1,095 results on '"Lee, Hyuck"'
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102. In Silico High-Throughput Screening of Ag-Based Electrocatalysts for Anion-Exchange Membrane Fuel Cells
103. Front Cover: Controlled Removal of Surfactants from Double‐Walled Carbon Nanotubes for Stronger p‐Doping Effect and Its Demonstration in Perovskite Solar Cells (Small Methods 6/2021)
104. Multidimensional Ti3C2Tx MXene Architectures via Interfacial Electrochemical Self-Assembly
105. Development of Sports Ethics Consciousness Scale for Preventing Fixing Game
106. Causal model among experience of irrational gambling belief inherent in illegal sports betting, gambling addiction, deviant behavior, and school life -Focusing on youth
107. Rediscovery of Bicycle City Policy: Sociological Meaning of Public Bicycle Project
108. Wettability and interfacial reactions of Sn-based Pb-free solders with Cu– xZn alloy under bump metallurgies
109. Vancomycin-resistant Enterococcus colonization in the intensive care unit: Clinical outcomes and attributable costs of hospitalization
110. The Analysis of the Public Sports Club’s Hierarchic Value Map for the Organization of Character Images Related to Studying Student Athletes: Focusing on Means-End Chain Theory
111. Structural Effectiveness of AgCl-decorated Ag Nanowires Enhancing Oxygen Reduction
112. Hetero-Dimensional 2D Ti3C2Tx MXene and 1D Graphene Nanoribbon Hybrids for Machine Learning-Assisted Pressure Sensors
113. Aconitine Neurotoxicity According to Administration Methods
114. Mechanistic Approaches for Chemically Modifying the Coordination Sphere of Copper–Amyloid-β Complexes
115. Controlled Removal of Surfactants from Double‐Walled Carbon Nanotubes for Stronger p‐Doping Effect and Its Demonstration in Perovskite Solar Cells
116. Improvement plan for bicycle friendly city development project utilizing IPA technique
117. Biodegradable Molybdenum/Polybutylene Adipate Terephthalate Conductive Paste for Flexible and Stretchable Transient Electronics
118. Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders
119. Is adjunctive corticosteroid beneficial in pneumococcal meningitis in a region with high rates of resistance to penicillin and ceftriaxone?
120. Synthesis and characterization of highly conductive Sn–Ag bimetallic nanoparticles for printed electronics
121. A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics
122. Denatured M13 Bacteriophage-Templated Perovskite Solar Cells Exhibiting High Efficiency
123. Phase stability of Pt nanoclusters and the effect of a (0 0 0 1) graphite surface through molecular dynamics simulation
124. Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C
125. Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints
126. Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
127. The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy
128. Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging
129. Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate
130. An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
131. Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
132. Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM
133. Undercooling and microhardness of Pb-free solders on various under bump metallurgies
134. Atomically ordered Pt3Mn intermetallic electrocatalysts for the oxygen reduction reaction in fuel cells.
135. Reducing Time to Discovery: Materials and Molecular Modeling, Imaging, Informatics, and Integration
136. Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
137. The Reflective Study on Dropouts of Professional Golf Trainees
138. Fluoroquinolone Can Be an Effective Treatment Option for Acute Pyelonephritis When the Minimum Inhibitory Concentration of Levofloxacin for the Causative Escherichia coli Is ≤16 mg/L
139. Impact of sphingosine and acetylsphingosines on the aggregation and toxicity of metal-free and metal-treated amyloid-β
140. Machine Learning Assisted Synthesis of Lithium-Ion Batteries Cathode Materials
141. Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System
142. Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging
143. Target Enzymes Considered for the Treatment of Alzheimer’s Disease and Parkinson’s Disease
144. Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering
145. Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging
146. Finite-element method study for the spin-polarized transport in a hybrid spin valve
147. Ag2S-CoS hetero-nanowires terminated with stepped surfaces for improved oxygen evolution reaction
148. Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging
149. Data-Driven Synthesis Optimization of Cathode Materials
150. Semi-Supervised Multi-Label Learning for Classification of Wafer Bin Maps With Mixed-Type Defect Patterns
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