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Start Over Descriptor "*THREE-dimensional integrated circuits" Region taipei (taiwan)
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1. 3D progress seen at SiP global summit.

Author

Garrou, Phil

Subjects
*SUMMIT meetings, *THREE-dimensional integrated circuits, *FORUMS
Abstract

Information about the system-in-a-package (SiP) global summit held during the 2011 Semicon Taiwan in Taipei is presented. The summit consisted of the three-dimensional integrated circuit (3D IC) Test Forum, the 3D IC Technology Forum, and the Embedded Substrate Forum. It also featured several speakers from the industry including Takayuki Watanabe, Elpida Memory, and Victor Peng.

Published
2011

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