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75 results on '"Elad, Danny"'

53. Room-temperature THz imaging based on antenna-coupled MOSFET bolometer

Author

Morf, Thomas, primary, Klein, Bernhard, additional, Despont, Michel, additional, Drechsler, Ute, additional, Kull, Lukas, additional, Corcos, Dan, additional, Elad, Danny, additional, Kaminski, Noam, additional, Braendli, Matthias, additional, Menolfi, Christian, additional, Kossel, Marcel, additional, Francese, Pier Andrea, additional, Toifl, Thomas, additional, and Plettemeier, Dirk, additional

Published
2013
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66. Broadcast-Enabled Massive Multicore Architectures: A Wireless RF Approach.

Author

Abadal, Sergi, Sheinman, Benny, Katz, Oded, Markish, Ofer, Elad, Danny, Fournier, Yvan, Roca, Damian, Hanzich, Mauricio, Houzeaux, Guillaume, Nemirovsky, Mario, Alarcon, Eduard, and Cabellos-Aparicio, Albert

Subjects
MULTICORE processors, RADIO frequency, COMPUTER architecture, MULTIPROCESSORS, COMPUTER algorithms
Abstract

Broadcast traditionally has been regarded as a prohibitive communication transaction in multiprocessor environments. Nowadays, such a constraint largely drives the design of architectures and algorithms all-pervasive in diverse computing domains, directly and indirectly leading to diminishing performance returns as the many-core era is approaching. Novel interconnect technologies could help revert this trend by offering, among others, improved broadcast support, even in large-scale chip multiprocessors. This article outlines the prospects of wireless on-chip communication technologies pointing toward low-latency (a few cycles) and energy-efficient broadcast (a few picojoules per bit). It also discusses the challenges and potential impact of adopting these technologies as key enablers of unconventional hardware architectures and algorithmic approaches, in the pathway of significantly improving the performance, energy efficiency, scalability, and programmability of many-core chips. [ABSTRACT FROM PUBLISHER]

Published
2015
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74. Design and Modeling Methodology of Vertical Interconnects for 3DI Applications.

Author

Gordin, Rachel, Goren, David, Shlafman, Shlomo, Elad, Danny, Scheuermann, Michael, Young, Albert, Liu, Fei, Gu, Xiaoxiong, and Tyberg, Christy

Subjects
INTEGRATED circuit design, INTEGRATED circuit interconnections, DISPERSION (Chemistry), THREE-dimensional integrated circuits, RADIO frequency, ELECTRIC capacity, NUMERICAL calculations
Abstract

This paper presents a design and modeling methodology of vertical interconnects for three-dimensional integration (3DI) applications. Compact semi-analytical wideband circuit level models have been developed based on explicit expressions. The pronounced frequency dependent silicon substrate induced dispersion and loss effects are considered, as well as skin and proximity effects. The models have been verified against numerical computations (full wave HFSS and quasi-static Q3D solvers). A dedicated test site has been designed for broadband characterization (from 1 MHz up to 110 GHz) of TSVs within a dense farm. [ABSTRACT FROM PUBLISHER]

Published
2011
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