51. Hybrid-mode read-in integrated circuit for infrared scene projectors
- Author
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Hee Chul Lee, Min Ji Cho, and Uisub Shin
- Subjects
business.industry ,Infrared ,Computer science ,Dynamic range ,Resolution (electron density) ,02 engineering and technology ,Integrated circuit ,021001 nanoscience & nanotechnology ,01 natural sciences ,law.invention ,010309 optics ,Optics ,Projector ,law ,0103 physical sciences ,Electronic engineering ,0210 nano-technology ,business - Abstract
The infrared scene projector (IRSP) is a tool for evaluating infrared sensors by producing infrared images. Because sensor testing with IRSPs is safer than field testing, the usefulness of IRSPs is widely recognized at present. The important performance characteristics of IRSPs are the thermal resolution and the thermal dynamic range. However, due to an existing trade-off between these requirements, it is often difficult to find a workable balance between them. The conventional read-in integrated circuit (RIIC) can be classified into two types: voltage-mode and current-mode types. An IR emitter driven by a voltage-mode RIIC offers a fine thermal resolution. On the other hand, an emitter driven by the current-mode RIIC has the advantage of a wide thermal dynamic range. In order to provide various scenes, i.e., from highresolution scenes to high-temperature scenes, both of the aforementioned advantages are required. In this paper, a hybridmode RIIC which is selectively operated in two modes is proposed. The mode-selective characteristic of the proposed RIIC allows users to generate high-fidelity scenes regardless of the scene content. A prototype of the hybrid-mode RIIC was fabricated using a 0.18-μm 1-poly 6-metal CMOS process. The thermal range and the thermal resolution of the IR emitter driven by the proposed circuit were calculated based on measured data. The estimated thermal dynamic range of the current mode was from 261K to 790K, and the estimated thermal resolution of the voltage mode at 300K was 23 mK with a 12-bit gray-scale resolution.
- Published
- 2017
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