Search

We report microfabrication of high quality photonic structures such as two-dimensional photonic crystals and beam splitters from a high DNA load, photosensitive Ormocer nanocomposite. This nanocomposite combines the high dye loading capacity of DNA with the photopatternability and hardness of the Ormocer. The fabrication is performed with the two-photon lithography method. Detailed studies of the deoxyribonucleic acid distribution in the fabricated structures are conducted with Raman microscopy. We also demonstrate that the deoxyribonucleic acid based nanocomposite films cast on glass substrates are of high enough quality to support amplified spontaneous emission from dyes intercalated in the deoxyribonucleic acid.

The application of radial basis function (RBF) neural networks for fault classification and location in transmission lines is presented. Instantaneous current/voltage samples have been used as inputs to artificial neural networks (ANNs). Whereas, for fault classification, prefault and postfault samples of only the three-phase currents are sufficient, for fault location, postfault samples of both currents and voltages of the three phases are necessary. To validate the proposed approach simulation studies have been carried out on two simulated power-system models: one in which the transmission line is fed from one end and another, in which the transmission line is fed from both ends. The models are subjected to different types of faults at different operating conditions for variations in fault location, fault inception angle and fault point resistance. The results of the simulation studies which are presented confirm the feasibility of the proposed approach.

Department of Chemistry, Lucknow University, Lucknow-226 007 Manuscript received 10 March 1989, accepted 20 June 1989 2-Methyl-3-(4′-carbomethoxypheny1)-4-quinazolinone undergoes nucleophilic addition-elimination reactions with different Indolinones leading to 2-(3-methylene­substituted-oxindoly1)-3-(4′-carbomethoxypheny1)-4 quinazolinones (2a - e). Similarly, N-methylindolinones react with 2-methyl-3-(4′-carbomethoxypbenyI)-4-quinazolinone to give 2 -(3 - methylene- I - methyl-substituted - oxindoly I) - 3 -(4' - carbomethoxyphenyl) -4 quinazolinones (4a —e). Mannich reactions were performed on 2 with formaldehyde and morpholine/piperidine to give 2-(3-rnethylene-1-morpholf no fpiperidinomethyl­substituted-oxindoly1)-3-(4′-carhomethoxypheny1)-4-quInazollnones (3a — e). The com­pounds have been characterised by ir, nmr and mass spectral data.

Department of Chemistry. Lucknow University,Lucknow-226 007 Manuscript received 26 October 1988, accepted 9 March 1989 Addition-Elimination Reactions of 4- and 6-Chloroindolin-2,3-diones with Aromatic Amines

Department of Chemistry, Lucknow University, Lucknow-226 007 Manuscript received 10 March 1989, accepted 20 June 1989 2-Methyl-3-(4'-carbomethoxphenyl)-4-quinazolinone undergoes nucleophilic addition-elimination reactions with different lndolinones leading to 2-(3-methylene- substituted-oxindolyl)-3-(4'-carbomethoxyphenyl)-4-quinazolinones (2a- e), Similarly, N-methylindolinones react with 2-methyl-3-(4'-carbomethoxyphenyl)-4-quinazolinone to give 2- (3-methylene-1- methyl-substituted -oxindolyl)- 3 -( 4' - carbomethoxyphenyl)-4 quinazolinones (4a -e). Mannich reactions were performed on 2 with formaldehyde and morpholine/piperidine to give 2-(3-methylene-1-morpholino/piperidinomethyl· substituted-oxindolyl)-3-(4'-carbomethoxyphenyl)-4-quinazolinones (3a- e). The compouuds have been characterised by ir, nmr and mass spectral data.

This paper discusses the effect of wafer level packaging, silicon substrate, and board material on gigabit data transmission. A test vehicle consisting of a co-planar silicon transmission line, two board transmission lines and wafer level packaging was used for evaluation. A silicon substrate with 100 /spl Omega/-cm resistivity was compared with a silicon substrate with 2000 /spl Omega/-cm resistivity to investigate the effect of silicon substrate on gigabit data transmission. For board transmission lines, six board materials such as Ciba thin film, Vialux from Dupont, FR4, Hitachi MCL-LX67, Nelco N4000-12, and APPE were compared to investigate the effect of board material. For wafer-level packaging, solder bumps with 50 /spl mu/m diameter and 100 /spl mu/m pitch were used, and the effect of parasitic capacitance in the solder bumps on gigabit data transmission was investigated. For the accurate simulation of the test vehicle in the time domain, a TDR characterization method and non-physical RLGC models for lossy transmission lines were used to characterize board and silicon transmission lines. This paper shows that better signal integrity in the test vehicle cannot be achieved only by using lower loss material, but also requires low parasitic capacitance for gigabit data transmission.