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101. Application of bimaterial interface corner failure mechanics to silicon/glass anodic bonds

102. Application of microforging to SiCN MEMS fabrication

103. Fabrication of SiCN MEMS by photopolymerization of pre-ceramic polymer

104. Shape forming by thermal expansion mismatch and shape memory locking in polymer/elastomer laminates

105. Variational bounds for the effective moduli of heterogeneous piezoelectric solids

106. Viscoelectroelastic behavior of heterogeneous piezoelectric solids

107. Fabrication of SiCN ceramic MEMS using injectable polymer-precursor technique

108. Fracture initiation at three-dimensional bimaterial interface corners

109. [Untitled]

110. Elastic constants of mullite containing alumina platelets

111. On ultrasonic guided waves in a thin anisotropic layer lying between two isotropic layers

112. Equivalence of Eshelby inclusion theory and Wechsler–Lieberman–Read, Bowles–Mackenzie martensite-crystallography theories

113. Micromechanically-based acoustic characterization of the fiber orientation distribution function of morphologically textured short-fiber composites: prediction of thermomechanical and physical properties

114. Elastic properties of a unidirectional SiCf/Ti composite: Acoustic-resonance measurements and micromechanics predictions

115. Initiation toughness of silicon/glass anodic bonds

116. Habit planes, inclusion theory, and twins

117. Thermoelectroelastic moduli of textured piezoelectric polycrystals: Exact solutions and bounds for film textures

118. Half-Space Green’s Functions for Transversely Isotropic Piezoelectric Solids

119. Elastic constants and internal friction of an SiC-fiber-reinforced Ti-alloy-matrix crossply composite: measurement and theory

120. Analysis of microstructural fields in heterogeneous piezoelectric solids

121. Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures

122. Stress intensities at interface corners in anisotropic bimaterials

123. Thermal expansion of morphologically textured short-fiber composites

124. Calculation of stress intensities at sharp notches in anisotropic media

125. Micromechanics of Magnetoelectroelastic Composite Materials: Average Fields and Effective Behavior

127. Anisotropic coupled-field inclusion and inhomogeneity problems

128. One-Dimensional Composite Micromechanics

129. Inclusions and inhomogeneities in transversely isotropic piezoelectric solids

130. Elastic-plastic behavior of textured short-fiber composites

131. Stress intensity factors for cracked I-beams

132. [Untitled]

133. Graphene blisters with switchable shapes controlled by pressure and adhesion

134. Large arrays and properties of 3-terminal graphene nanoelectromechanical switches

135. Green's functions for transversely isotropic piezoelectric solids

136. Elastic constants of textured short-fiber composites

137. Free vibrations of LiNbO3 piezoelectric crystals

138. Estimation of the orientation distribution of short‐fiber composites using ultrasonic velocities

139. Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines

140. Internal stress storage in shape memory polymer nanocomposites

141. Reversible Shape Memory Polymers and Composites: Synthesis, Modeling and Design

142. Mechanics of Adhered, Pressurized Graphene Blisters

143. Elastic Moduli of Composites Reinforced by Multiphase Particles

144. Viscoelastic damping of particle and fiber reinforced composite materials

145. Poisson's ratio of porous and microcracked solids: Theory and application to oxide superconductors

146. Elastic Properties of Particle-Occlusion Composites: Measurements and Modeling

147. Effects of grain shape anisotropy, porosity, and microcracks on the elastic and dielectric constants of polycrystalline piezoelectric ceramics

148. Thermal expansion of textured polycrystalline aggregates

149. Experimental Study of the Fracture Toughness of a Ceramic/Ceramic-Matrix Composite Sandwich Structure

150. A Theoretical Framework for the Analysis of Thermoelectroelastic Heterogeneous Media with Applications

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