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1,503 results on '"Semiconductor chips -- Technology application"'

151. Swift Navigation's Precise Positioning Solution with STMicroelectronics Teseo V Delivers Centimeter-Level Accurate Location Precision

Subjects
STMicroelectronics N.V. -- Technology application, Semiconductor industry -- Technology application, Artificial satellites -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Satellite communications -- Technology application, Semiconductor industry, Standard IC, Technology application, Satellite communications, Telecommunications industry
Abstract

(GlobeNewswire) - Swift Navigation, a San Francisco-based tech firm redefining GNSS (Global Navigation Satellite System) and precise positioning technology for autonomous vehicles, automotive, mobile and mass-market applications, today announced its [...]

Published
2021

152. Swift Navigation's Precise Positioning Solution with STMicroelectronics Teseo V Delivers Centimeter-Level Accurate Location Precision

Subjects
STMicroelectronics N.V. -- Technology application, Semiconductor industry -- Technology application, Artificial satellites -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Satellite communications -- Technology application, Semiconductor industry, Standard IC, Technology application, Satellite communications, Banking, finance and accounting industries, Business
Abstract

SAN FRANCISCO, Nov 30, 2021 (GLOBE NEWSWIRE via COMTEX) -- Swift Navigation, a San Francisco-based tech firm redefining GNSS (Global Navigation Satellite System) and precise positioning technology for autonomous vehicles, [...]

Published
2021

153. New Allegro LED Drivers Bring High-End Lighting Technology to Mainstream Vehicles, Enhancing Automotive Safety

Subjects
Allegro MicroSystems Inc. -- Technology application, Light-emitting diodes -- Technology application, Semiconductor industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Semiconductor industry, Standard IC, Technology application, Banking, finance and accounting industries, Business
Abstract

Manchester, NH, Nov 03, 2021 (GLOBE NEWSWIRE via COMTEX) -- Allegro MicroSystems, Inc. ('Allegro') (Nasdaq: ALGM), a global leader in sensing and power solutions for motion control and energy-efficient systems, [...]

Published
2021

154. Ligase detection reaction generation of reverse molecular beacons for near real-time analysis of bacterial pathogens using single-pair fluorescence resonance energy transfer and a cyclic olefin copolymer microfluidic chip

Author

Peng, Zhiyong, Soper, Steven A., Pingle, Maneesh R., Barany, Francis, and Davis, Lloyd M.

Subjects
Microfluidics -- Research, Integrated circuits -- Usage, Integrated circuits -- Composition, Integrated circuits -- Technology application, Semiconductor chips -- Usage, Semiconductor chips -- Composition, Semiconductor chips -- Technology application, Ligases -- Chemical properties, Pathogenic microorganisms -- Chemical properties, Fluorescence -- Research, Resonance -- Research, Energy transformation -- Research, Olefins -- Usage, Standard IC, Technology application, Chemistry
Abstract

Detection of pathogenic bacteria and viruses require strategies that can signal the presence of these targets in near real-time due to the potential threats created by rapid dissemination into water and/or food supplies. In this paper, we report an innovative strategy that can rapidly detect bacterial pathogens using reporter sequences found in their genome without requiring polymerase chain reaction (PCR). A pair of strain-specific primers was designed based on the 16S rRNA gene and were end-labeled with a donor (Cy5) or acceptor (Cy5.5) dye. In the presence of the target bacterium, the primers were joined using a ligase detection reaction (LDR) only when the primers were completely complementary to the target sequence to form a reverse molecular beacon (rMB), thus bringing Cy5 (donor) and Cy5.5 (acceptor) into close proximity to allow fluorescence resonance energy transfer (FRET) to occur. These rMBs were subsequently analyzed using single-molecule detection of the FRET pairs (single-pair FRET; spFRET). The LDR was performed using a continuous flow thermal cycling process configured in a cyclic olefin copolymer (COC) microfluidic device using either 2 or 20 thermal cycles. Single-molecule photon bursts from the resulting rMBs were detected on-chip and registered using a simple laser-induced fluorescence (LIF) instrument. The spFRET signatures from the target pathogens were reported in as little as 2.6 min using spFRET. 10.1021/ac101843n

Published
2010

155. Geometrical characteristics and damage morphology of nodules grown from artificial seeds in multilayer coating

Author

Shan, Yongguang, He, Hongbo, Wei, Chaoyang, Li, Shuhong, Zhou, Ming, Li, Dawei, and Zhao, Yuan'an

Subjects
Semiconductor chips -- Materials, Semiconductor chips -- Atomic properties, Semiconductor chips -- Technology application, Semiconductor chips -- Testing, Nanoparticles -- Usage, Gold -- Atomic properties, Dynamic testing -- Methods, Dynamic testing -- Technology application, Integrated circuits -- Materials, Integrated circuits -- Atomic properties, Integrated circuits -- Technology application, Integrated circuits -- Testing, Technology application, Standard IC, Astronomy, Physics
Abstract

Nodules have been planted in an Hf[O,sub.2]/Si[O.sub.2] multilayer system with absorptive gold nanoparticle seeds located on the surface of a substrate. The topography of nodules was scanned by ah atomic force microscope and imaged by a scanning electron microscope. The underlying characteristics of nodules were revealed by a focused ion beam. The cross-sectional profiles reveal that nodules grown from small seeds have a continuous boundary and better mechanical stability. A laser-induced damage test shows that nodules decrease the laser-induced damage threshold by up to 3 times. The damage pits are exclusively caused by nodular ejection and triggered by the absorptive seeds. The distribution of electric field and average temperature rise in the nodules were analyzed. Theoretical results met experimental results very well. The strong absorptive seed and microlens effect of the nodule play important roles in laser-induced damage of a planted nodule. OCIS codes: 140.3440, 310.6870.

Published
2010

156. Nanoliter multiplex PCR arrays on a SlipChip

Author

Shen, Feng, Du, Wenbin, Davydova, Elena K., Karymov, Mikhail A., Pandey, Janmajay, and Ismagilov, Rustem F.

Subjects
Nanotechnology -- Research, Polymerase chain reaction -- Research, Integrated circuits -- Usage, Integrated circuits -- Technology application, Semiconductor chips -- Usage, Semiconductor chips -- Technology application, Standard IC, Technology application, Chemistry
Abstract

The SlipChip platform was tested to perform high-throughput nanoliter multiplex PCR. The advantages of using the SlipChip platform for multiplex PCR include the ability to preload arrays of dry primers, instrument-free sample manipulation, small sample volume, and highthroughput capacity. The SlipChip was designed to preload one primer pair per reaction compartment and to screen up to 384 different primer pairs with less than 30 nanoliters of sample per reaction compartment. Both a 40-well and a 384-well design of the SlipChip were tested for multiplex PCR. In the geometries used here, the sample fluid was spontaneously compartmentalized into discrete volumes even before slipping of the two plates of the SlipChip, but slipping introduced additional capabilities that made devices more robust and versatile. The wells of this SlipChip were designed to overcome potential problems associated with thermal expansion. By using circular wells filled with oil and overlapping them with square wells filled with the aqueous PCR mixture, a droplet of aqueous PCR mixture was always surrounded by the lubricating fluid. In this design, during heating and thermal expansion, only oil was expelled from the compartment and leaking of the aqueous solution was prevented. Both 40-well and 384-well devices were found to be free from cross-contamination, and end point fluorescence detection provided reliable readout. Multiple samples could also be screened on the same SlipChip simultaneously. Multiplex PCR was validated on the 384-well SlipChip with 20 different primer pairs to identify 16 bacterial and fungal species commonly presented in blood infections. The SlipChip correctly identified five different bacterial or fungal species in separate experiments. In addition, the presence of the resistance gene mecA in methicillin resistant Staphylococcus aureus (MRSA) was identified. The SlipChip will be useful for applications involving PCR arrays and lays the foundation for new strategies for diagnostics, point-of-care devices, and immobilization-based arrays. 10.1021/ac1007249

Published
2010

157. Enrichment and detection of Escherichia coli O157:H7 from water samples using an antibody modified microfluidic chip

Author

Dharmasiri, Udara, Witek, Malgorzata A., Adams, Andre A., Osiri, John K., Hupert, Mateusz L., Bianchi, Thomas S., Roelke, Daniel L., and Soper, Steven A.

Subjects
Microfluidics -- Research, Escherichia coli -- Chemical properties, Escherichia coli -- Identification and classification, Water quality -- Analysis, Antibodies -- Usage, Viral antibodies -- Usage, Integrated circuits -- Usage, Integrated circuits -- Technology application, Semiconductor chips -- Usage, Semiconductor chips -- Technology application, Standard IC, Technology application, Chemistry
Abstract

Low abundant (< 100 cells [mL.sup.-1]) E. coli O157:H7 cells were isolated and enriched from environmental water samples using a microfluidic chip. The poly(methylmethacrylate), PMMA, chip contained 8 devices, each equipped with 16 curvilinear high aspect ratio channels that were covalently decorated with polyclonal anti-O157 antibodies (pAb) and could search for rare ceils through a pAb mediated process. The chip could process independently 8 different samples or one sample using 8 different parallel inputs to increase volume processing throughput. After cell enrichment, cells were released and enumerated using benchtop real-time quantitative polymerase chain reaction (PCR), targeting genes which effectively discriminated the O157:H7 serotype from other nonpathogenic bacteria. The recovery of target cells from water samples was determined to be ~72%, and the limit-of-detection was found to be 6 colony forming units (cfu) using the slt1 gene as a reporter. We subsequently performed analysis of lake and wastewater samples. The simplicity in manufacturing and ease of operation makes this device attractive for the selection of pathogenic species from a variety of water supplies suspected of containing bacterial pathogens at extremely low frequencies. 10.1021/ac100323k

Published
2010

158. Toshiba Shrinks Quantum Key Distribution Tech to a Semiconductor Chip

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Cryptography -- Technology application, Standard IC, Technology application, General interest, News, opinion and commentary
Abstract

CAMBRIDGE: Toshiba Europe Ltd announced it has developed the world's first chip-based quantum key distribution (QKD) system. This advance will enable the mass manufacture of quantum security technology, bringing its [...]

Published
2021

159. Toshiba Shrinks Quantum Key Distribution Technology to a Semiconductor Chip

Subjects
Toshiba Corp. -- Technology application, Communications equipment -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Electronics industry -- Technology application, Integrated circuit fabrication -- Technology application, Cellular transmission equipment, Standard IC, Integrated circuit fabrication, Telecommunications equipment, Technology application, Electronics industry, Business, Business, international
Abstract

* Toshiba develops world's first QKD system based on quantum transmitter, receiver and random number generator chips. * Quantum chips manufactured using standard semiconductor processes. * Significant advance towards mass [...]

Published
2021

160. AI-chips: The new mobility-chops

Subjects
NVIDIA Corp. -- Technology application, Artificial intelligence -- Technology application, Semiconductor industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Semiconductor industry, Standard IC, Artificial intelligence, Technology application, Mass communications
Abstract

Byline: Pratima Harigunani We know what AI is synonymous with. Here is how its core advantage of speeding up a process and adding precision to it translates into the realm [...]

Published
2021

161. GBT is Developing an EDA Technology For Automatic Generation of Integrated Circuits Layout IPs

Subjects
Intellectual property -- Technology application, Integrated circuits -- Technology application, Circuit components -- Technology application, Semiconductor chips -- Technology application, Embedded systems -- Technology application, Electronic design automation -- Technology application, Standard IC, Semiconductor device, Embedded system, System on a chip, Electronic design automation, Technology application, Intellectual property, Banking, finance and accounting industries, Business
Abstract

SAN DIEGO, Sep 28, 2021 (GLOBE NEWSWIRE via COMTEX) -- GBT Technologies Inc. (OTC PINK: GTCH) ('GBT' or the 'Company'), is developing EDA (Electronic Design Automation) software technology to automate [...]

Published
2021

162. NeoPhotonics Announced Tunable, High Power FMCW Laser and Semiconductor Optical Amplifier for Coherent Lidar in Autonomous Vehicle and Industrial Sensing Applications

Subjects
NeoPhotonics Corp. -- Technology application, Remote sensing -- Technology application, Optical radar -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Driverless cars -- Technology application, Frequency modulation -- Technology application, Standard IC, Technology application, General interest, News, opinion and commentary
Abstract

SAN JOSE: NeoPhotonics Corporation (NYSE: NPTN), a leading developer of silicon photonics and advanced hybrid photonic integrated circuit-based lasers, modules and subsystems for bandwidth-intensive, high speed communications networks, today announced [...]

Published
2021

163. Zero-Spin Silicon via Laser Isotope Separation for Quantum Computer Chips

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Silicon -- Technology application, Standard IC, Technology application, Business, international
Abstract

Scope A current major limitation to the development of silicon Quantum Computing (QC) is ensuring supply of essential materials, such as isotopically enriched silicon, where current world commercial supply is [...]

Published
2021

164. Vivo brings new imaging chip V1

Subjects
High technology industry -- Technology application, Executives -- Technology application, Integrated circuits -- Technology application, Image processing -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Telecommunications industry
Abstract

Global technology company Vivo unveiled its new imaging chip V1 last week in China's Shenzhen. Hu Baishan, executive vice-president and COO of the company, said: 'V1 is a fully-customised integrated [...]

Published
2021

165. Vivo brings new imaging chip V1

Subjects
High technology industry -- Technology application, Executives -- Technology application, Integrated circuits -- Technology application, Image processing -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Business, international, Law
Abstract

Global technology company Vivo unveiled its new imaging chip V1 last week in China's Shenzhen. Hu Baishan, executive vice-president and COO of the company, said: 'V1 is a fully-customised integrated [...]

Published
2021

166. eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, General interest, News, opinion and commentary
Abstract

SAN JOSE: Diakopto has issued the following news release: Diakopto announced today that eTopus, a pioneer of ultra-high speed ADC/DSP-based SerDes for wireline applications, has chosen the ParagonX platform and [...]

Published
2021

167. AGM Group Holdings Inc. Announces Strategy of its Blockchain Business with Bitcoin Miner Production and High-performance Chip Solutions As Core Development

Subjects
High technology industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Telecommunications industry
Abstract

AGM Group Holdings Inc. ('AGMH' or the 'Company') (NASDAQ: AGMH), an integrated technology company focusing on blockchain-oriented ASIC chip design, advanced crypto miner production, and fintech software service, today announced [...]

Published
2021

168. AGM Group Holdings Inc. Announces Strategy of its Blockchain Business with Bitcoin Miner Production and High-performance Chip Solutions As Core Development

Subjects
High technology industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Business, international, Law
Abstract

AGM Group Holdings Inc. ('AGMH' or the 'Company') (NASDAQ: AGMH), an integrated technology company focusing on blockchain-oriented ASIC chip design, advanced crypto miner production, and fintech software service, today announced [...]

Published
2021

169. eTopus Selects Diakopto's ParagonX(TM) Platform for Ultra-High Speed SerDes IP

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Business, News, opinion and commentary
Abstract

Breakthrough Software and Methodology Enables Fast and Insightful IC Design Debugging and Optimization SAN JOSE Calif., Aug. 24, 2021 /PRNewswire/ -- Diakopto announced today that eTopus, a pioneer of ultra-high [...]

Published
2021

170. AGM Group Holdings Inc. Announces Strategy of its Blockchain Business with Bitcoin Miner Production and High-performance Chip Solutions As Core Development

Subjects
High technology industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Business, News, opinion and commentary
Abstract

BEIJING, Aug. 24, 2021 /PRNewswire/ -- AGM Group Holdings Inc. ('AGMH' or the 'Company') (NASDAQ: AGMH), an integrated technology company focusing on blockchain-oriented ASIC chip design, advanced crypto miner production, [...]

Published
2021

171. Microchip Introduces new Chip Scale Atomic Clocks

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Telecommunications industry
Abstract

Advanced military platforms, ocean-bottom survey systems and remote sensing applications all require precise timing for mission success. Chip Scale Atomic Clocks (CSACs) ensure stable and accurate timing even when Global [...]

Published
2021

172. Microchip Introduces new Chip Scale Atomic Clocks

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Business, international, Law
Abstract

Advanced military platforms, ocean-bottom survey systems and remote sensing applications all require precise timing for mission success. Chip Scale Atomic Clocks (CSACs) ensure stable and accurate timing even when Global [...]

Published
2021

173. A new algorithm for the analysis of the MCUs sensitiveness of TMR architectures in SRAM-based FPGAs

Author

Sterpone, Luca and Violante, Massimo

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Digital integrated circuits -- Usage, Digital integrated circuits -- Analysis, Standard IC, Programmable logic array, Technology application, Business, Electronics, Electronics and electrical industries
Abstract

In this paper we present an analytical analysis of the fault masking capabilities of triple modular redundancy (TMR) hardening techniques in the presence of multiple cell upsets (MCUs) in the configuration memory of SRAM-based field-programmable gate arrays (FPGAs). The analytical method we developed allows an accurate study of the MCUs provoking domain crossing errors that defeat TMR. From our analysis we have found that most of the failures affect configurable logic block's routing resources. The experimental analysis has been performed on two realistic case study circuits. Experimental results are presented and discussed showing in particular that 2-bits MCUs may corrupt TMR 2.6 orders of magnitude more than single cell upsets (SCUs). Index Terms--Analytical analysis, field-programmable gate array (FPGA), multiple cell upset, triple modular redundancy (TMR).

Published
2008

175. Boosting debugging support for complex systems on chip

Author

Mayer, Albrecht, Siebert, Harry, and McDonald-Maier, Klaus D.

Subjects
Embedded system, System on a chip, Standard IC, Technology application, Debugging -- Usage, Embedded systems -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application
Published
2007

176. SeaStar interconnect: balanced bandwidth for scalable performance

Author

Brightwell, Ron, Pedretti, Kevin T., Underwood, Keith D., and Hudson, Trammell

Subjects
Standard IC, Technology application, Integrated circuits -- Usage, Integrated circuits -- Technology application, Semiconductor chips -- Usage, Semiconductor chips -- Technology application
Published
2006

177. Researchers at National Institute of Technology Raipur Release New Data on Biosensors (Hetero Channel Double Gate Mosfet for Label-free Biosensing Application)

Subjects
Medical equipment -- Technology application, Biosensors -- Technology application, Metal oxide semiconductor field effect transistors -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Physiological apparatus -- Technology application, Standard IC, Technology application, Biotechnology industry, Pharmaceuticals and cosmetics industries
Abstract

2022 FEB 2 (NewsRx) -- By a News Reporter-Staff News Editor at Biotech Week -- Current study results on Biosensors have been published. According to news reporting originating from Chhattisgarh, [...]

Published
2022

178. Drivers have more than 200 used vehicles to explore at Baierl Toyota

Subjects
Integrated circuits -- Technology application, Video games -- Equipment and supplies, Semiconductor chips -- Technology application, Automobile drivers -- Technology application, Automotive dealers -- Technology application, Used cars -- Technology application, Standard IC, Technology application, Mobile gaming, Business, international, Law
Abstract

(PRWeb) - Since the beginning of the COVID-19 outbreak, drivers searching for a vehicle in the Butler County, Pennsylvania, area may have a difficult time finding their ideal vehicle due [...]

Published
2021

179. Drivers have more than 200 used vehicles to explore at Baierl Toyota

Subjects
Integrated circuits -- Technology application, Video games -- Equipment and supplies, Semiconductor chips -- Technology application, Automobile drivers -- Technology application, Automotive dealers -- Technology application, Used cars -- Technology application, Standard IC, Technology application, Mobile gaming, Business, general
Abstract

MARS, Pa. (PRWEB) July 30, 2021 Since the beginning of the COVID-19 outbreak, drivers searching for a vehicle in the Butler County, Pennsylvania, area may have a difficult time finding [...]

Published
2021

180. NEW CHEMISTRY ENABLES USING EXISTING TECHNOLOGY TO PRINT STRETCHABLE, BENDABLE CIRCUITS ON ARTIFICIAL SKIN

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Skin -- Technology application, Standard IC, Technology application, News, opinion and commentary, Stanford University -- Technology application
Abstract

STANFORD, Calif. -- The following information was released by Stanford University: Stanford researchers show how to print dense transistor arrays on skin-like materials to create stretchable circuits that flex with [...]

Published
2021

181. SensiML Partners with Microchip Technology for Smart Edge IoT Applications

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, General interest, News, opinion and commentary
Abstract

PORTLAND: SensiML Corporation has issued the following press release: SensiML Corporation, a leading developer of AI tools for building intelligent Internet of Things (IoT) endpoints, today announced that it has [...]

Published
2021

182. SensiML Partners with Microchip Technology for Smart Edge IoT Applications

Subjects
Intel Corp. -- Alliances and partnerships, Semiconductor industry -- Alliances and partnerships, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Semiconductor industry, Standard IC, Technology application, Business, News, opinion and commentary
Abstract

- Microchip's powerful MPLAB X IDE now integrated with easy-to-use SensiML Analytics Toolkit - Best-in-class edge AI code efficiency with small memory footprint and ultra-low power consumption - Simplifies building [...]

Published
2021

183. United States : MaxLinears PAM4 DSP Selected by uSenlight to Deliver Sub-3.5W 100G Optical Modules for Hyperscale Data Centers and Wireless Fronthaul Applications

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Business, international
Abstract

MaxLinear, Inc. a leading provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, today announced that uSenlight Corporation, a key ODM developing high-speed, high-performance, reliable integrated optical modules [...]

Published
2021

184. MaxLinear's PAM4 DSP Selected by uSenlight to Deliver Sub-3.5W 100G Optical Modules for Hyperscale Data Centers and Wireless Fronthaul Applications

Subjects
Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, General interest, News, opinion and commentary
Abstract

CARLSBAD, Calif.: MaxLinear, Inc. has issued the following news release: MaxLinear, Inc. (NYSE: MXL), a leading provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, today announced that [...]

Published
2021

185. Efficient Power Conversion (EPC) Announces New Family of Radiation-Hardened Enhancement-Mode Gallium Nitride (eGaN(r)) Transistors and Integrated Circuits for Demanding Space Applications

Subjects
Transistors -- Technology application, Nitrides -- Technology application, Integrated circuits -- Technology application, Gallium nitrate -- Technology application, Circuit components -- Technology application, Semiconductor chips -- Technology application, Standard IC, Semiconductor device, Technology application, General interest, News, opinion and commentary
Abstract

EL SEGUNDO, Calif.: Efficient Power Conversion has issued the following news release: EPC announces the introduction of a new family of radiation-hardened gallium nitride transistors and integrated circuits. With higher [...]

Published
2021

186. United States : MaxLinear Showcases Industrys First 5nm CMOS 800G PAM4 DSP on TSMC Advanced Process at OFC 2021

Subjects
Taiwan Semiconductor Manufacturing Company Ltd. -- Technology application, Semiconductor industry -- Technology application, Integrated circuits -- Technology application, Transceivers -- Technology application, Semiconductor chips -- Technology application, Fiber optics -- Technology application, Digital signal processors -- Technology application, Complementary metal oxide semiconductors -- Technology application, Semiconductor industry, Transceiver, Standard IC, Digital signal processor, Fiber optics, Technology application, Business, international
Abstract

MaxLinear, Inc. a leading provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, announced today that the company will showcase the industrys first 5nm CMOS 800Gbps PAM4 DSP [...]

Published
2021

187. Power Integrations Introduces InnoSwitch4-CZ Flyback Switcher ICs for a New Class of Mobile Charging Devices

Subjects
Power Integrations Inc. -- Technology application, Semiconductor industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Battery chargers -- Technology application, Semiconductor industry, Standard IC, Technology application, Business, Business, international
Abstract

Anker selects zero voltage switching InnoSwitch4-CZ ICs with PowiGaN technology for new ultra-compact 30, 45 & 65 W USB-C Nano II charger series SAN JOSE, Calif. -- Power Integrations (Nasdaq: [...]

Published
2021

188. ADVAMED ENCOURAGES ADMINISTRATION TO CONSIDER PATIENT NEEDS AS IT ADDRESSES SEMICONDUCTOR SHORTAGE

Subjects
ON Semiconductor Corp. -- Technology application, High technology industry -- Technology application, Semiconductor industry -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Semiconductor industry, Product shortage, Standard IC, Technology application, News, opinion and commentary
Abstract

WASHINGTON -- The following information was released by AdvaMed - Advanced Medical Technology Association: AdvaMed, the world's largest trade organization representing medical technology companies, wrote a letter to U.S. Department [...]

Published
2021

189. Smaller Chips Open Door to New RFID Applications

Subjects
Radio frequency identification (RFID) -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Radio frequency identification, Business, Business, international, North Carolina State University -- Technology application
Abstract

M2 PRESSWIRE-May 13, 2021-: Smaller Chips Open Door to New RFID Applications (C)1994-2021 M2 COMMUNICATIONS RDATE:12052021 Researchers at North Carolina State University have made what is believed to be the [...]

Published
2021

190. IBM Announced it has Created a Two-nanometer Chip, The Smallest, Most Powerful Microchip Yet Developed

Subjects
International Business Machines Corp. -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Computer industry -- Technology application, Standard IC, Microcomputer industry, Technology application, Computer industry, Telecommunications industry
Abstract

(GlobeNewswire) - ResearchAndMarkets.compublished a new article on the Nano-chip industry 'IBM Creates Smallest Ever Chip' IBM announced it has created a two-nanometer chip, the smallest, most powerful microchip yet developed. [...]

Published
2021

191. Smaller Chips Open Door to New RFID Applications

Subjects
Radio frequency identification (RFID) -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Radio frequency identification, Business, Business, international, North Carolina State University -- Technology application
Abstract

M2 PRESSWIRE-May 12, 2021-: Smaller Chips Open Door to New RFID Applications (C)1994-2021 M2 COMMUNICATIONS RDATE:12052021 https://news.ncsu.edu Researchers at North Carolina State University have made what is believed to be [...]

Published
2021

192. SMALLER CHIPS OPEN DOOR TO NEW RFID APPLICATIONS

Subjects
Radio frequency identification (RFID) -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Standard IC, Technology application, Radio frequency identification, News, opinion and commentary, North Carolina State University -- Technology application
Abstract

RALEIGH, NC -- The following information was released by North Carolina State University - Raleigh: Researchers at North Carolina State University have made what is believed to be the smallest [...]

Published
2021

193. IBM Announced it has Created a Two-nanometer Chip, The Smallest, Most Powerful Microchip Yet Developed

Subjects
International Business Machines Corp. -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Computer industry -- Technology application, Standard IC, Microcomputer industry, Technology application, Computer industry, Banking, finance and accounting industries, Business
Abstract

Dublin, May 11, May 11, 2021 (GLOBE NEWSWIRE via COMTEX) -- ResearchAndMarkets.compublished a new article on the Nano-chip industry 'IBM Creates Smallest Ever Chip' IBM announced it has created a [...]

Published
2021

194. IBM says it has created the world's smallest and most powerful microchip

Subjects
International Business Machines Corp. -- Technology application, Semiconductor industry -- Technology application, Cellular telephones -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Computer industry -- Technology application, Semiconductor industry, Standard IC, Microcomputer industry, Wireless telephone, Wireless voice/data device, Technology application, Computer industry, Telecommunications industry
Abstract

The semiconductor industry's constant challenge is to make microchips that are smaller, faster, more powerful and more energy efficient simultaneously. On Thursday, IBM announced it has created a 2-nanometer chip, [...]

Published
2021

195. IBM says it has created the world's smallest and most powerful microchip

Subjects
International Business Machines Corp. -- Technology application, Semiconductor industry -- Technology application, Cellular telephones -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Computer industry -- Technology application, Semiconductor industry, Standard IC, Microcomputer industry, Wireless telephone, Wireless voice/data device, Technology application, Computer industry, Business, international, Law
Abstract

The semiconductor industry's constant challenge is to make microchips that are smaller, faster, more powerful and more energy efficient simultaneously. On Thursday, IBM announced it has created a 2-nanometer chip, [...]

Published
2021

196. Implementing an OFDM receiver on the RaPiD reconfigurable architecture

Author

Ebeling, Carl, Fisher, Chris, Guanbin Xing, Manyuan Shen, and Hui Liu

Subjects
Wireless telecommunications equipment, Digital signal processor, Standard IC, Field programmable gate array, Technology application, Wireless telecommunications equipment -- Technology application, Digital signal processors -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Gate arrays -- Evaluation
Published
2004

197. Gel-based microchips: history and prospects

Author

Kolchinsky, A.M., Gryadunov, D.A., Lysov, Yu. P., Mikhailovich, V.M., Nasedkina, T.V., Turygin, A. Yu., Rubina, A. Yu., Barsky, V.E., and Zasedatelev, A.S.

Subjects
Anthrax -- Diagnosis, DNA probes -- Usage, Genomics -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Proteomics -- Technology application, Smallpox -- Diagnosis, Tuberculosis -- Diagnosis, Standard IC, Technology application, Science and technology
Published
2004

198. Efficacy of charge sharing in reshaping the surface electric field in high-voltage lateral RESURF devices

Author

Imam, Mohammed, Quddus, Mohammed, Adams, Jim, and Hossain, Zia

Subjects
Semiconductor chips -- Analysis, Semiconductor chips -- Technology application, Integrated circuits -- Analysis, Integrated circuits -- Technology application, Electric fields -- Analysis, Technology application, Standard IC, Business, Electronics, Electronics and electrical industries
Abstract

The analysis and determination of the breakdown properties of reduced surface field (RESURF) lateral devices are presented by a simple one-dimensional (I-D) analytical solution method. The reshaping and reduction of the electric field and its dependence on the devices/process key parameters are demonstrated both quantitatively and qualitatively by the solution.

Published
2004

199. An introduction to LTE-advanced: the real 4G: the next generation of cellular technology is emerging faster than expected

Author

Frenzel, Louis E.

Subjects
CDMA technology -- Technology application, Integrated circuits -- Technology application, Semiconductor chips -- Technology application, Code Division Multiple Access technology, Standard IC, Technology application, Business, Computers and office automation industries, Electronics and electrical industries
Abstract

Long-Term Evolution (LTE) is being adopted around the world as the primary cell-phone communications service. Multiple 2G and 3G cellular radio methods are being phased out as carriers build their [...]

Published
2013

200. Design and optimization of double-RESURF high-voltage lateral devises for a manufacturable process

Author

Imam, Mohamed, Hossain, Zia, Quddus, Mohammed, Adams, Jim, Hogatt, Charles, Nair, Rajesh, and Ishiguro, Tikeshi

Subjects
Structural optimization -- Analysis, Semiconductor chips -- Design and construction, Semiconductor chips -- Technology application, Integrated circuits -- Design and construction, Integrated circuits -- Technology application, Technology application, Standard IC, Semiconductor device, Business, Electronics, Electronics and electrical industries
Abstract

An easy method for determining the optimal charge balance and processing window of double-reduced surface field (RESURF) lateral devices has been presented. The technique provides insights on optimal device design and controlled process conditions that can be determined and assessed to achieve the desired device and technology performances.

Published
2003

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