457 results on '"Jalar, Azman"'
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52. Study of the side gate junctionless transistor in accumulation region
53. Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
54. Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel
55. INFLUENCE OF THERMOMECHANICAL PROCESSING ON MICROMECHANICAL PROPERTIES OF SN-0.7CU SOLDER ALLOY VIA NANOINDENTATION APPROACH
56. EVOLUTION OF DISCRETE SEMICONDUCTOR COPPER WEDGE BOND IN BIASED TEMPERATURE HUMIDITY CHAMBER
57. Voltage Bias Enhancement for Leakage Test on Discrete Products to Detect Low Contact
58. Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
59. Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
60. Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages
61. TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY
62. Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds
63. In-vitro bioactivity of wollastonite materials derived from limestone and silica sand
64. Low temperature production of wollastonite from limestone and silica sand through solid-state reaction
65. A wide-band UV photodiode based on n-ZnO/p-Si heterojunctions
66. Magnesium-Doped ZnO Nanorod Electrolyte–Insulator–Semiconductor (EIS) Sensor for Detecting Organic Solvents
67. Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
68. Effect of heat shield locations on rework- induced thermal management in ball grid array solder joint
69. Strength distribution of Au ball bond using nanoindentation approach
70. Structural and Optical Properties of a bi-Structured ZnO Film Prepared Via Electrodeposition
71. Nanosilicate Extraction from Rice Husk Ash as Green Corrosion Inhibitor
72. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging
73. Structural phase transformations in radiolytically synthesized Al–Cu bimetallic nanoparticles
74. Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package
75. Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach
76. Effect of Nd on Microstructure and Mechanical Properties of Mg-7gd-0.5zr Alloy
77. Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu
78. The Effect of Electrolytic Deflash Current on Delamination of Epoxy Mold Compound During Tin Plating Process
79. Elucidation of Metal Etching Defects Through the Experimental Design Process Characterization at Encapsulation and Electro-deflashing Processes
80. Synthesis and characterization of ZnO thin films by thermal evaporation
81. Effect of Applied Load in the Nanoindentation of Gold Ball Bonds
82. EFFECT OF GAMMA RADIATION ON MICROMECHANICAL BEHAVIOR OF SNPB SOLDER ALLOY
83. Incorporation of Big Data in Methodology of Identifying Corrosion Factors in the Semiconductor Package
84. The Effect of Blast Exposure Distance on Hardness and Reduced Modulus Properties of Lead-Free Solder
85. Effect of Gamma Radiation on Micromechanical Behaviour of SAC305 Solder
86. Some thoughts on bondability and strength of gold wire bonding
87. Microhardness and Tensile Properties of a 6XXX Alloy Through Minor Additions of Zr
88. Effect of Ultrasonic Bonding Parameters on the Contact Resistance and Bondability Performances of CIGS Thin Film Photovoltaic Solar Panel
89. Zinc Oxide Nanorod Electrolyte–Insulator– Semiconductor Sensor for Enhanced 2-Methoxyethanol Selectivity
90. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes
91. Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS)
92. Effect of Shock Wave on Constant Load Behaviour of Pb-Free/Cnt Solder Joint
93. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder.
94. Effect of wafer thinning methods towards fracture strength and topography of silicon die
95. The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
96. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
97. Effect of Blast Wave on Intermetallics Formation, Hardness and Reduced Modulus Properties of Solder Joints
98. Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining
99. Solderability of Coloured Lead Free Solder Composite
100. Dicing Laminated Wafer for QFN 3D Stacked Die Packaging
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