281 results on '"Tokei, Zsolt"'
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52. Interconnect reliability – A study of the effect of dimensional and porosity scaling
53. Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers
54. Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers
55. Beyond-Cu Intermediate-Length Interconnect Exploration for SRAM Application
56. Capacitance measurements and k-value extractions of low- k films
57. In situ X-ray diffraction study of self-forming barriers from a Cu–Mn alloy in 100 nm Cu/low- k damascene interconnects using synchrotron radiation
58. Reliability of copper low- k interconnects
59. Analysis and characterization of a mechanical sensor to monitor stress in interconnect features
60. Metal induced charge transfer doping in graphene-ruthenium hybrid interconnects
61. In-line metrology for vertical edge placement control of monolithic CFET using CD-SEM
62. Aluminide intermetallics for advanced interconnect metallization: thin film studies
63. Joule heating investigation for advanced interconnect schemes with airgaps
64. Nano-Ridge Bending during Conformal Ruthenium Metallization: Implications for Interconnect Fabrication
65. 11‐2: Technology Developments in High‐Resolution FMM‐free OLED and BEOL IGZO TFTs for Power‐Efficient Microdisplays
66. Electromigration limits of copper nano-interconnects
67. 28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV lithography
68. Enhancing interface doping in graphene-metal hybrid devices using H2 plasma clean
69. UV nanosecond laser annealing for Ru interconnects
70. On a more accurate assessment of scaled copper/low-k interconnects performance
71. Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling
72. (Invited) Sub-40mV Sigma VTH Igzo nFETs in 300mm Fab
73. Semidamascene Interconnects for 2nm node and Beyond
74. Characterization of interface interactions between Graphene and Ruthenium
75. Ru as an alternative material for advanced contacts
76. Thickness scaling of NiAl thin films for alternative interconnect metallization
77. Interconnect Design-Technology Co-Optimization for Sub-3nm Technology Nodes
78. 300mm IGZO nFETs with low-T Ru contacts for localized doping and increased BEOL compatibility
79. (Invited) Alternative Metals for Beyond-Cu Interconnects
80. Reaction temperature and time dependence of MoCl5 intercalation to few-layer graphene
81. Accurate Determination of Interlayer Resistivity of 2-D Layered Systems: Graphene Case Study
82. Electrochemical Deposition of Manganese and Copper-Manganese Alloy on Silicon
83. Study of Ni-Silicide Contacts to Si:C Source/Drain.
84. Electromigration Activation Energies in Alternative Metal Interconnects
85. Lateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure
86. Reconfigurable neuromorphic synapse interconnects with TFTs
87. High quality NH2SAM (self assembled monolayer) diffusion barrier for advanced copper interconnects
88. RC Benefits of Advanced Metallization Options
89. Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch
90. Reaction temperature and time dependence of MoCl5 intercalation to few-layer graphene.
91. Modeling of Edge Scattering in Graphene Interconnects
92. Subtractive Etch of Ruthenium for Sub-5nm Interconnect
93. Alternative Metals: From AB Initio Screening to Calibrated Narrow Line Models
94. Graphene Interconnects - High Performance Twisted 20 nm Graphene Ribbons
95. High-Aspect-Ratio Ruthenium Lines for Buried Power Rail
96. Boosting Carrier Mobility of Synthetic Few Layer Graphene on SiO2 by Interlayer Rotation and Decoupling
97. Sub-100 nm2 Cobalt Interconnects
98. Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
99. The first observation of p-type electromigration failure in full ruthenium interconnects
100. Patterning challenges in 193i-based tip to tip in N5 interconnects
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