51. Preparation of high-performance multilayer circuits by controlling the diffusion of Ag in borosilicate glass-ceramics through the addition of SiO2.
- Author
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Fang, Jun, Chen, Tianhong, Fu, Renli, Bei, Guoping, Ge, Jinlong, Jiao, Yuhong, Dong, Sirui, Li, Guojun, and Li, Zhanyuan
- Subjects
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SANDWICH construction (Materials) , *CERAMICS , *THICK films , *DIELECTRIC strength , *AUTOMOTIVE electronics , *BOROSILICATES - Abstract
Due to its superior reliability and performance, thick film technology is extensively employed in various applications, including automotive electronics, consumer electronics, communication engineering, and aerospace. However, a challenge arises from the mutual diffusion during the electronic paste production process, which leads to a decline in insulation performance and hinders the production of three-dimensional equipment. Inspired by the principles of low-temperature co-fired ceramic technology, a multi-layered ceramic structure has been successfully bonded using thick film technology by introducing a borosilicate glass-ceramics layer. To further enhance the properties of this multi-layered ceramic structure, approximately 8 wt% SiO 2 was incorporated into the borosilicate glass-ceramics. This addition effectively inhibits silver diffusion and reduces the diffusion depth within the glass-ceramic film. The key mechanisms behind this improvement are the increased activation energy for crystallization, resulting in a slower crystallization rate due to the addition of SiO 2. Moreover, the multi-layered ceramic with a sandwich structure exhibits remarkable properties. Notably, the dielectric strength of this system has been significantly enhanced to 13.9 kV/mm, accompanied by a high adhesion strength of 790 N. These enhanced properties of the optimized system indicate promising characteristics for multi-layer circuit applications. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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