance tests of MALTA modules with 2 and 4 chips tested in a cosmic muon telescope. They will also show first results on the effect of serial power tests on chip performance as well as the impact of the different interconnection techniques and the results of mechanical tests. Finally, a conceptual study for a flex based ultra-light weight monolithic pixel module based on the MALTA chip with minimum interconnections is presented. [ABSTRACT FROM AUTHOR]

The upgrade of the tracking detectors for the High Luminosity-LHC (HL-LHC) requires the development of novel radiation hard silicon sensors. The development of Depleted Monolithic Active Pixel Sensors targets the replacement of hybrid pixel detectors with radiation hard monolithic CMOS sensors. We designed, manufactured and tested radiation hard monolithic CMOS sensors in the TowerJazz 180 nm CMOS imaging technology with small electrodes pixel designs. These designs can achieve pixel pitches well below current hybrid pixel sensors (typically 50 × 50 μ m) for improved spatial resolution. Monolithic sensors in our design allow to reduce multiple scattering by thinning to a total silicon thickness of only 50 μ m. Furthermore monolithic CMOS sensors can substantially reduce detector costs. These well-known advantages of CMOS sensor for performance and costs can only be exploited in pp-collisions at HL-LHC if the DMAPS sensors are designed to be radiation hard, capable of high hit rates and have a fast signal response to satisfy the 25 ns bunch crossing structure of LHC. Through the development of the MALTA and Mini-MALTA sensors we show the necessary steps to achieve radiation hardness at 1 0 15 n e q /cm2 for DMAPS with small electrode designs. The sensors combine high granularity (pitch 36.4x 36. 4 μ m 2), low detector capacitance (< 5fF/pixel) of the charge collection electrode (3 μ m), low noise (ENC ≈ 10 e −) and low power operation (1 μ W/pixel) with a fast signal response (25 ns bunch crossing). The sensors feature arrays of 512 × 512 (MALTA) and 16 × 64 (Mini-MALTA) pixels. To cope with high hit rates expected at HL-LHC (> 200 MHz/cm2) we have implemented a novel high-speed asynchronous readout architecture. The paper summarises the optimisation of the pixel design to achieve radiation hard pixel designs with full efficiency after irradiation at > 98% after 1 0 15 n e q /cm2). [ABSTRACT FROM AUTHOR]