1. Unraveling the role played by a buried mud diapir: alternative model for 2016 Mw 6.4 MeiNong earthquake in southwestern Taiwan.
- Author
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Lin, Geng-Pei, Chang, Wu-Lung, and Chiu, Chi-Yu
- Subjects
EARTHQUAKES ,GRAVITY anomalies ,DIAPIRS ,MUDSTONE ,INDUCED seismicity - Abstract
Southwestern Taiwan exhibits multiple fold-thrust systems as a consequence of the interaction between the Philippine Sea Plate and the Eurasian Plate. A prominent geological feature of this region is the extensive layer of GuTingKeng mudstone, with a thickness of approximately 4 km, which serves as a source material for the formation of mud or shale diapirs. The 2016 Mw 6.4 Meinong earthquake, striking southwestern Taiwan at a depth of 15–20 km and inducing approximately 100 mm of uplift, has prompted investigations into the potential involvement of shallow structures (< 4 km) in this uplift. Recent studies have proposed that such shallow structures may have contributed significantly to the observed uplift during the earthquake. This study aims to elucidate the role of buried mud diapirs in the context of coseismic deformation. Here, we present a modeling approach that utilizes sill-like dislocations to simulate the deformation at the upper tip of the diapir. Our results indicate a vertical opening of approximately 60 mm at a depth of 1.4 km, which closely aligns with the spatial distribution of tomographic and gravity anomalies. We also examine how the coseismic stress changes induced by the Meinong earthquake can lead to a dilatational strain of about 1.2 microstrain within the shallow depth range of 0–4 km, resulting in extension within our modeled region. In contrast, the dilatational strain diminishes from 0.2 to − 1.2 microstrain at greater depths (4–8 km), implying compression in the subsurface beneath the diapir's top. This study discusses the potential mechanisms how fluid-rich and high-pressure mudstone may be deformed through coseismic process and how mud diapirs may contribute to additional deformation within the seismic cycle. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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