283 results on '"Wang, Tongqing"'
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52. Thickness Measurement Based on Eddy Current Sensor With Coaxial Double Coil for Chemical Mechanical Polishing
53. The Role of Diethanolamine on Chemical Mechanical Polishing in Alkaline Glycine-Based Slurries for Cobalt Interconnects
54. Association between the cytotoxic T-lymphocyte antigen 4 +49A/G polymorphism and bladder cancer risk
55. Synthesis of CeO2Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
56. An Analysis on the Construction of Large-scale Dynamic Changing Model of Discrete Time Variable Gravity from GRACE
57. Additional file 1 of LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA
58. Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process
59. Effect of slurry injection position on material removal in chemical mechanical planarization
60. Integrated Silicon Photonics Transmitter in 400GBASE-DR4 QSFP-DD Transceiver
61. Erratum: Galvanic corrosion inhibitors for Cu/Ru couple during chemical mechanical polishing of Ru [ ECS J. Solid-State Sci. Technol., 7, P62 (2017)]
62. Size-reduction and band-broadening design technique of uniplanar hybrid ring coupler using phase inverter for M(H)MIC's
63. Solution of a sound field generated by the vibrating surface of a body moving at small Mach number
64. Spectral-domain analysis of radiating cylindrical dielectric resonator for wireless communications
65. An efficient approach to modeling of quasi-planar structures using the formulation of power conservation in spectral domain
66. Effects of various suspended mounting schemes on mode characteristics of coupled slotlines considering conductor thickness for wideband MIC applications
67. Mechanism of GaN CMP Based on H2O2Slurry Combined with UV Light
68. Expression of IL-23R and IL-17 and the pathology and prognosis of urinary bladder carcinoma
69. Micro-galvanic corrosion of Cu/Ru couple in potassium periodate (KIO 4 ) solution
70. A Motif-based Mission Planning Method for UAV Swarms Considering Dynamic Reconfiguration
71. Role of the Adhesion Force during Copper Chemical Mechanical Planarization
72. Chemical Mechanical Polishing of Inlaid Copper Structures with Ru/Ta/TaN as Barrier/Liner Layer
73. Junction and Evolution of the Qinling, Qilian and Kunlun Orogenic Belts
74. Research of Low Signal-to-Noise Ratio Crack Noise Reduction Based on Kernel Anisotropic Diffusion
75. Reversible data hiding scheme based on significant‐bit‐difference expansion
76. A theoretical model incorporating both the nano-scale material removal and wafer global uniformity during planarization process
77. Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS
78. Effect of α-receptor blockers on lower urinary tract symptoms, sexual function and quality of life in young and middle-aged men with benign prostatic hyperplasia
79. Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process
80. A frequency-response-based method of sound velocity measurement in an impedance tube
81. Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru
82. Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS
83. Supplementary material to "Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS"
84. Effects of catalyst concentration and ultraviolet intensity on chemical mechanical polishing of GaN
85. In-situ Cu layer thickness measurement during chemical mechanical planarization
86. Effect of photocatalytic oxidation technology on GaN CMP
87. Learning a Similarity Constrained Discriminative Kernel Dictionary from Concatenated Low-Rank Features for Action Recognition
88. Surface characteristics of ruthenium in periodate-based slurry during chemical mechanical polishing
89. Kinematic analysis of in situ measurement during chemical mechanical planarization process
90. Statistics on Temporal Changes of Sparse Coding Coefficients in Spatial Pyramids for Human Action Recognition
91. Mechanism of GaN CMP Based on H2O2Slurry Combined with UV Light
92. ISOLAN facility and its research program
93. Ruthenium and Copper CMP in periodate-based slurry with BTA and K2MoO4 as compound corrosion inhibitors
94. Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO 4 -based slurry
95. Removal of Copper and Lead from Aqueous Solution by Adsorption onto Cross-Linked Chitosan/Montmorillonite Nanocomposites in the Presence of Hydroxyl–Aluminum Oligomeric Cations: Equilibrium, Kinetic, and Thermodynamic Studies
96. Piezocomposite SmartFoam for Active Control of Underwater Noise
97. A status report of the ISOL facility in Lanzhou
98. Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru.
99. Image Dimensionality Reduction Based on the Intrinsic Dimension and Parallel Genetic Algorithm
100. Augmenting bag-of-words: a robust contextual representation of spatiotemporal interest points for action recognition
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